IP Library Granted Patent US 12,176,241
Granted Patent B2
US 12,176,241 · App. 17/183,862 · Granted Dec 24, 2024

Support structure for thermal processing systems

Inventors: Manuel Sohn (Neu-Ulm, DE); Rolf Bremensdorfer (Bibertal, DE); Silke Hamm (Laupheim, DE); Alex Wansidler (Ulm, DE)
Assignees: Beijing E-Town Semiconductor Technology Co., Ltd.; Matson Technology, Inc.
H01L21/68742C23C14/30C23C14/50H01L21/67115H01L21/68757
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Quick Facts
Patent No.
US 12,176,241
App. No.
17/183,862
Granted
Dec 24, 2024
Kind
B2
Abstract

Support plates and support structures for thermal processing systems to heat workpieces are provided. In one example, a thermal processing apparatus is provided that includes a plurality of heat sources, a rotatable support plate, and a support structure having a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate. Also provided are support plates for supporting a workpiece in a thermal processing apparatus. The support plate can include a base defining a radial direction and an azimuthal direction and at least one support structure extending from the base having a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.

Claims (24)

1. A thermal processing apparatus, comprising:

a plurality of heat sources configured to heat a workpiece;

a rotatable support plate operable to support the workpiece during thermal processing the rotatable support plate defining a radial direction and an azimuthal direction, the rotatable support plate comprises one or more openings, wherein the one or more openings are oriented such that a tilting momentum of the support structure in the radial direction is greater than a tilting momentum in the azimuthal direction; and

a support structure extending from the rotatable support plate, the support structure configured to contact the workpiece during thermal processing, the support structure comprising a first end and a second end, wherein the first end of the support structure is arranged to support the workpiece during thermal processing, wherein the support structure has a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate.

2. The thermal processing apparatus of claim 1 , wherein the support structure comprises a quartz material.

3. The thermal processing apparatus of claim 1 , wherein the apparatus comprises a plurality of support structures, each of the support structures comprising a support pin.

4. The thermal processing apparatus of claim 1 , wherein the first end of the support structure comprises a tapered end and the second end of the support structure comprises a blunt end.

5. The thermal processing apparatus of claim 1 , wherein the support structure has a length of about 17 mm and a diameter of about 1.5 mm.

6. The thermal processing apparatus of claim 1 , wherein the support structure comprises a base plate such that the one or more openings are configured to engage the base plate to secure the support structure to the rotatable support plate.

7. The thermal processing apparatus of claim 6 , wherein the support structure comprises a key-shaped end configured to secure the support structure to the rotatable support plate.

8. The thermal processing apparatus of claim 1 , wherein the support structure comprises a pivot and a counterweight.

9. The thermal processing apparatus of claim 8 , wherein the pivot comprises a pin, wherein the pin is configured to be inserted into an opening on the support structure.

10. The thermal processing apparatus of claim 9 , wherein the rotatable support plate comprises one or more recessed pockets configured to engage the pivot of the support structure to secure the support structure to the rotatable support plate.

11. The thermal processing apparatus of claim 1 , wherein the rotatable support plate comprises a support structure mount configured to releasably secure the support structure to the rotatable support plate.

12. The thermal processing apparatus of claim 11 , wherein the support structure mount comprises a pivot configured such that tilting momentum of the support structure in the radial direction is greater than in the azimuthal direction.

13. A support plate for supporting a workpiece in a thermal processing apparatus, the support plate comprising:

a base defining a radial direction and an azimuthal direction, the base comprises one or more openings, wherein the one or more openings are oriented such that a tilting momentum of the support structure in the radial direction is greater than a tilting momentum in the azimuthal direction; and

at least one support structure extending from the base, the at least one support structure configured to support the workpiece during thermal processing;

wherein the support structure has a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.

14. The support plate of claim 13 , wherein the at least one support structure comprises a three support pins.

15. The support plate of claim 14 , wherein the at least one support structure comprises a key-shaped end configured to secure the at least one support structure to the base.

16. The support plate of claim 13 , wherein the at least one support structure comprises a pivot and a counterweight, wherein the base comprises one or more recessed pockets configured to engage the pivot of the at least one support structure to secure the support structure to the base.

17. The support plate of claim 13 , wherein the base comprises a support structure mount configured to releasably secure the at least one support structure to the base.

18. The support plate of claim 17 , wherein the support structure mount comprises a pivot configured such that tilting momentum of the support structure in the radial direction is greater than in the azimuthal direction.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2021
From: SOHN, MANUEL; BREMENSDORFER, ROLF; HAMM, SILKE; WANSIDLER, ALEX
To: MATTSON THERMAL PRODUCTS GMBH
Reel/Frame 055547/0476 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2021
From: MATTSON THERMAL PRODUCTS, GMBH
To: MATTSON TECHNOLOGY, INC.
Reel/Frame 055547/0611 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2021
From: MATTSON TECHNOLOGY, INC.
To: MATTSON TECHNOLOGY, INC.; BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD
Reel/Frame 055547/0804 →
Continuity (2)
Provisional Application 62983032 · Feb 28, 2020
Related Publication 20210272839A1 · Sep 2, 2021