IP Library Granted Patent US 11,659,650
Granted Patent B2
US 11,659,650 · App. 17/180,779 · Granted May 23, 2023

Dual-spiral common-mode filter

Inventors: Antonio Ciccomancini Scogna (Cupertino, CA); Xinzhi Xing (San Jose, CA)
Assignee: Western Digital Technologies, Inc.
H05K1/0245H01P1/20381H01P3/026H05K1/111H05K3/4644H05K2201/09236H05K2201/1006
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Quick Facts
Patent No.
US 11,659,650
App. No.
17/180,779
Granted
May 23, 2023
Kind
B2
Abstract

Disclosed herein are dual-spiral common-mode filters, printed circuit boards (PCBs) comprising such dual-spiral common-mode filters, and devices comprising such dual-spiral common-mode filters and PCBs. A dual-spiral common-mode filter is patterned into the reference plane of a PCB. The dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion. The spiral portions may be substantially identical, or mirror images of each other, or different from each other. One or more signal traces in a signal trace layer of the PCB pass over the dual-spiral common-mode filter. The disclosed dual-spiral common-mode filters can replace both conventional patterned ground structure (PGS) filters used for radio-frequency interference mitigation and the cutouts often used in the reference plane of a PCB to mitigate impedance mismatches due to DC blocking capacitors. Also disclosed herein are methods of making PCBs that include dual-spiral common-mode filters.

Claims (34)

1. A printed circuit board, comprising:

a signal trace layer comprising:

a first signal trace comprising a first portion and a second portion, wherein the first and second portions of the first signal trace are disjoint,

a first component pad coupled to the first portion of the first signal trace,

a second component pad coupled to the second portion of the first signal trace,

a second signal trace, the second signal trace comprising a first portion and a second portion, wherein the first and second portions of the second signal trace are disjoint,

a third component pad coupled to the first portion of the second signal trace, and

a fourth component pad coupled to the second portion of the second signal trace; and

a reference plane situated under the signal trace layer, wherein the reference plane comprises a dual-spiral common-mode filter,

wherein:

a first at least part of the dual-spiral common-mode filter is situated under at least a portion of (a) the first component pad, (b) the second component pad, or (c) both (a) and (b),

a second at least part of the dual-spiral common-mode filter is situated under at least a portion of (i) the third component pad, (ii) the fourth component pad, or (iii) both (i) and (ii), and

the dual-spiral common-mode filter comprises a first spiral portion connected to a second spiral portion.

2. The printed circuit board recited in claim 1 , wherein a spiraling direction of the first spiral portion is opposite a spiraling direction of the second spiral portion.

3. The printed circuit board recited in claim 1 , wherein a spiraling direction of the first spiral portion and a spiraling direction of the second spiral portion are the same.

4. The printed circuit board recited in claim 1 , wherein the first and second spiral portions are approximate mirror images of each other.

5. The printed circuit board recited in claim 1 , wherein each of the first and second spiral portions has a substantially rectangular shape.

6. The printed circuit board recited in claim 1 , wherein an overall length of the dual-spiral common-mode filter is between approximately 10 mm and approximately 25 mm.

7. The printed circuit board recited in claim 1 , wherein a pattern width of the dual-spiral common-mode filter is between approximately 0.05 mm and approximately 0.15 mm.

8. The printed circuit board recited in claim 1 , wherein the dual-spiral common-mode filter has a substantially rectangular shape, and wherein an aspect ratio of the dual-spiral common-mode filter is greater than 1, and wherein a longer dimension of the dual-spiral common-mode filter is perpendicular to the first and second signal traces.

9. A data storage device comprising the printed circuit board recited in claim 1 .

10. The printed circuit board recited in claim 5 , wherein an aspect ratio of the dual-spiral common-mode filter is between 1 and approximately 6.

11. The printed circuit board recited in claim 8 , wherein the first and second spiral portions are approximate mirror images of each other.

12. A printed circuit board, comprising: a signal trace layer comprising a first signal trace, the first signal trace comprising a first portion and a second portion, wherein the first and second portions of the first signal trace are disjoint; a reference plane comprising a via-less dual-spiral common-mode filter, wherein the via-less dual-spiral common-mode filter comprises a pattern comprising a first spiral portion connected to a second spiral portion by a connector portion; and an insulating layer disposed between the signal trace layer and the reference plane, wherein: the via-less dual-spiral common-mode filter is situated below the first signal trace, and the first and second portions of the first signal trace are situated above the first spiral portion.

13. The printed circuit board recited in claim 12 , wherein a length of the pattern is between approximately 10 mm and approximately 25 mm.

14. The printed circuit board recited in claim 12 , wherein a spiraling direction of the first spiral portion is opposite a spiraling direction of the second spiral portion.

15. The printed circuit board recited in claim 12 , wherein the first and second spiral portions are approximate mirror images of each other.

16. The printed circuit board recited in claim 12 , wherein each of the first and second spiral portions has a substantially rectangular shape.

17. The printed circuit board recited in claim 12 , wherein a pattern width of the via-less dual-spiral common-mode filter is between approximately 0.05 mm and approximately 0.15 mm.

18. The printed circuit board recited in claim 12 , further comprising:

a first component pad coupled to the first portion of the first signal trace and situated above the first spiral portion, and

a second component pad coupled to the second portion of the first signal trace and situated above the first spiral portion.

19. A data storage device comprising the printed circuit board recited in claim 12 .

20. The printed circuit board recited in claim 16 , wherein an aspect ratio of the via-less dual-spiral common-mode filter is between 1 and approximately 6.

Assignments (5)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 056285 FRAME 0292 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 056285/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2021
From: SCOGNA, ANTONIO CICCOMANCINI; XING, XINZHI
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 055346/0403 →