Image module package having glass filter secured by transparent adhesive
There is provided an image module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.
1. An image module package, comprising:
a circuit board having an upper surface;
a photo sensor chip attached to the upper surface of the circuit board;
a light emitting die attached to the upper surface of the circuit board;
a first transparent layer covering the photo sensor chip and a part of the upper surface of the circuit board, wherein a top surface of the first transparent layer has a receptacle opposite to the photo sensor chip;
a second transparent layer covering the light emitting die and another part of the upper surface of the circuit board;
an opaque layer covering the first transparent layer and having a through hole opposite to the receptacle; and
a glass filter accommodated in the receptacle, and secured by transparent adhesive in the receptacle of the first transparent layer.
2. The image module package as claimed in claim 1 , wherein the first transparent layer and the second transparent layer are separated from each other.
3. The image module package as claimed in claim 1 , wherein a top surface of the second transparent layer has a light guiding structure opposite to the light emitting die.
4. The image module package as claimed in claim 3 , wherein the opaque layer covers the first transparent layer and the second transparent layer, and the opaque layer has another through hole opposite to the light guiding structure.
5. The image module package as claimed in claim 4 , wherein the opaque layer is a cover or a molded light blocking layer.
6. The image module package as claimed in claim 4 , wherein the light guiding structure is a convex dome and accommodated in said another through hole.
7. The image module package as claimed in claim 3 , wherein the light guiding structure is integrally formed with the second transparent layer.
8. The image module package as claimed in claim 1 , wherein the receptacle has a circular shape or a rectangular shape.
9. The image module package as claimed in claim 1 , wherein the glass filter fully fits in the receptacle.
10. The image module package as claimed in claim 1 , wherein a transmitting spectrum of the glass filter is between 920 nm and 960 nm.
11. An image module package, comprising:
a circuit board having an upper surface;
an opaque cover, attached to the upper surface of the circuit board, and having a first inner space, a first through hole above the first inner space, a second inner space and a second through hole above the second inner space;
a photo sensor chip attached to the upper surface of the circuit board in the first inner space and opposite to the first through hole;
a light emitting die attached to the upper surface of the circuit board in the second inner space and opposite to the second through hole;
a transparent layer covering the photo sensor chip, the light emitting die and a part of the upper surface of the circuit board, wherein a top surface of the transparent layer has a receptacle opposite to the photo sensor chip; and
a glass filter accommodated in the receptacle, and secured by transparent adhesive in the receptacle of the transparent layer.
12. The image module package as claimed in claim 11 , wherein the transparent layer is separated into two parts by a wall protruding from the opaque cover.
13. The image module package as claimed in claim 11 , wherein the top surface of the transparent layer further has a light guiding structure accommodated in the second through hole.
14. The image module package as claimed in claim 13 , wherein the light guiding structure is integrally formed with the transparent layer.
15. The image module package as claimed in claim 11 , wherein the receptacle has a circular shape or a rectangular shape.
16. The image module package as claimed in claim 11 , wherein the photo sensor chip comprises a pixel array arranged under the glass filter.
17. The image module package as claimed in claim 11 , wherein a transmitting spectrum of the glass filter is between 920 nm and 960 nm.
18. The image module package as claimed in claim 11 , wherein the glass filter fully fits in the receptacle.