Granted Patent B2

US 12,204,149 · App. 17/133,235 · Granted Jan 21, 2025

Inventors: Jacobus Nicolaas Tuin (Best, NL); Rutger Wilhelmus Smink (Hamont-Achel, BE); Mark Benton (Hoffman Estates, IL); Sander Johannes Floris (Lennisheuvel, NL)

Assignee: TE Connectivity Solutions GmbH

G02B6/3644G02B6/4286

Abstract

Claims (21)

1. An optical subassembly comprising:

an interposer comprising a substrate having first and second opposing sides and defining at least one alignment aperture extending from said first opposing side to said second opposing side, said interposer having electrical traces and contacts on said second opposing side;

at least one fiber having a first optical axis disposed in said at least one alignment aperture;

at least one optical component mounted to a first portion of said contacts on said second opposing side and having an emitting surface having a second optical axis coincident with said first optical axis and defining an interface between said at least one optical component and said at least one fiber;

a feedback component mounted to a second portion of said contacts on said second opposing side within line-of-sight of said interface and having a receiving surface to receive at least a portion of uncoupled light emitted from said interface; and

wherein each of said optical component and said feedback component is mounted on said second opposing side such that said emitting and receiving surfaces of said optical and feedback components, respectively, face said second opposing surface, and said emitting surface and said second opposing surface define a first gap and said receiving surface and said second opposing surface define a second gap.

2. The optical subassembly of claim 1 , wherein said feedback component is adjacent to said optical component.

3. The optical subassembly of claim 1 , wherein said at least a portion comprises light reflected from said substrate.

4. The optical subassembly of claim 1 , wherein said fiber comprises an end face, and said interface comprises a third gap between said optical component and said end face.

5. The optical subassembly of claim 4 , wherein said at least a portion comprises light reflected from said end face.

6. The optical subassembly of claim 1 , wherein said optical and feedback components are elevated above said second opposing side by electrical contacts to create said first and second gaps, respectively.

7. The optical subassembly of claim 6 , wherein said electrical contacts comprise bumps.

8. The optical subassembly of claim 1 , wherein said feedback component provides active feedback on an output of said optical component.

9. The optical subassembly of claim 1 , further comprising said at least one chip for operating said at least one optical component, said at least one chip being mounted on said first or second opposing side.

10. The optical subassembly of claim 9 , further comprising at least one second chip for cooperating with said feedback component to provide said active feedback.

11. The optical subassembly of claim 9 , wherein said interposer has electrical traces comprising first, second, third, and fourth contacts, said first contacts being configured for electrical connection to at least one optical component, said second contacts being configured for electrical connection to at least one chip, said third contacts being configured for electrical connection to a circuit board, and said fourth contacts being configured for election connection to said feedback component.

12. The optical subassembly of claim 11 , further comprising said circuit board configured to receive said interposer such that said interposer is essentially orthogonal to said circuit board, said circuit board being electrically connected to at least a portion of said third contacts.

13. The optical subassembly of claim 1 , wherein said at least one optical component is a VCSEL or an LED, and said feedback component is a photodiode.

14. The optical subassembly of claim 1 , wherein said first optical axis is oriented essentially orthogonal to said first and second opposing sides.

15. The optical subassembly of claim 1 , further comprising an electrical chip disposed on said second opposing side and configured to power said at least one optical component, and wherein said interposer comprises electrical traces for interconnecting said optical component and said chip.

16. The optical subassembly of claim 1 , wherein said interposer comprises a card edge connector for connection to a printed circuit board (PCB).

Assignments (3)

Continuity (2)

References Cited (21)