Fingerprint sensing module and method for manufacturing the fingerprint sensing module

1. A fingerprint sensing module comprising:

a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads for connecting said fingerprint sensor device to external circuitry;

a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces for electrically connecting said fingerprint sensor module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device; and

wherein said fingerprint sensor device further comprises wire-bonds electrically connecting said connection pads of said fingerprint sensing device to said conductive traces of said cover structure.

2. The fingerprint sensing module according to claim 1 , wherein the fingerprint sensor device further comprises:

via connections arranged adjacent to said array of fingerprint sensing elements, the via connections connecting the first side of the device to the second side of the device;

conductive traces connecting said connection pads of said fingerprint sensor device to a first side of said via connections, wherein the connection pads are arranged on the first side of the fingerprint sensor device; and

wire-bonds arranged between a second side of said via connections, opposite of said first side of said via connections, and said conductive traces of said cover structure.

3. The fingerprint sensing module according to claim 1 , wherein the fingerprint sensor device further comprises:

via connections arranged adjacent to said array of fingerprint sensing elements, the via connections connecting the first side of the device to the second side of the device; and

wire-bonds arranged between the via connections on the second side of the device and said conductive traces of said cover structure.

4. The fingerprint sensing module according to claim 1 , further comprising an electrically conductive bezel arranged adjacent to said sensing array to provide an electrical connection between a finger placed on said sensing surface and drive signal circuitry of said fingerprint sensing module.

5. The fingerprint sensing module according to claim 1 , wherein said cover structure extends outside of said fingerprint sensor device such that said fingerprint sensing module has a T-shaped profile.

6. The fingerprint sensing module according to claim 1 , wherein said cover structure is flexible.

7. A smart card comprising a fingerprint sensing module according to claim 1 , said smart card comprising a recess into which said fingerprint sensing module is arranged;

wherein said cover structure of said fingerprint sensing module comprises connection pads for connecting said conductive traces to corresponding connection pads of a conductive inlay of said smart card.

8. The smart card according to claim 7 , wherein said recess has a shape corresponding to a shape of said fingerprint sensing module.

9. The smart card according to claim 7 , wherein said recess is T-shaped and configured to receive a correspondingly T-shaped fingerprint sensing module.

10. A fingerprint sensing module comprising:

a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads arranged on a second side of said fingerprint sensor device for connecting said fingerprint sensor device to external circuitry; and

a smart card substrate comprising an opening in which the fingerprint sensor device is arranged, said smart card substrate having a first side facing in the same direction as the sensing array and a second side opposite the first side, wherein said smart card substrate comprises conductive traces arranged on the second side of the smart card substrate, for electrically connecting said fingerprint sensing module to external circuitry;

wherein said fingerprint sensor device further comprises wire-bonds electrically connecting said connection pads of said fingerprint sensing device to said conductive traces of said smart card substrate.

11. The fingerprint sensing module according to claim 10 , wherein the fingerprint sensor device further comprises:

a via connection arranged adjacent to said array of fingerprint sensing elements, the via connection connecting the first side of the device to the connection pads on the second side of the device.

12. A smart card comprising a fingerprint sensing module according to claim 11 .

13. A fingerprint sensing module comprising:

a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements, wherein said fingerprint sensor device comprises connection pads arranged on said first side of said fingerprint sensing device for connecting said fingerprint sensor device to external circuitry;

a fingerprint sensor device cover structure arranged to cover said fingerprint sensor device, said cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of said sensing module, and a second side facing said sensing array, wherein said cover structure comprises conductive traces arranged on the second side of the cover structure, for electrically connecting said fingerprint sensing module to external circuitry, and wherein a surface area of said cover structure is larger than a surface area of said sensor device;

a carrier having a first side facing in the same direction as the sensing array, the carrier being arranged adjacent to said fingerprint sensor device; and

conductive traces connecting said connection pads of said fingerprint sensor device to said first side of said carrier, and

wire-bonds arranged between a second side of said carrier, opposite of said first side of said carrier, and said conductive traces of said smart card cover structure.

14. The fingerprint sensing module according to claim 13 , wherein the carrier comprises a via connection connecting the conductive traces of the first side of the carrier to the wire bonds of the second side of the carrier.

15. The fingerprint sensing module according to claim 13 , wherein the cover structure is a layer of a smart card.

16. The fingerprint sensing module according to claim 13 , wherein the cover structure is an outer layer of a smart card.