POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POROUS POLYIMIDE FILM
A polyimide precursor solution, includes: a polyimide precursor; resin particles having a volume average particle diameter of 5 nm or more and 100 nm or less, and having a volume particle size distribution wherein a ratio of a volume frequency of resin particles having a particle diameter of 150 nm or more to a volume frequency of all of the resin particles in the polyimide precursor solution is 5% or less; and an aqueous solvent containing water.
1 . A polyimide precursor solution, comprising:
a polyimide precursor;
resin particles having a volume average particle diameter of 5 nm or more and 100 nm or less, and having a volume particle size distribution wherein a ratio of a volume frequency of resin particles having a particle diameter of 150 nm or more to a volume frequency of all of the resin particles in the polyimide precursor solution is 5% or less; and
an aqueous solvent containing water.
2 . The polyimide precursor solution according to claim 1 ,
wherein the ratio of the volume frequency of the resin particles having a particle diameter of 150 nm or more to the volume frequency of all of the resin particles in the polyimide precursor solution is 3% or less.
3 . The polyimide precursor solution according to claim 1 , further comprising a water-soluble surfactant,
wherein a content of the water-soluble surfactant is in a range of 3.3 mass % or more and 170 mass % or less with respect to the polyimide precursor.
4 . The polyimide precursor solution according to claim 2 , further comprising a water-soluble surfactant,
wherein a content of the water-soluble surfactant is in a range of 3.3 mass % or more and 170 mass % or less with respect to the polyimide precursor.
5 . A polyimide precursor solution, comprising:
a polyimide precursor;
resin particles having a volume average particle diameter of 5 nm or more and 100 nm or less;
an aqueous solvent containing water; and
a water-soluble surfactant,
wherein a content of the water-soluble surfactant is in a range of 3.3 mass % or more and 170 mass % or less with respect to the polyimide precursor.
6 . The polyimide precursor solution according to claim 3 ,
wherein the content of the water-soluble surfactant is in a range of 7.5 mass % or more and 113 mass % or less with respect to the polyimide precursor.
7 . The polyimide precursor solution according to claim 4 ,
wherein the content of the water-soluble surfactant is in a range of 7.5 mass % or more and 113 mass % or less with respect to the polyimide precursor.
8 . The polyimide precursor solution according to claim 5 ,
wherein the content of the water-soluble surfactant is in a range of 7.5 mass % or more and 113 mass % or less with respect to the polyimide precursor.
9 . The polyimide precursor solution according to claim 1 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
10 . The polyimide precursor solution according to claim 2 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
11 . The polyimide precursor solution according to claim 3 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
12 . The polyimide precursor solution according to claim 4 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
13 . The polyimide precursor solution according to claim 5 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
14 . The polyimide precursor solution according to claim 6 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
15 . The polyimide precursor solution according to claim 7 ,
wherein a volume particle size distribution index of the resin particles is 1.40 or less.
16 . The polyimide precursor solution according to claim 1 ,
wherein a content of the water is 70 mass % or more with respect to the aqueous solvent.
17 . The polyimide precursor solution according to claim 1 ,
wherein the resin particles contain a vinyl resin.
18 . The polyimide precursor solution according to claim 17 ,
wherein the vinyl resin includes at least one selected from the group consisting of a polystyrene resin, an acrylic resin, a methacrylic resin, an acrylic acid ester resin, a methacrylic acid ester resin, a styrene-acrylic resin, and a styrene-methacrylic resin.
19 . The polyimide precursor solution according to claim 1 ,
wherein a content of the resin particles with respect to 100 parts by mass of the polyimide precursor is 65 parts by mass or more and 600 parts by mass or less.
20 . A method for producing a porous polyimide film comprising:
coating the polyimide precursor solution according to claim 1 onto a substrate to form a coating film, and drying the coating film to form a film containing the polyimide precursor and the resin particles; and
heating the film to imidize the polyimide precursor to form a polyimide film, and removing the resin particles.