Liquid compression molding or encapsulant compositions
Thermosetting resin compositions useful for liquid compression molding encapsulation of a reconfigured wafer are provided. The so-encapsulated molded wafer offers improved resistance to warpage, compared to reconfigured wafers encapsulated with known encapsulation materials.
1. A thermosetting resin composition, comprising a thermosetting resin matrix, a silica filler and a cure component comprising the combination of a clathrate comprising a tetrakis phenol compound and a nitrogen-containing curative,
wherein the composition has a viscosity increase after 24 hour room temperature storage of less than about 30% relative to an initial viscosity of the composition before storage, and
wherein, when cured on a wafer, the wafer including the cured composition exhibits a warpage of less than about 3 cm after oven cure.
2. The composition according to claim 1 , wherein, when cured, the cured composition has the following set of physical properties:
(a) storage modulus in the range of about 25 gigapascals (GPas) or less at room temperature,
(b) a coefficient of thermal expansion (CTE) α1 of less than or equal to 15 ppm,
(c) a CTE α2 of less than or equal to 30 ppm and
(d) multiple glass transition temperatures (Tgs) as measured by thermal mechanical analysis (TMA) of greater than about 135° C.
3. The composition according to claim 1 , wherein when cured the cured composition exhibits multiple Tgs as measured by TMA of greater than about 160° C. and, wherein when cured on a wafer, the wafer including the cured composition exhibits a warpage of less than about 2 cm, as measured by molding a 200 μm thick layer of the composition onto a 600 μm thick, 8″ silicon wafer at temperature of about 130° C. to about 150° C. for a period of time of about 10 minutes to about 1 hour.
4. The composition according to claim 1 , wherein the wafer is constructed of silicon and the composition is disposed on the wafer at a thickness of less than about 50 percent of a thickness of the wafer.
5. A method of improving warpage resistance of a molded wafer encapsulated by the thermosetting resin composition according to claim 1 , steps of the method comprising:
providing a wafer;
providing the thermosetting resin composition according to claim 1 in contact with the wafer; and
exposing the wafer and the thermosetting resin composition to conditions favorable to allow the thermosetting resin composition to flow about the wafer and cure to a reaction product of the thermosetting resin composition, wherein the cured reaction product of the thermosetting resin composition is capable of improving warpage resistance of the molded wafer with the cured reaction product of the thermosetting resin composition by about 50% or greater as compared with a molded wafer with a material other than the cured reaction product of the thermosetting resin composition.
6. The method according to claim 5 , wherein the warpage resistance of the molded wafer with the cured reaction product of the thermosetting resin composition is improved by about 65% or greater as compared with a molded wafer with a material other than the cured reaction product of the thermosetting resin composition.
7. The method according to claim 5 , wherein the warpage resistance of the molded wafer with the cured reaction product of the thermosetting resin composition is improved by about 80% greater as compared with a molded wafer with a material other than the cured reaction product of the thermosetting resin composition.
8. A product formed from the method of claim 5 .
9. The composition of claim 1 wherein the thermosetting resin matrix comprises an epoxy resin component, an episulfide resin component, an oxazine component, an oxazoline component, a cyanate ester component, and/or a maleimide-, a nadimide- or an itaconimide-containing component.