Memory device and method of operating the same

1. A memory device comprising:

a system block for storing test information;

a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines; and

a column repair controller configured to detect, based on the test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line among the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

2. The memory device of claim 1 , wherein the column repair controller comprises:

a wafer test information storage configured to temporarily store wafer test information among information included in the test information;

a packaging test information storage configured to temporarily store packaging test information among the information included in the test information; and

a concurrent repair detector configured to generate concurrent repair information, which is a result of comparing the wafer test information and the packaging test information.

3. The memory device of claim 2 , further comprising:

a status register configured to store the concurrent repair information.

4. The memory device of claim 2 , wherein the wafer test information storage stores a column address of a column line repaired in a wafer test of the memory device among the plurality of low bank column lines and the plurality of high bank column lines.

5. The memory device of claim 2 , wherein the packaging test information storage stores a column address of a column line repaired in a packaging test of the memory device among the plurality of low bank column lines and the plurality of high bank column lines.

6. The memory device of claim 2 , wherein the concurrent repair detector is configured to perform an exclusive OR operation on the wafer test information and the packaging test information.

7. A method of operating a memory device including a system block for storing test information and a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines, the method comprising:

storing packaging test information, which is included in test data stored in the system block, in a first register;

storing wafer test information, which is included in the test data stored in the system block, in a second register; and

detecting, based on the wafer test information and the packaging test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line among the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

8. The method of claim 7 , wherein detecting a concurrent repair column line comprises:

determining whether a repair column line exists based on the packaging test information stored in the first register;

performing an exclusive OR operation with the packaging test information based on the wafer test information stored in the second register;

storing result information of the exclusive OR operation in a status register; and

determining the memory device as a defective chip according to the result information of the exclusive OR operation stored in the status register.

9. The method of claim 7 , further comprising:

determining whether an exclusive OR operation on address information respectively corresponding to a plurality of repair columns included in the wafer test information is performed with address information corresponding to a repair column included in the packaging test information; and

storing wafer test information corresponding to address information on which the exclusive OR operation is not performed with the address information corresponding to the repair column included in the packaging test information among the address information respectively corresponding to the plurality of repair columns included in the wafer test information, in the second register.

10. The method of claim 7 , wherein detecting further comprises:

determining whether an exclusive OR operation is performed on all packaging test information included in the system block; and

storing packaging test information on which the exclusive OR operation is not performed among the packaging test information included in the system block, in the first register.

11. The method of claim 7 , wherein storing the packaging test information, which is included in the test data stored in the system block, in the first register comprises storing column address information of a column line repaired in a packaging test of the memory device among the plurality of low bank column lines and the plurality of high bank column lines.

12. The method of claim 7 , wherein storing the wafer test information, which is included in the test data stored in the system block, in the second register comprises storing column address information of a column line repaired in a wafer test of the memory device among the plurality of low bank column lines and the plurality of high bank column lines.

13. The method of claim 7 , further comprising:

generating concurrent repair information based on detecting the concurrent repair column line; and

storing the concurrent repair information in a status register.

14. The method of claim 13 , further comprising:

determining the memory device as a defective chip based on the concurrent repair information stored in the status register.