Light-emitting device
A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.
1. A light-emitting device, comprising:
a first light-emitting module, comprising a first substrate comprising a first cavity and a first sidewall;
a second light-emitting module, comprising a second substrate comprising a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall;
a light-emitting component, disposed on the first substrate;
a conductive layer connecting the first cavity and the second cavity and electrically connected to the first light-emitting module and the second light-emitting module; and
an insulation layer connected to the first sidewall and the second sidewall.
2. The light-emitting device according to claim 1 , wherein the first substrate comprises a top surface and a bottom surface corresponding to the top surface, and the conductive layer is exhibited on the top surface or under the bottom surface.
3. The light-emitting device according to claim 2 , further comprising a first circuit disposed on the top surface and adjacent to the first cavity.
4. The light-emitting device according to claim 3 , wherein the first circuit is located at a position staggered with the first cavity.
5. The light-emitting device according to claim 2 , further comprising a first circuit disposed on the top surface and a second circuit disposed under the bottom surface, and the first circuit is electrically connected to the second circuit.
6. The light-emitting device according to claim 1 , further comprising a first circuit disposed on the first substrate and a second circuit disposed on the second substrate, and wherein the first circuit is electrically connected to the second circuit.
7. The light-emitting device according to claim 1 , wherein the first cavity further comprises an inner surface and the inner surface is a non-smooth surface.
8. The light-emitting device according to claim 1 , further comprising a protective layer covering and directly contacting with the light-emitting component, the first substrate, the second substrate, and the conductive layer.
9. The light-emitting device according to claim 1 , wherein more than 80% of light emitted by the light-emitting component can pass through the insulation layer.
10. The light-emitting device according to claim 1 , the first substrate comprising a top surface and a bottom surface, and wherein the light-emitting component is disposed on the top surface and a driving chip is disposed under the bottom surface so that the light-emitting component is controlled by the driving chip.
11. A light-emitting device, comprising:
a first light-emitting module, comprising a first substrate, and the first substrate comprising a cavity and a first sidewall, wherein the cavity comprises an inner surface, and the inner surface is a non-smooth surface;
a second light-emitting module, comprising a second substrate, and the second substrate comprising a second sidewall corresponding to the cavity and the first sidewall;
a light-emitting component disposed on the first substrate; and
a conductive layer, directly connected to the cavity and sidewalls, and electrically connected to the first light-emitting module and the second light-emitting module.
12. The light-emitting device according to claim 11 , wherein the first substrate comprises a top surface and a bottom surface corresponding to the top surface, and the conductive layer is exposed on the top surface or under the bottom surface.
13. The light-emitting device according to claim 12 , further comprising a first circuit disposed on the top surface and adjacent to the cavity.
14. The light-emitting device according to claim 13 , wherein the first circuit is located at a position staggered with the cavity.
15. The light-emitting device according to claim 12 , further comprising a first circuit disposed on the top surface and a second circuit disposed under the bottom surface, and the first circuit is electrically connected to the second circuit.
16. The light-emitting device according to claim 11 , further comprising a first circuit disposed on the first substrate and a second circuit disposed on the second substrate, and wherein the first circuit is electrically connected to the second circuit.
17. The light-emitting device according to claim 11 , further comprising a protective layer covering and directly contacting with the light-emitting component, the first substrate, the second substrate, and the conductive layer.
18. The light-emitting device according to claim 11 , further comprising an insulation layer connected to the first sidewall and the second sidewall, and wherein more than 80% of light emitted by the light-emitting component can pass through the insulation layer.
19. The light-emitting device according to claim 11 , the first substrate comprising a top surface and a bottom surface, and wherein the light-emitting component is disposed on the top surface and a driving chip is disposed under the bottom surface so that the light-emitting component is controlled by the driving chip.