Transversely-excited film bulk acoustic resonator matrix filters

1. A radio frequency filter, comprising:

a substrate;

a piezoelectric plate having front and back surfaces, the back surface attached to the substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms, wherein the conductor pattern connects the plurality of resonators in a matrix filter circuit comprising a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators, wherein the piezoelectric plate and the plurality of IDTs are configured such that respective radio frequency signals applied to the IDTs excite respective shear primary acoustic modes in the respective diaphragms.

2. The filter of claim 1 , further comprising:

a first port and a second port, wherein

the two or more resonators of the first sub-filter are connected in series between the first port and the second port, and

the two or more resonators of the second sub-filter are connected in series between the first port and the second port.

3. The filter of claim 2 , further comprising:

a first low-edge resonator, from the plurality of resonators, connected between the first port and ground; and

a second low-edge resonator, from the plurality of resonators, connected between the second port and ground,

wherein respective resonance frequencies of the first and second low-edge resonators are adjacent to a lower edge of a passband of the filter.

4. The filter of claim 3 , further comprising:

a first high-edge resonator, from the plurality of resonators, connected between the first port and ground; and

a second high-edge resonator, from the plurality of resonators, connected between the second port and ground,

wherein respective resonance frequencies of the first and second high-edge resonators are adjacent to a higher edge of the passband of the filter.

5. A radio frequency filter, comprising:

a substrate;

a piezoelectric plate having front and back surfaces, the back surface attached to the substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms, wherein

the conductor pattern connects the plurality of resonators in a matrix filter circuit comprising a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators, wherein a first thickness of a first dielectric layer formed over the IDTs of the two or more resonators of the first sub-filter is different from a second thickness of a second dielectric layer formed over the IDTs of the two or more resonators of the second sub-filter.

6. The filter of claim 5 , wherein

the matrix filter circuit comprises a third sub-filter comprising two or more resonators from the plurality of resonators, and

a third thickness of a third dielectric layer formed over the IDTs of the two or more resonators of the third sub-filter is different from the first thickness and the second thickness.

7. A radio frequency filter, comprising:

a substrate;

a piezoelectric plate having front and back surfaces, the back surface attached to the substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate; and

a conductor pattern formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a respective plurality of resonators, interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms, wherein

the conductor pattern connects the plurality of resonators in a matrix filter circuit comprising a first sub-filter and a second sub-filter, each sub-filter comprising two or more resonators from the plurality of resonators, wherein each of the first and second sub-filters comprises:

m resonators connected in series, where m is an integer greater than one; and

m-1 capacitors, each capacitor connected from a junction between two of the m resonators and a common terminal.

8. The filter of claim 7 , wherein each of the m-1 capacitors of each sub-filter are metal-insulator-metal capacitors.

9. The filter of claim 7 , wherein an inductor is connected from the common terminal to ground.

10. A radio frequency filter, comprising:

a first port and a second port;

n sub-filters, each sub-filter including m resonators connected in series between the first port and the second port, where n and m are integers greater than one; and

a first low-edge resonator connected from the first port to ground and a second low-edge resonator connected from the second port to ground,

wherein each of the first and second low-edge resonators and the m resonators within the n sub-filters comprises:

a piezoelectric plate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in a substrate, and

an interdigital transducer (IDT) formed on a surface of the piezoelectric plate with interleaved IDT fingers disposed on the diaphragm,

the piezoelectric plate and the IDT configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode in the diaphragm.

11. The filter of claim 10 , wherein

a single substrate and a single piezoelectric plate are common to all of the first and second low-edge resonators and the m resonators within the n sub-filters.

12. The filter of claim 10 , wherein

the n sub-filters are numbered in order of increasing passband frequency,

dielectric layers are formed over the IDT fingers of each resonator, where tdi is a thickness of the dielectric layer formed over the IDT fingers of the m resonators of sub-filter i, and

td 1 >td 2 >. . . . >tdn.

13. The filter of claim 12 , further comprising:

a passivation layer having a thickness tpass formed over the conductor pattern and the piezoelectric plate,

wherein tdn≥tpass.

14. The filter of claim 12 , wherein

the piezoelectric plate has a thickness tp, and

0.35tp≥td 1 .

15. The filter of claim 10 , each of the n sub-filters further comprising:

m-1 capacitors, each capacitor connected from a junction between two of the m resonators and a common terminal.

16. The filter of claim 15 , wherein each of the m-1 capacitors of each of the n sub-filters are metal-insulator-metal capacitors.

17. The filter of claim 15 , wherein an inductor is connected from the common terminal to ground.