Optical module

1. An integrated optical communication device comprising:

a silicon substrate;

a transmit lane module configured to generate electrical signals from a RX interface and process the electrical signals by a forward error correction device (FEC) and PAM encoder, and dual PAM drivers;

dual DFB laser devices for producing two-wavelength laser signals characterized by a relative intensity noise (RIN) level of less than −140 dB/Hz;

dual optical modulators built in the silicon substrate and configured to be driven by the dual PAM drivers to convert the two-wavelength laser signals to two modulated optical signals;

a MUX device coupled to the silicon substrate and configured to multiplex the two modulated optical signals and to output a multiplexed optical output signal;

a DEMUX device coupled to the silicon substrate and configured to receive a multiplexed optical input signal and demultiplex to two de-multiplexed signals;

dual photodetectors built in the silicon substrate to respectively convert the two de-multiplexed signals to current signals;

a receive lane module comprising dual transimpedance amplifier (TIA) to amplify the current signals, dual PAM-based analog-to-digital converter (ADC) to convert the current signals to digital signals, dual digital signal processors (DSP) to process the digital signals, a forward error correction device (FEC) and a decoder to generate electrical signals based on the digital signals outputting through a TX interface.

2. The integrated optical communication device of claim 1 wherein the DEMUX device comprises one or more silicon-based delay-line interferometers (DLIs), each DLI being configured to interleave an incoming optical signal from one fiber into two waveguides each with a de-multiplexed signal in different wavelength.

3. The integrated optical communication device of claim 1 wherein the dual photodetectors are configured to respectively convert the two de-multiplexed signals with different wavelengths.

4. The integrated optical communication device of claim 1 wherein the two de-multiplexed signals with different wavelengths comprise a predetermined channel spacing selected from 50 GHz or 100 GHz.

5. The integrated optical communication device of claim 1 wherein the receive lane module further comprises a Tx clock and data recovery device (Tx-CDR) configured to remove jitter within the digital signals before transmitting the electrical signals to Ethernet.

6. The integrated optical communication device of claim 5 wherein the ADC and the DSP comprise PAM-N enabled encoding format, selecting from PAM4, PAM8, or PAM16, or NRZ encoding format.

7. The integrated optical communication device of claim 1 wherein the RX interface or the TX interface comprises an Ethernet electrical interface in 4×25G CAUI-4 format.

8. The integrated optical communication device of claim 7 wherein the Ethernet electrical interface is configured with 4×10G/bits Quad Small Form-factor Pluggable (QSFP) compact, hot-pluggable format.

9. The integrated optical communication device of claim 7 wherein the dual PAM drivers using PAM-N or NRZ enabled encoding format to control the dual DFB laser devices and the dual optical modulators to generate the two modulated optical signals.

10. The integrated optical communication device of claim 9 wherein the dual PAM drivers are implemented with an encoder in 28.125 GBaud PAM4 format for 100 Gbit/s data rate optical transmission over one of CWDM channels or DWDM channels with 100 GHz spacing.

11. The integrated optical communication device of claim 9 wherein the dual optical modulators comprise silicon-based Mach Zehnder linear segmented modulator.

12. The integrated optical communication device of claim 11 wherein the silicon-based Mach Zehnder modulator operates in a carrier depletion mode.

13. The integrated optical communication device of claim 1 wherein the dual optical modulators comprise a distributed configuration driven by the dual PAM drivers comprising a parallel array of a plurality of amplifiers, each of which is optimized with a PAM encoder to drive a single segment of each optical modulator.

14. The integrated optical communication device of claim 1 wherein the MUX device comprises one or more DLIs, each DLI being a 2-to-1 power combiner.

15. The integrated optical communication device of claim 1 further comprises a control module comprising power supplies, a microcontroller, and ASIC chips.

16. The integrated optical communication device of claim 1 further comprising an optical amplifier and a dispersion compensation module for retaining data integrity of the multiplexed optical output signal.

17. The integrated optical communication device of claim 1 wherein the transmit lane module further comprises a RX correct data recovery (Rx-CDR) device coupled between the RX interface and the forward error correction device (FEC) to handle the electrical signals.

18. The integrated optical communication device of claim 1 wherein the receive lane module further comprises TX correct data recovery (Tx-CDR) device coupled to the forward error correction device (FEC) and the decoder to remove jitter within the digital signals.

19. The integrated optical communication device of claim 1 wherein the dual DFB laser devices are mounted on the silicon substrate as a silicon-photonics die packaged on an interposer.

20. The integrated optical communication device of claim 19 wherein the transmit lane module and the receive lane module are separately packaged on the interposer as the silicon-photonics die.