Thermal and acoustical management in information handling systems
A quality of a mechanical connection within an information handling system may be inferred based on pressure. An electronic pressure sensor is disposed between two components operating within the information handling system. The electronic pressure sensor generates an output signal in response to a clamping pressure and/or clamping force between the two components. Performance of a processor operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. A speed of a cooling fan operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force. Any internal components operating within the information handling system may be controlled in response to the clamping pressure and/or clamping force.
1. A method, comprising:
determining, by a hardware processor, a mechanical clamping pressure between two internal components installed within an information handling system;
identifying a performance level in response to the mechanical clamping pressure determined between the two internal components installed within the information handling system;
identifying a fan speed associated with a cooling fan based on the mechanical clamping pressure; and
operating the hardware processor at the performance level identified in response to the mechanical clamping pressure.
2. The method of claim 1 , further comprising identifying an electrical power based on the mechanical clamping pressure.
3. The method of claim 1 , further comprising reducing a fan speed associated with a cooling fan in response to the mechanical clamping pressure.
4. The method of claim 1 , further comprising increasing a speed associated with a cooling fan in response to the mechanical clamping pressure.
5. The method of claim 1 , further comprising reducing a performance associated with the hardware processor in response to the mechanical clamping pressure.
6. The method of claim 1 , further comprising increasing a performance associated with the hardware processor in response to the mechanical clamping pressure.
7. The method of claim 1 , further comprising generating an error in response to the mechanical clamping pressure.
8. An information handling system, comprising:
a processor; and
a memory device storing instructions that when executed by the processor perform operations, the operations including:
determining a mechanical clamping pressure between two components installed within the information handling system;
identifying a performance level for the processor based on the mechanical clamping pressure between the two components, wherein identification of the performance level includes mapping the mechanical clamping pressure to the performance level in one of a plurality of entries in a database;
operating the processor at the performance level based on the mechanical clamping pressure between the two components; and
increasing a speed associated with a cooling fan in response to the mechanical clamping pressure.
9. The system of claim 8 , wherein the operations further include identifying a processor power state based on the mechanical clamping pressure.
10. The system of claim 8 , wherein the operations further include reducing a speed associated with a cooling fan in response to the mechanical clamping pressure.
11. The system of claim 8 , wherein the operations further include reducing a performance associated with the processor in response to the mechanical clamping pressure.
12. The system of claim 8 , wherein the operations further include increasing a performance associated with the processor in response to the mechanical clamping pressure.
13. The system of claim 8 , wherein the operations further include generating an error in response to the mechanical clamping pressure.
14. A memory device storing instructions that when executed perform operations, the operations comprising:
determining a mechanical clamping pressure between two components installed within an information handling system;
identifying a performance level for the hardware processor based on the mechanical clamping pressure between the two components;
operating the hardware processor at the performance level based on the mechanical clamping pressure between the two components; and
reducing a speed associated with a cooling fan in response to mechanical clamping pressure.
15. The memory device of claim 14 , wherein the operations further include identifying a processor power state based on the mechanical clamping pressure.
16. The memory device of claim 14 , wherein the operations further include increasing a speed associated with a cooling fan in response to the mechanical clamping pressure.
17. The memory device of claim 14 , wherein the operations further include reducing a performance associated with the processor in response to the mechanical clamping pressure.