Hybrid sheet layout, method, system, and structure
A method of generating an IC layout diagram includes abutting a first row of cells with a second row of cells along a border, the first row including first and second active sheets, the second row including third and fourth active sheets, the active sheets extending along a row direction and having width values. The active sheets are overlapped with first through fourth back-side via regions, the first active sheet width value is greater than the third active sheet width value, a first back-side via region width values is greater than a third back-side via region width value, and a value of a distance from the first active sheet to the border is less than a minimum spacing rule for metal-like defined regions. At least one of abutting the first row with the second row or overlapping the active sheets with the back-side via regions is performed by a processor.
1. A method of generating an integrated circuit (IC) layout diagram, the method comprising:
abutting a first row of cells with a second row of cells along a border, the first row of cells comprising first and second active sheets extending along a row direction, the second row of cells comprising third and fourth active sheets extending along the row direction; and
overlapping each of the first through fourth active sheets with a corresponding first through fourth back-side via region,
wherein
each of the first through fourth active sheets and first through fourth back-side via regions has a width in a width direction perpendicular to the row direction, the width having a width value,
the width value of the first active sheet is greater than that of the third active sheet,
the width value of the first back-side via region is greater than that of the third back-side via region,
a distance from the first active sheet to the border has a value less than a minimum spacing rule for metal-like defined regions of a manufacturing process corresponding to the IC layout diagram, and
at least one of the abutting the first row of cells with the second row of cells or the overlapping the first through fourth active sheets with the first through fourth back-side via regions is performed by a processor.
2. The method of claim 1 , wherein
the abutting the first row of cells with the second rows of cells comprises aligning the border and a first metal region along a first metal track, and
the first metal region abuts or overlaps the first active sheet.
3. The method of claim 1 , wherein each of the width values of the first through fourth active sheets is uniform with respect to locations along the row direction.
4. The method of claim 3 , wherein at least one of
the width value of the first active sheet is different from that of the second active sheet, or
the width value of the third active sheet is different from that of the fourth active sheet.
5. The method of claim 3 , further comprising abutting a third row of cells with the second row of cells, the third row of cells comprising fifth and sixth active sheets, wherein
a width value of the fifth active sheet is the same as that of the third active sheet, and
a width value of the sixth active sheet is the same as that of the fourth active sheet.
6. The method of claim 1 , wherein at least one of
the width value of the first active sheet is one width value of multiple width values of the width of the first active sheet, or
the width value of the third active sheet is one width value of multiple width values of the width of the third active sheet.
7. The method of claim 1 , wherein
the width value of the first active sheet is one width value of multiple width values of the width of the first active sheet, and
a width value of the second active sheet is one width value of multiple width values of the width of the second active sheet.
8. The method of claim 7 , wherein at each location along the row direction, each width value of the multiple width values of the first active sheet is the same as each width value of the multiple width values of the second active sheet.
9. The method of claim 1 , wherein
a multi-row cell is included in each of the first row of cells and the second row of cells, and
the abutting the first row of cells with the second row of cells comprises merging the first active sheet with the third active sheet.
10. A method of generating an integrated circuit (IC) layout diagram, the method comprising:
abutting a first row of cells with a second row of cells along a border, the first row of cells comprising first and second active sheets extending along a row direction, the second row of cells comprising third and fourth active sheets extending along the row direction;
aligning the border along a first metal track of a plurality of metal tracks having a metal track pitch; and
overlapping each of the first through fourth active sheets with a corresponding first through fourth back-side via region,
wherein
each of the first through fourth active sheets and first through fourth back-side via regions has a width in a width direction perpendicular to the row direction, the width having a width value,
the width value of the first active sheet is greater than that of the third active sheet,
the width value of the first back-side via region is greater than that of the third back-side via region,
a distance from the first active sheet to the border has a value less than a minimum spacing rule for metal-like defined regions of a manufacturing process corresponding to the IC layout diagram,
each of the first and second rows of cells has a height in the width direction equal to five times the metal track pitch, and
at least one of the abutting the first row of cells with the second row of cells or the overlapping the first through fourth active sheets with the first through fourth back-side via regions is performed by a processor.
11. The method of claim 10 , wherein
the aligning the border along the first metal track of the plurality of metal tracks comprises aligning a first metal region along the first metal track of the plurality of metal tracks, and
the first metal region abuts or overlaps the first active sheet.
12. The method of claim 11 , wherein
the first metal region is a first metal region of a plurality of metal regions,
the aligning the first metal region along the first metal track of the plurality of metal tracks comprises aligning the plurality of metal regions along the plurality of metal tracks, and
each of the first metal region and second and third metal regions of the plurality of metal regions overlaps the first active sheet.
13. The method of claim 12 , wherein
each of fourth through sixth metal regions of the plurality of metal regions overlaps the second active sheet.
14. The method of claim 13 , wherein
seventh and eighth metal regions of the plurality of metal regions are a first subset of two metal regions of the plurality of metal regions that overlap the third active sheet, and
ninth and tenth metal regions of the plurality of metal regions are a second subset of two metal regions of the plurality of metal regions that overlap the fourth active sheet.
15. The method of claim 10 , wherein
a sum of the width values of the first and second active sheets is greater than three times the metal track pitch.
16. A method of generating an integrated circuit (IC) layout diagram, the method comprising:
abutting a first row of cells with a second row of cells along a border, the first row of cells comprising first and second active sheets extending along a row direction, the second row of cells comprising third and fourth active sheets extending along the row direction; and
overlapping each of the first through fourth active sheets with a corresponding first through fourth back-side via region,
wherein
each of the first through fourth active sheets and first through fourth back-side via regions has a width in a width direction perpendicular to the row direction, the width having a width value,
a single width value of each of the first and second active sheets is greater than a single width value of the third and fourth active sheets,
a single width value of each of the first and second back-side via regions is greater than a single width value of each of the third and fourth back-side via regions,
a distance from the first active sheet to the border has a value less than a minimum spacing rule for metal-like defined regions of a manufacturing process corresponding to the IC layout diagram, and
at least one of the abutting the first row of cells with the second row of cells or the overlapping the first through fourth active sheets with the first through fourth back-side via regions is performed by a processor.
17. The method of claim 16 , wherein
the first row of cells further comprises:
a first metal-like defined region overlapping each of the first active sheet and the first back-side via region; and
a second metal-like defined region overlapping each of the second active sheet and the second back-side via region,
the second row of cells further comprises:
a third metal-like defined region overlapping each of the third active sheet and the third back-side via region; and
a fourth metal-like defined region overlapping each of the fourth active sheet and the fourth back-side via region, and
the first thorough fourth metal-like defined regions are aligned in the width direction.
18. The method of claim 17 , wherein
a distance from the first metal-like defined region to the border has a value less than the minimum spacing rule.
19. The method of claim 16 , wherein
the first and third active sheets correspond to nano-sheets having p-type doping and located in a same n-well.
20. The method of claim 16 , wherein
the abutting the first row of cells with the second row of cells along the border comprises the first row of cells corresponding to a timing-critical circuit application.