IP Library Granted Patent US 11,444,400
Granted Patent B2
US 11,444,400 · App. 17/128,848 · Granted Sep 13, 2022

Information handling system with a printed circuit board having an embedded interconnect

Inventors: Charles W. Ziegler, IV (Framingham, MA); Stephen E. Strickland (Foxborough, MA); Jason Pritchard (Hopkinton, MA)
Assignee: Dell Products L.P.
H01R12/724H01R12/7005H01R12/79H01R13/518
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Quick Facts
Patent No.
US 11,444,400
App. No.
17/128,848
Granted
Sep 13, 2022
Kind
B2
Abstract

An information handling system includes first and second printed circuit boards (PCBs), and first and second connectors. The first PCB includes a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces. The first connector is embedded within the first PCB, and extends from the first bottom surface toward the first top surface. A first height of the first connector is substantially equal to a first thickness of the first PCB. The second PCB includes a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces. The second connector is embedded within the second PCB, and extends from the second bottom surface toward the second top surface. A second height of the second connector is greater than a second thickness of the second printed circuit board.

Claims (34)

1. An information handling system comprising:

a first printed circuit board including a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces;

a first connector embedded within the first printed circuit board, the first connector extending from the first bottom surface toward the first top surface, wherein mounting pads of the first connector are mounted on the first bottom surface;

a second printed circuit board including a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces; and

a second connector embedded within the second printed circuit board, the second connector to extend from the second bottom surface toward the second top surface, wherein mounting pads of the second connector are mounted on the second top surface, wherein a height of the second connector is substantially greater than a thickness of the second printed circuit board.

2. The information handling system of claim 1 , wherein the first printed circuit board and the second printed circuit board are mated by an interface between the first connector and the second connector.

3. The information handling system of claim 1 , wherein a distance between the first printed circuit board and the second printed circuit board when mated is determined by a difference between a length that the second connector extends beyond the second printed circuit board and a thickness of the first connector.

4. The information handling system of claim 1 , the second printed circuit board further includes:

a third plurality of surfaces extending between the second top and second bottom surfaces, wherein the third plurality of surfaces form a hole within the second printed circuit board, the second connector is located within the second printed circuit board.

5. The information handling system of claim 1 , the first printed circuit board further includes:

a second plurality of surfaces extending between the first top and first bottom surfaces, wherein the second plurality of surfaces form a hole within the first printed circuit board, the first connector is located within the hole of the first printed circuit board.

6. An information handling system comprising:

a first printed circuit board including a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces;

a first connector embedded within the first printed circuit board, the first connector extending from the first bottom surface toward the first top surface, wherein mounting pads of the first connector are mounted on the first bottom surface, wherein a first height of the first connector is substantially equal to a first thickness of the first printed circuit board;

a second printed circuit board including a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces; and

a second connector embedded within the second printed circuit board, the second connector extending from the second bottom surface toward the second top surface, wherein mounting pads of the second connector are mounted on the second top surface, wherein a second height of the second connector is substantially greater than a second thickness of the second printed circuit board.

7. The information handling system of claim 6 , wherein the first printed circuit board and the second printed circuit board are mated by an interface between the first connector and the second connector.

8. The information handling system of claim 6 , wherein a distance between the first printed circuit board and the second printed circuit board when mated is determined by a difference between a length that the second connector extends beyond the second printed circuit board and the first thickness of the first connector.

9. The information handling system of claim 6 , the second printed circuit board further includes:

a third plurality of surfaces extending between the second top and second bottom surfaces, wherein the third plurality of surfaces form a hole within the second printed circuit board, the second connector is located within the second printed circuit board.

10. The information handling system of claim 1 , the first printed circuit board further includes:

a third plurality of surfaces extending between the first top and first bottom surfaces, wherein the third plurality of surfaces form a hole within the first printed circuit board, the first connector is located within the hole of the first printed circuit board.

11. An information handling system comprising:

a printed circuit board including a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces;

a first connector embedded within the printed circuit board, the first connector extending from the first bottom surface toward the first top surface, wherein mounting pads of the first connector are mounted on the first bottom surface;

a cable board including a second top surface, a second bottom surface, and a second plurality of side surfaces extending between the second top and second bottom surfaces; and

a second connector embedded within the cable board, the second connector to extend from the second bottom surface toward the second top surface, wherein a height of the second connector is greater than a thickness of the cable board.

12. The information handling system of claim 11 , wherein the printed circuit board and the cable board are mated by an interface between the first connector and the second connector.

13. The information handling system of claim 11 , wherein a distance between the printed circuit board and the cable board when mated is determined by a difference between a length of the second connector and a thickness of the cable board.

14. The information handling system of claim 11 , the cable board further includes:

a third plurality of surfaces extending between the second top and second bottom surfaces, wherein the third plurality of surfaces form a hole within the cable board, the second connector is located within the cable board.

15. The information handling system of claim 11 , wherein mounting pads of the second connector are mounted on the second top surface.

16. The information handling system of claim 15 , wherein termination pads of a plurality of cables are mounted on the second top surface.

17. The information handling system of claim 15 , wherein electrical connection between the mounting pads and the termination pads is on the second top surface.

Assignments (9)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (055479/0342) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0460 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (055479/0051) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0663 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056136/0752) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
Reel/Frame 062021/0771 →
RELEASE OF SECURITY INTEREST AT REEL 055408 FRAME 0697 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0553 →
SECURITY INTEREST Recorded Mar 3, 2021
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056136/0752 →
SECURITY INTEREST Recorded Mar 3, 2021
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 055479/0051 →
SECURITY INTEREST Recorded Mar 3, 2021
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 055479/0342 →
SECURITY AGREEMENT Recorded Feb 25, 2021
From: EMC IP HOLDING COMPANY LLC; DELL PRODUCTS L.P.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 055408/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2020
From: ZIEGLER IV, CHARLES W.; STRICKLAND, STEPHEN E.; PRITCHARD, JASON
To: DELL PRODUCTS, LP
Reel/Frame 054710/0582 →
Continuity (1)
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