Microphone and electronic device having the same
The present disclosure relates to microphones and electronic devices having the same. A microphone may include a housing for receiving vibration signals; a converting component inside the housing for converting the vibration signals into electrical signals, and a processing circuit for processing the electrical signals. The converting component may include a transducer and at least one damping film attached to the transducer.
1. A microphone comprising:
a housing for receiving vibration signals;
a converting component inside the housing for converting the vibration signals into electrical signals, wherein the converting component includes:
a transducer; and
at least one damping film attached to the transducer, the at least one damping film including at least two damping films, and the at least two damping films being arranged symmetrically with respect to a center line of the transducer;
at least two elastic elements, wherein the at least one damping film is connected to the transducer and the at least two elastic elements respectively, to transmit vibrations of the at least two elastic elements to the transducer, a resonance frequency of each of the at least two elastic elements is different from each other and is within a predetermined voice frequency range; and
a processing circuit for processing the electrical signals.
2. The microphone of claim 1 , wherein the at least one damping film covers at least part of at least one surface of the transducer.
3. The microphone of claim 2 , wherein the at least one surface of the transducer includes at least one of an upper surface, a lower surface of the transducer, a lateral surface, or an internal surface of the transducer.
4. The microphone of claim 1 , wherein the at least one damping film is disposed on at least one position including an upper surface of the transducer, a lower surface of the transducer, a lateral surface of the transducer, or an interior of the transducer.
5. The microphone of claim 1 , wherein the at least one damping film is disposed on at least one surface of the transducer at a predetermined angle.
6. The microphone of claim 1 , wherein the at least one damping film is not connected to the housing.
7. The microphone of claim 1 , wherein the at least one damping film is connected to the housing.
8. The microphone of claim 1 , wherein the at least two elastic elements and the transducer are arranged in a predetermined distribution mode.
9. The microphone of claim 8 , wherein the predetermined distribution mode includes at least one of a horizontal distribution mode, a vertical distribution mode, an array distribution mode, or a random distribution mode.
10. The microphone of claim 1 , wherein the at least one damping film covers at least part of at least one surface of each of the at least two elastic elements.
11. The microphone of claim 1 , wherein a width of the at least one damping film is variable.
12. The microphone of claim 1 , wherein a thickness of the at least one damping film is variable.
13. The microphone of claim 1 , wherein the transducer includes at least one of a diaphragm, a piezo ceramic plate, a piezo film, or an electrostatic film.
14. The microphone of claim 1 , wherein a structure of the transducer includes at least one of a film, a cantilever, or a plate.
15. The microphone of claim 1 , wherein the vibration signals are caused by at least one of: gas, liquid, or solid.
16. The microphone of claim 1 , wherein the vibration signals are transmitted from the housing to the converting component according to a non-contact mode or a contact mode.
17. The microphone of claim 1 , wherein the transducer and the at least one damping film are designed according to a frequency response curve of the microphone.
18. An electronic device comprising a microphone, wherein the microphone includes:
a housing for receiving vibration signals;
a converting component inside the housing for converting the vibration signals into electrical signals, wherein the converting component includes:
a transducer; and
at least one damping film attached to the transducer, the at least one damping film including at least two damping films, and the at least two damping films being arranged symmetrically with respect to a center line of the transducer;
at least two elastic elements, wherein the at least one damping film is connected to the transducer and the at least two elastic elements respectively, to transmit vibrations of the at least two elastic elements to the transducers, a resonance frequency of each of the at least two elastic elements is different from each other and is within a predetermined voice frequency range; and
a processing circuit for processing the electrical signals.