IP Library Granted Patent US 11,363,387
Granted Patent B2
US 11,363,387 · App. 17/165,998 · Granted Jun 14, 2022

Transducer system with configurable acoustic overload point

Inventors: Robert Littrell (Boston, MA); Ronald Gagnon (Boston, MA)
Assignee: Vesper Technologies, Inc.
H04R19/04H04R1/04H04R3/00H04R17/02H04R19/005H04R2201/003
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Quick Facts
Patent No.
US 11,363,387
App. No.
17/165,998
Granted
Jun 14, 2022
Kind
B2
Abstract

A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

Claims (9)

1. A MEMS microphone comprising:

a plurality of sense members configured to flex in response to an acoustic signal incident on the sense members, the plurality of the sense members being electrically coupled with a first pad and a second pad;

a plurality of nodes between the sense members; and

at least one pick-off pad, each pick-off pad coupled with no more than one of the nodes between the sense members and associated with one of the sense members, each pick-off pad being configured to cooperate with the second pad to produce an output signal representative of an attenuated version of the acoustic signal incident on the plurality of sense members.

2. The MEMS microphone of claim 1 further comprising an integrated circuit configured to switch between receiving signals from the first output pad and the at least one pick-off pad.

3. The MEMS microphone claim 1 wherein the at least one pick-off pad comprises a plurality of pick-off pads.

4. The MEMS microphone of claim 1 wherein the sense members comprise piezoelectric sense members.

5. The MEMS microphone of claim 1 wherein the plurality of sense members are connected in series.

6. The MEMS microphone of claim 1 wherein the MEMS microphone comprises a piezoelectric MEMS microphone.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2025
From: QUALCOMM TECHNOLOGIES, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 069818/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2022
From: VESPER TECHNOLOGIES INC.
To: QUALCOMM TECHNOLOGIES, INC.
Reel/Frame 061424/0533 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2022
From: LITTRELL, ROBERT; GAGNON, RONALD
To: VESPER TECHNOLOGIES INC.
Reel/Frame 060601/0664 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2022
From: LITTRELL, ROBERT; GAGNON, RONALD
To: VESPER TECHNOLOGIES, INC.
Reel/Frame 059903/0807 →
Continuity (3)
Division 16353589 · Mar 14, 2019
Provisional Application 62643865 · Mar 16, 2018
Related Publication 20210160623A1 · May 27, 2021