IP Library Granted Patent US 12,077,706
Granted Patent B2
US 12,077,706 · App. 17/161,128 · Granted Sep 3, 2024

Hybrid silicone composite for high temperature applications

Inventors: Dejie Tao (Fremont, CA); Yiliang Wu (San Ramon, CA); Lananh Pham (Fremont, CA); Lei Wang (San Jose, CA); Ting Gao (Palo Alto, CA); Andre Martin Dressel (Lampertheim, DE); Frank Schabert (Nuremberg, DE)
Assignees: TE CONNECTIVITY SERVICES GMBH; TE CONNECTIVITY GERMANY GMBH
C09K21/14C08G77/04C08K3/22C08K3/26C09K21/02H01M50/128H01M50/129H01M50/143C08K2003/2206C08K2003/2224C08K2003/2227C08K2003/262C08K2003/267
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,077,706
App. No.
17/161,128
Granted
Sep 3, 2024
Kind
B2
Abstract

A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.

Claims (11)

1. A silicone composite comprising: a silicone mixture and a thermally decomposable inorganic filler which can be decomposed at a temperature of 500° C. and below, wherein said inorganic filler is from about 10 weight % to about 90 weight % of said silicone composite, wherein said silicone composite when exposed to a high temperature forms at least a portion of an inorganic composite and maintains its dimensional stability wherein said silicone composite has a viscosity from about 10000 to about 1000000 Pa·S at a shear rate of 1.0 rads/s at 25 degrees C., and a density of about 1.3 to about 1.8 g/cm 3 and wherein said silicone mixture comprises a liquid high consistency silicone rubber and a solid high consistency silicone rubber, said solid high consistency rubber is a solid at 25-250° C., has a Mooney viscosity of about 10 to about 200 and with a hardness from Shore A 10 to Shore A 90.

2. The silicone composite according to claim 1 , wherein the silicone composite is capable of forming at least a portion of an inorganic composite at a temperature of no more than 500° C. and maintaining its dimensional stability.

3. The silicone composite according to claim 1 , wherein said inorganic filler is chosen from the group comprising: magnesium hydroxide, magnesium carbonate, calcium hydroxide, sodium bicarbonate, potassium bicarbonate, aluminum hydroxide and mixtures thereof.

4. The silicone composite according to claim 1 , wherein the silicone composite further includes fumed silica, antioxidants, fluxes or catalysts.

5. The silicone composite according to claim 1 , wherein said silicone composite is moldable or calenderable.

6. The silicone composite according to claim 1 , wherein said liquid high consistency silicone rubber comprises from about 5 weight % to about 90 weight % of the total weight of the silicone mixture.

7. The silicone composite according to claim 1 , wherein the silicone composite has a density of about 1.3 to about 1.6 g/cm 3 .

8. A silicone composite film comprising a silicone mixture and a thermally decomposable inorganic filler which can be decomposed at a temperature of 500° C. and below, wherein said silicone composite film when exposed to a high temperature forms at least a portion of an inorganic composite and maintains its dimensional stability, wherein said silicone composite film has a tensile stress from about 2.5 to about 10 MPa after curing, a tensile strain from about 10% to about 100%, and density from about 1.3 to 1.8 g/cm 3 and wherein said silicone mixture comprises a liquid high consistency silicone rubber and a solid high consistency silicone rubber, wherein said solid high consistency silicone is a solid at 25-250° C., has a Mooney viscosity of about 10 to about 200 and with a hardness from Shore A 10 to Shore A 90.

9. The silicone composite film according to claim 8 , wherein the silicone composite film has a thickness of less than 1 mm.

10. The silicone composite film according to claim 8 , wherein said silicone composite film can bent at a 2.0 mm radius without cracks when examined visually.

11. The silicone composite film according to claim 8 , wherein said silicone composite film further includes a support chosen from the group consisting of metal foils, metal meshes and glass fibers embedded in said silicone composite film.

Assignments (3)
MERGER Recorded Jun 7, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060305/0923 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2021
From: TAO, DEJIE; WU, YILIANG; PHAM, LANANH; WANG, LEI; GAO, TING
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 055242/0991 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2021
From: DRESSEL, ANDRE MARTIN; SCHABERT, FRANK
To: TE CONNECTIVITY GERMANY GMBH
Reel/Frame 055243/0122 →