IP Library Granted Patent US 12,442,755
Granted Patent B2
US 12,442,755 · App. 17/168,132 · Granted Oct 14, 2025

Sensor purge techniques and related systems and methods

Inventor: Justin Keenan (Lexington, MA)
Assignee: Formlabs, Inc.
G01N21/15F01N13/08G01J5/0875G01J5/051
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Quick Facts
Patent No.
US 12,442,755
App. No.
17/168,132
Granted
Oct 14, 2025
Kind
B2
Abstract

Techniques for preventing contamination of an electronic component via gas flow are described. According to some aspects, an electronic component module is configured to provide gas flow past and away from an electronic component such that thermal and material exchange is limited between the electronic component module and a coupled system. In some embodiments, the coupled system may be a portion of an additive fabrication device. As a result, a reduced number of contaminants may adhere to the electronic component, extending its lifespan and reducing maintenance.

Claims (38)

1. An electronic component module, comprising:

at least one gas intake channel;

a primary channel coupled to the at least one gas intake channel via at least one first opening in the primary channel, the primary channel having a first end, a second end opposing the first end, and a first side and a second side each extending from the first end to the second end, and the primary channel comprising an orifice at the first end of the primary channel, the orifice configured to provide a second opening from the primary channel into a system coupled to the electronic component module;

an electronic component arranged at least partially within the primary channel at the second end of the primary channel such that the electronic component is arranged between the at least one gas intake channel and the orifice; and

a first gas exhaust channel coupled to the first side of the primary channel via a third opening in the primary channel, the first gas exhaust channel being arranged between the electronic component and the orifice, wherein an angle formed between the first side of the primary channel and sides of the first gas exhaust channel is greater than 90° and less than 180°, such that the first gas exhaust channel is oriented away from the electronic component.

2. The electronic component module of claim 1 , wherein the first gas exhaust channel is coupled to the first side of the primary channel at a location proximate the orifice.

3. The electronic component module of claim 1 , wherein the at least one gas intake channel is coupled to the first side of the primary channel.

4. The electronic component module of claim 1 , wherein the at least one gas intake channel comprises a first gas intake channel and a second gas intake channel, the first gas intake channel coupled to the first side of the primary channel and the second gas intake channel coupled to a second side of the primary channel, the second side different than the first side.

5. The electronic component module of claim 1 , wherein the at least one gas intake channel is coupled to the second end of the primary channel.

6. The electronic component module of claim 1 , wherein the at least one gas intake channel comprises at least two gas intake channels.

7. The electronic component module of claim 1 , further comprising a second gas exhaust channel coupled to the second side of the primary channel via a fourth opening in the primary channel.

8. The electronic component module of claim 1 , wherein the at least one gas intake channel is coupled to at least one fan.

9. The electronic component module of claim 1 , wherein the at least one gas intake channel is coupled to at least one air compressor.

10. The electronic component module of claim 1 , wherein the first gas exhaust channel is coupled to at least one fan.

11. The electronic component module of claim 1 , wherein the first gas exhaust channel is coupled to at least one vacuum pump.

12. The electronic component module of claim 1 , wherein the electronic component is an optical sensor.

13. The electronic component module of claim 12 , wherein the optical sensor is at least one of a pyrometer or an infrared sensor.

14. The electronic component module of claim 12 , wherein the optical sensor comprises an optical window.

15. The electronic component module of claim 14 , wherein the optical window is a germanium optical window.

16. The electronic component module of claim 14 , wherein the optical window is arranged within the primary channel.

17. The electronic component module of claim 1 , wherein the electronic component has an optical field of view through the orifice in a range from 10° to 25°.

18. The electronic component module of claim 1 , wherein the electronic component has an optical field of view through the orifice in a range from 15° to 20°.

19. The electronic component module of claim 1 , wherein the first gas exhaust channel is a straight gas exhaust channel.

20. The electronic component module of claim 1 , wherein the first side of the primary channel and one of the sides of the first gas exhaust channel meet at a point, thereby forming the angle between the first side of the primary channel and the sides of the first gas exhaust channel.

21. The electronic component module of claim 1 ,

wherein the first side of the primary channel and the sides of the first gas exhaust channel include a respective straight portion that are oriented with respect to one another at the angle, and

wherein the first side of the primary channel and/or the sides of the first gas exhaust channel include a curved portion in between the straight portion of the first side of the primary channel and the straight portion of the sides of the first gas exhaust channel.

22. The electronic component module of claim 1 , wherein the first gas exhaust channel is coupled to the first side of the primary channel at a location disposed at a distance more than 1 cm from the orifice.

23. The electronic component module of claim 1 , wherein the at least one gas intake channel is coupled to the primary channel at an obtuse angle such that the at least one gas intake channel is oriented away from the first end of the primary channel.

24. The electronic component module of claim 1 , further comprising a second gas exhaust channel coupled to the second side of the primary channel, and wherein:

the at least one gas intake channel comprises two gas intake channels coupled to the second end of the primary channel.

25. The electronic component module of claim 1 , further comprising a second gas exhaust channel coupled to the second side of the primary channel, and wherein:

the at least one gas intake channel comprises two gas intake channels, each gas intake channel of the two gas intake channels being coupled to a different side of the primary channel.

26. The electronic component module of claim 1 , further comprising a second gas exhaust channel coupled to the second side of the primary channel, and wherein:

the at least one gas intake channel comprises a first gas intake channel coupled to the first side of the primary channel, and a second gas intake channel coupled to the second side of the primary channel; and

the electronic component comprises an optical window, the optical window being disposed within the primary channel.

27. The electronic component module of claim 1 , wherein a distance along the first side of the primary channel between the orifice and the third opening is less than 1 cm.

28. The electronic component module of claim 1 , wherein the first gas exhaust channel is arranged such that the Coanda effect channels gas entering the primary channel through the at least one gas intake channel out through the first gas exhaust channel, and prevents gas entering the primary channel through the orifice.

Assignments (2)
AMENDED AND RESTATED INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Aug 5, 2022
From: FORMLABS INC.; FORMLABS OHIO INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 061087/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2021
From: KEENAN, JUSTIN
To: FORMLABS, INC.
Reel/Frame 058122/0845 →
Continuity (2)
Provisional Application 62970352 · Feb 5, 2020
Related Publication 20210239535A1 · Aug 5, 2021
References Cited (13)
US 20030142403A1 · Kalley · 2003 [cited by examiner]
US 20100238446A1 · Akiyama · 2010 [cited by examiner]
US 20110180694A1 · Leuthold · 2011 [cited by examiner]
US 20130052291A1 · Morikawa · 2013 [cited by applicant]
US 20170297109A1 · Gibson et al. · 2017 [cited by applicant]
US 20180126460A1 · Murphree et al. · 2018 [cited by applicant]
US 20180186067A1 · Bulller et al. · 2018 [cited by applicant]
US 20180257977A1 · Nagashima · 2018 [cited by examiner]
US 20190358905A1 · Werner · 2019 [cited by examiner]
EP 3441213A1 · 2019 [cited by applicant]
EP 3572213A1 · 2019 [cited by applicant]
International Preliminary Report on Patentability mailed Aug. 18, 2022 in connection with International Application No. PCT/US2021/016572. [cited by applicant]
International Search Report and Written Opinion mailed May 31, 2021 in connection with International Application No. PCT/US2021/016572. [cited by applicant]