IP Library Granted Patent US 11,737,216
Granted Patent B2
US 11,737,216 · App. 17/155,455 · Granted Aug 22, 2023

Metal drop ejecting three-dimensional (3D) object printer

Inventors: Denis Cormier (Pittsford, NY); Santokh S. Badesha (Pittsford, NY); Varun Sambhy (Pittsford, NY)
Assignee: Xerox Corporation
H05K3/125H05K3/4046H05K3/4053H05K13/0092H05K2203/128
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Quick Facts
Patent No.
US 11,737,216
App. No.
17/155,455
Granted
Aug 22, 2023
Kind
B2
Abstract

A three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The apparatus identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The apparatus identifies the via holes in the substrate and positions an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.

Claims (24)

1. A metal drop ejecting apparatus comprising:

a melter configured to receive and melt a bulk metal;

an ejector operatively connected to the melter to receive melted bulk metal from the melter;

a platform configured to support a substrate having a plurality of via holes in the substrate, the platform being positioned opposite the ejector;

at least one actuator operatively connected to at least one of the platform and the ejector, the at least one actuator being configured to move at least one of the platform and the ejector relative to one another;

a user interface configured to receive a digital data model of a substrate and user input data; and

a controller operatively connected to the melter, the ejector, the user interface, and the at least one actuator, the controller being configured to:

identify the bulk metal to be received by the melter using the digital data model;

identify locations of the via holes in the substrate using the digital data model;

generate machine ready instructions for moving and operating the ejector to fill the via holes at the identified locations; and

execute the machine ready instructions to operate the ejector, the at least one actuator, and the melter to melt the bulk metal in the melter, position the ejector opposite the identified locations for the via holes in the substrate and eject drops of the melted bulk metal toward the via holes at the identified locations.

2. The apparatus of claim 1 , the controller being further configured to:

operate the melter to maintain a temperature of the melted bulk metal in the melter within a range of 50° C. up to 200° C. above a melting point of the bulk metal identified by the digital data model.

3. The apparatus of claim 1 , the controller being further configured to operate the melter to maintain the temperature of the melted bulk metal in the melter in a range of 700° C. up to 900° C. when the digital data model identifies the bulk metal as being aluminum.

4. The apparatus of claim 1 , the controller being further configured to operate the melter to maintain the temperature of the melted bulk metal in the melter in a range of 1100° C. up to 1300° C. when the digital data model identifies the bulk metal as being copper.

5. The apparatus of claim 1 , the controller being further configured to:

identify a predetermined ejection frequency corresponding to the bulk metal identified by the digital data model; and

operate the ejector to eject the drops of melted bulk metal toward the via holes at the identified predetermined ejection frequency.

6. The apparatus of claim 1 , the controller being further configured to:

identify a smallest diameter for the via holes at the identified locations; and

identify a nozzle diameter for the ejector corresponding to the identified smallest diameter.

7. The apparatus of claim 6 , the controller being further configured to identify the nozzle diameter as being equal to or larger than the identified smallest diameter for the via holes.

8. The apparatus of claim 7 , the controller being further configured to:

generate the machine ready instructions to position the ejector opposite the via holes to eject the drops of melted bulk metal toward the via holes so only a portion that is less than an entirety of the drops engages a wall of the via holes or enters an opening of the via holes.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2023
From: XEROX CORPORATION
To: ELEM ADDITIVE, LLC
Reel/Frame 065734/0413 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2023
From: ELEM ADDITIVE, LLC
To: ADDITIVE TECHNOLOGIES LLC
Reel/Frame 065743/0267 →
RELEASE OF SECURITY INTEREST IN PATENTS AT R/F 062740/0214 Recorded May 18, 2023
From: CITIBANK, N.A., AS AGENT
To: XEROX CORPORATION
Reel/Frame 063694/0122 →
SECURITY INTEREST Recorded Nov 10, 2022
From: XEROX CORPORATION
To: CITIBANK, N.A., AS AGENT
Reel/Frame 062740/0214 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2021
From: CORMIER, DENIS; BADESHA, SANTOKH S.; SAMBHY, VARUN
To: XEROX CORPORATION
Reel/Frame 054997/0126 →
Continuity (1)
Related Publication 20220240387A1 · Jul 28, 2022