Thermal management for head-worn computer
Aspects of the present invention relate to thermal management systems for head-worn computers.
1. A device comprising:
a frame coupled to a first arm and further coupled to a second arm, the frame configured to rest on a user's head via the first arm and the second arm;
a first compartment coupled to an upper portion of the frame and comprising an outer member;
an electronic system disposed within the first compartment, the electronic system configured to produce heat;
display coupled to a lower portion of the frame, the display configured to concurrently display digital imagery and a view of a surrounding environment; and
a thermal conductor adapted to facilitate a thermal connection between the electronic system and the outer member, wherein the electronic system is configured to be cooled by transference of the produced heat through the thermal conductor and the outer member;
wherein the first arm and a second arm are adapted to secure the first compartment on the user's head, at least one of the first arm and the second arm comprising an electrical connection for supplying power to the electronic system.
2. The device of claim 1 , wherein the first compartment further comprises a wireless communication system.
3. The device of claim 1 , wherein one or more of the first arm and the second arm comprises a respective removable ear horn.
4. The device of claim 1 , wherein one or more of the first arm and the second arm comprises:
a respective battery compartment for receiving a battery; and
a respective battery connection for connecting to the battery to supply power to the electronic system.
5. The device of claim 4 , wherein the respective battery compartment of the first arm is in a temple section of the first arm, wherein the temple section is disposed along the first arm.
6. The device of claim 1 , wherein the electronic system comprises a processor.
7. The device of claim 1 , wherein the electronic system comprises one or more sensors.
8. The device of claim 1 , wherein the electronic system comprises an optical drive system.
9. The device of claim 1 , wherein the thermal conductor comprises one or more heat dissipating fins coupled to the outer member.
10. The device of claim 1 , wherein a surface of the thermal conductor comprises a surface of the first compartment.
11. The device of claim 1 , wherein the thermal conductor is configured to maintain a device operating temperature below 70 degrees Celsius.
12. A method comprising:
cooling an electronic system of a device, wherein:
the electronic system is configured to produce heat and is disposed within a first compartment of the device;
the first compartment is coupled to an upper portion of a frame of the device and comprises an outer member;
the frame is coupled to a first arm and further coupled to a second arm;
the frame is configured to rest on a user's head via the first arm and the second arm;
the device comprises a display coupled to a lower portion of the frame, the display configured to concurrently display digital imagery and a view of a surrounding environment;
the device further comprises a thermal conductor adapted to facilitate a thermal connection between the electronic system and the outer member; and
cooling the electronic system comprises cooling by transference of the produced heat through the thermal conductor and the outer member.
13. The method of claim 12 , wherein the first compartment further comprises a wireless communication system.
14. The method of claim 12 , wherein one or more of the first arm and the second arm comprises a respective removable ear horn.
15. The method of claim 12 , wherein one or more of the first arm and the second arm comprises:
a respective battery compartment for receiving a battery; and
a respective battery connection for connecting to the battery to supply power to the electronic system.
16. The method of claim 15 , wherein the respective battery compartment of the first arm is in a temple section of the first arm, wherein the temple section is disposed along the first arm.
17. The method of claim 12 , wherein the electronic system comprises a processor.
18. The method of claim 12 , wherein the thermal conductor comprises one or more heat dissipating fins coupled to the outer member.
19. The method of claim 12 , wherein a surface of the thermal conductor comprises a surface of the first compartment.
20. The method of claim 12 , wherein cooling the electronic system comprises maintaining a device operating temperature below 70 degrees Celsius.