Power conversion device
Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.
1. A power conversion device comprising:
a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path, the outer side having a plate-like shape; and
a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power, wherein
a first thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected, wherein the first thickness and the wall thickness are measured in a direction substantially perpendicular to the plate-like shape of the outer side of the cooling surface.
2. The power conversion device according to claim 1 , wherein
the smoothing capacitor includes a substrate and a plurality of capacitor cells mounted on the substrate,
the substrate is fixed to the cooler, and
the plurality of capacitor cells are thermally connected to the cooling surface with the heat transfer member therebetween.
3. The power conversion device according to claim 2 , wherein the power conversion device further comprises a noise-removing capacitor mounted on the substrate.
4. The power conversion device according to claim 2 , wherein
the substrate is disposed so as to be apart from the cooling surface,
the plurality of capacitor cells are disposed between the substrate and the cooling surface,
the cooler includes a protruding portion protruding from the cooling surface, and
the substrate is fixed to the protruding portion.
5. The power conversion device according to claim 2 , wherein
the substrate is disposed parallel to the cooling surface so as to be apart therefrom,
each capacitor cell has a shape of a column,
the plurality of capacitor cells are arranged along the cooling surface and the substrate,
one bottom surface of each capacitor cell having the shape of the column faces a surface, of the substrate, that is located on the cooling surface side,
a terminal provided to the one bottom surface is electrically connected to the substrate,
another bottom surface of the capacitor cell faces the cooling surface, and
the heat transfer member is interposed between the other bottom surface and the cooling surface.
6. The power conversion device according to claim 5 , wherein
the smoothing capacitor includes, in addition to the substrate and the capacitor cell, a plate-shaped power-feeding busbar electrically connected to the plurality of capacitor cells via the substrate,
the power-feeding busbar includes a linear portion extending linearly along the cooling surface, and
the plurality of capacitor cells are arranged along the linear portion.
7. The power conversion device according to claim 6 , wherein the power-feeding busbar includes: a positive-side busbar; a negative-side busbar; and an insulation member provided between the positive-side busbar and the negative-side busbar.
8. The power conversion device according to claim 7 , wherein an insulation paper sheet as the insulation member is interposed between the positive-side busbar and the negative-side busbar which are disposed parallel to each other.
9. The power conversion device according to claim 7 , wherein the positive-side busbar, the negative-side busbar, and the insulation member are integrated with each other by a resin member.
10. The power conversion device according to claim 9 , wherein the positive-side busbar, the negative-side busbar, and the insulation member are molded integrally with each other by the resin member.
11. The power conversion device according to claim 10 , wherein
the power-feeding busbar is disposed on an end side of the substrate,
the resin member includes a fixation portion extending to a center side of the substrate from a portion, of the resin member, at which integral molding has been made, and
the fixation portion is, together with the substrate, fixed to the cooler.
12. The power conversion device according to claim 11 , wherein the fixation portion includes a projection fitted into a through-hole provided in the substrate.
13. The power conversion device according to claim 9 , wherein the power conversion device further comprises a magnetic core enclosing a periphery of the positive-side busbar and the negative-side busbar and positioned by the resin member.
14. The power conversion device according to claim 1 , wherein
the power conversion device further comprises a power module including a semiconductor switching element, and
the power module is fixed to the cooler and thermally connected to the cooling surface.
15. A power conversion device comprising:
a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and
a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power, wherein
a thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected, wherein
the power conversion device further comprises a power module including a semiconductor switching element,
the smoothing capacitor includes
a substrate,
a plurality of capacitor cells mounted on the substrate, and
a plate-shaped power-feeding busbar electrically connected to the plurality of capacitor cells via the substrate, and
the power-feeding busbar is electrically connected to the power module, the power-feeding busbar being thermally connected to the cooling surface with a busbar heat transfer member therebetween.
16. The power conversion device according to claim 15 , wherein a thickness of the busbar heat transfer member between the power-feeding busbar and a portion, of the cooling surface, to which the power-feeding busbar is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the power-feeding busbar is thermally connected.
17. A power conversion device comprising:
a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and
a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power, wherein
a thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected, wherein
the power conversion device further comprises a plurality of power modules each including a semiconductor switching element,
the plurality of power modules are fixed to the cooler and thermally connected to the cooling surface,
the smoothing capacitor includes
a substrate,
a plurality of capacitor cells mounted on the substrate, and
a plate-shaped power-feeding busbar electrically connected to the plurality of capacitor cells via the substrate,
the power-feeding busbar includes a linear portion extending linearly along the cooling surface,
the plurality of capacitor cells are arranged along the linear portion so as to be in a region, of the cooling surface, that is located on one side of the linear portion, and
the plurality of power modules are arranged along the linear portion so as to be in a region, of the cooling surface, that is located on another side of the linear portion, and are connected to portions of the linear portion.