IP Library Granted Patent US 11,444,109
Granted Patent B2
US 11,444,109 · App. 17/131,346 · Granted Sep 13, 2022

Global shutter pixel circuit and method for computer vision applications

Inventors: Erez Tadmor (Atlit, IL); David Cohen (Nesher, IL); Giora Yahav (Haifa, IL)
Assignee: Magic Leap, Inc.
H01L27/14605G01S11/00G01S17/894H01L27/1463H01L27/14609H01L27/14643H04N5/232H04N5/2353H04N5/341H04N5/3745H04N5/37452H04N5/37457H01L27/14641
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Quick Facts
Patent No.
US 11,444,109
App. No.
17/131,346
Granted
Sep 13, 2022
Kind
B2
Abstract

An image sensor device includes a plurality of pixel cells arranged in a pixel array, a control circuit for controlling an exposure phase and a sampling phase of the image sensor device. Each of the plurality of pixel cells includes a photodiode, a storage diode, and a floating diffusion region. The control circuit is configured to activate the photodiode in a plurality of time windows to sense light reflected from a target as a result of a corresponding plurality of emitted light pulses, with a pre-determined delay time between each time window and a corresponding emitted light pulse. The photodiode can be activated using a plurality of bias voltage pulses or a plurality of global shutter signal pulses.

Claims (28)

1. An image sensor device, comprising:

a plurality of pixel cells arranged in a pixel array;

a control circuit for controlling an exposure phase and a sampling phase of the image sensor device; and

a switching circuit for coupling a pixel power supply line to a first voltage in an exposure phase and to a second voltage in a sampling phase, the first voltage being higher than the second voltage;

wherein each of the plurality of pixel cells comprises:

a photodiode in a semiconductor substrate, a first end of the photodiode coupled to a bias voltage through a shutter gate controlled by a global shutter signal;

a ground contact for coupling a second end of the photodiode to an electrical ground through an electrical ground conductive line;

a storage diode in the semiconductor substrate and coupled to a second end of the photodiode through a first transfer gate controlled by a first transfer signal; and

a floating diffusion region in the semiconductor substrate and coupled to the storage diode through a second transfer gate controlled by a second transfer signal.

2. The image sensor device of claim 1 , wherein the control circuit is configured to activate the photodiode in a plurality of time windows to sense light reflected from a target as a result of a corresponding plurality of emitted light pulses, with a pre-determined delay time between each time window and a corresponding emitted light pulse.

3. The image sensor device of claim 2 , further comprising a drain region, wherein:

a first end of the photodiode is coupled to a bias voltage through the drain region; and

the control circuit is configured to provide a plurality of bias voltage pulses to activate the photodiode in the plurality of time windows to sense reflected light.

4. The image sensor device of claim 2 , wherein the control circuit is configured to provide a plurality of global shutter signal pulses to activate the photodiode in the plurality of time windows to sense reflected light.

5. A pixel cell for time-of-flight (ToF) distance measurement, comprising:

a substrate;

a photodiode;

a ground contact for coupling a second end of the photodiode to an electrical ground through an electrical ground conductive line;

a drain region adjacent to the photodiode and coupled to a bias voltage;

a shutter gate disposed between the photodiode and the drain region, the shutter gate controlled by a global shutter signal to apply the bias voltage to bias the photodiode for light sensing;

a storage diode coupled to the photodiode through a first transfer gate controlled by a first transfer signal; and

a floating diffusion region coupled to the storage diode through a second transfer gate controlled by a second transfer signal.

6. The pixel cell of claim 5 , wherein:

the photodiode is formed in a rectangular diffusion area having four side lines;

the shutter gate is disposed along a first side line between the photodiode and the drain region, the shutter gate having a same length as the first side line; and

the first transfer gate is disposed along a second side line adjacent the first side line, the first transfer gate having a length that is half the length of the second side line and disposed over a corner of the photodiode away from the first side line.

7. The pixel cell of claim 5 , further comprising first, second, and third metal interconnect layers, wherein: a first transfer line, a second transfer line, a select line, and a reset line are formed in the first metal interconnect layer along a first direction, and span a total width of W; a voltage supply VDDA line, a voltage supply VSSA line, and a pixel output line are formed in the second metal interconnect layer along a second direction perpendicular to the first direction; and a global shutter line is formed in the third metal interconnect layer along the first 8 direction, the global shutter line having a width substantially equal to W.

8. The pixel cell of claim 5 , wherein the drain region comprises a low capacitance drain diffusion region to facilitate modulating of the bias voltage.

Assignments (3)
SECURITY INTEREST Recorded Feb 7, 2023
From: MAGIC LEAP, INC.; MENTOR ACQUISITION ONE, LLC; MOLECULAR IMPRINTS, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 062681/0065 →
SECURITY INTEREST Recorded May 24, 2022
From: MOLECULAR IMPRINTS, INC.; MENTOR ACQUISITION ONE, LLC; MAGIC LEAP, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060338/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2021
From: COHEN, DAVID; TADMOR, EREZ; YAHAV, GIORA
To: MAGIC LEAP, INC.
Reel/Frame 055429/0423 →
Continuity (3)
Division 16219829 · Dec 13, 2018
Provisional Application 62598390 · Dec 13, 2017
Related Publication 20210183923A1 · Jun 17, 2021