Thermal and acoustical management in information handling systems based on mechanical connections
A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.
1. A method, comprising:
receiving, by a hardware processor, an output value representing a mechanical clamping pressure between a heat sink and a system board assembly installed within an information handling system;
identifying a fan electrical power by querying an electronic database for the output value representing the mechanical clamping pressure between the heat sink and the system board assembly, the electronic database electronically associating output values to electrical powers including the fan electrical power that is electronically associated to the output value representing the mechanical clamping pressure between the heat sink and the system board assembly; and
cooling the heat sink and the system board assembly by operating a cooling fan at the fan electrical power.
2. The method of claim 1 , further comprising identifying a processor power state based on the output value representing the mechanical clamping pressure.
3. The method of claim 1 , further comprising reducing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
4. The method of claim 1 , further comprising increasing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
5. The method of claim 1 , further comprising reducing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.
6. The method of claim 1 , further comprising increasing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.
7. The method of claim 1 , further comprising generating an error in response to the output value representing the mechanical clamping pressure between the heat sink and the system board assembly.
8. A system comprising:
a processor; and
a memory device storing instructions that when executed by the processor perform operations, the operations including:
receiving an output value representing a mechanical clamping pressure between a heat sink and a system board assembly;
identifying a fan electrical power by querying an electronic database for the output value representing the mechanical clamping pressure, the electronic database electronically associating output values to electrical powers including the fan electrical power that is electronically associated to the output value representing the mechanical clamping pressure; and
cooling the heat sink and the system board assembly by operating a cooling fan at the fan electrical power.
9. The system of claim 8 , wherein the operations further include identifying a processor power state based on the output value representing the mechanical clamping pressure.
10. The system of claim 8 , wherein the operations further include reducing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
11. The system of claim 8 , wherein the operations further include increasing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
12. The system of claim 8 , wherein the operations further include reducing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.
13. The system of claim 8 , wherein the operations further include increasing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.
14. The system of claim 8 , wherein the operations further include generating an error in response to the output value representing the mechanical clamping pressure between the heat sink and the system board assembly.
15. A non-transitory memory device storing instructions that when executed perform operations, the operations comprising:
receiving an output value representing a mechanical clamping pressure between a heat sink and a system board assembly;
identifying a fan electrical power by querying an electronic database for the output value, the electronic database electronically associating output values to electrical powers including the fan electrical power that is electronically associated to the output value; and
cooling the heat sink and the system board assembly by operating a cooling fan at the fan electrical power.
16. The non-transitory memory device of claim 15 , wherein the operations further include identifying a processor power state based on the output value representing the mechanical clamping pressure.
17. The non-transitory memory device of claim 15 , wherein the operations further include reducing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
18. The non-transitory memory device of claim 15 , wherein the operations further include increasing a speed associated with the cooling fan in response to the output value representing the mechanical clamping pressure.
19. The non-transitory memory device of claim 18 , wherein the operations further include reducing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.
20. The non-transitory memory device of claim 15 , wherein the operations further include increasing a performance associated with the system board assembly in response to the output value representing the mechanical clamping pressure.