IP Library Granted Patent US 12,422,906
Granted Patent B2
US 12,422,906 · App. 17/184,637 · Granted Sep 23, 2025

Automated thermal property assignment based on surrounding part substrate

Inventors: Patrick A. Hampton (Round Rock, TX); Ernesto Ramirez (Austin, TX); Bo Hom (Round Rock, TX)
Assignee: Dell Products L.P.
G06F1/203H05K7/20172H05K7/20209H05K1/181
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Quick Facts
Patent No.
US 12,422,906
App. No.
17/184,637
Filed
Feb 25, 2021
Granted
Sep 23, 2025
Kind
B2
Art Unit
2847
USPC
174/255
Abstract

A portable information handing system. The portable information handling system includes a main housing portion, the main housing portion comprising first enclosure portion, a second enclosure portion, a motherboard, an electrical path detection component and a thermal characteristic selection system, the electrical path detection component being physically coupled between one of the first enclosure portion and the second enclosure portion and the motherboard, the thermal characteristic selection system determining a material of the one of the first enclosure portion and the second enclosure portion, the thermal characteristic selection system adjusting a thermal design power value based upon the material and a lid housing portion, the display chassis portion comprising a display component and a rear display cover portion.

Claims (48)

1. A portable information handling system, comprising:

a main housing portion, the main housing portion comprising a first enclosure portion, a second enclosure portion, a motherboard, an electrical path detection component and a thermal characteristic selection system, the electrical path detection component being physically coupled between one of the first enclosure portion and the second enclosure portion and the motherboard, the thermal characteristic selection system determining a material of the one of the first enclosure portion and the second enclosure portion, the thermal characteristic selection system adjusting a thermal design power value based upon a particular configuration of the material, the particular configuration being one of a plurality of material configurations, the thermal design power value corresponding to a particular thermal wattage, the particular thermal wattage being associated with the particular configuration of the material; and,

a lid housing portion, the display chassis portion comprising a display component and a rear display cover portion; and wherein

the thermal characteristic selection system adjusts the thermal design power value based upon a value of a substrate material signal.

2. The portable information handing system of claim 1 , wherein:

the main housing portion comprises a second electrical path detection component, the second electrical path detection component being physically coupled between another of the first enclosure portion and the second enclosure portion and the motherboard.

3. The portable information handing system of claim 2 , wherein:

the first enclosure portion includes a first material and the second enclosure portion includes a second material.

4. The portable information handing system of claim 1 , wherein:

the thermal characteristic selection system configures a set of thermal characteristics based upon the thermal design power value.

5. The portable information handing system of claim 4 , wherein:

the set of thermal characteristics are configured according to a respective set of thermal characteristic values, the set of thermal characteristic values comprising an indication of whether to turn a fan on or off and an indication of fan speed.

6. The portable information handing system of claim 5 , wherein:

the set of thermal characteristics are associated with an operating mode of the portable information handling system.

7. The portable information handing system of claim 1 , wherein:

the substrate material signal is provided to the thermal characteristic selection system via the electrical path detection component.

8. The portable information handing system of claim 5 , wherein:

the set of thermal characteristic values are provided to the thermal characteristic selection system via an embedded serial port interface.

9. The portable information handing system of claim 1 , wherein:

the electrical path detection component comprises a spring clip.

10. The portable information handing system of claim 6 , wherein:

the operating mode of the portable information handling system includes a balance mode of operation, a performance mode of operation, a cool mode of operation and a quiet mode of operation.

11. The portable information handing system of claim 10 , wherein:

the balance mode of operation is a default mode of operation.

12. An information handling system comprising:

a base chassis, the base chassis comprising first enclosure portion, a second enclosure portion, a motherboard, an electrical path detection component and a thermal characteristic selection system, the electrical path detection component being physically coupled between one of the first enclosure portion and the second enclosure portion and the motherboard, the thermal characteristic selection system determining a material of the one of the first enclosure portion and the second enclosure portion, the thermal characteristic selection system adjusting a thermal design power value based upon a particular configuration of the material, the particular configuration being one of a plurality of material configurations, the thermal design power value corresponding to a particular thermal wattage, the particular thermal wattage being associated with the particular configuration of the material; and,

a display chassis, the display chassis comprising a display component and a rear display cover portion; and wherein

the thermal characteristic selection system adjusts the thermal design power value based upon a value of a substrate material signal.

13. The information handling system of claim 12 , wherein:

the base chassis portion comprises a second electrical path detection component, the second electrical path detection component being physically coupled between another of the first enclosure portion and the second enclosure portion and the motherboard.

14. The information handling system of claim 13 , wherein:

the first enclosure portion includes a first material and the second enclosure portion includes a second material.

15. The information handling system of claim 12 , wherein:

the thermal characteristic selection system configures a set of thermal characteristics based upon the thermal design power value.

16. The information handling system of claim 15 , wherein:

the set of thermal characteristics are configured according to a respective set of thermal characteristic values, the set of thermal characteristic values comprising an indication of whether to turn a fan on or off and an indication of fan speed.

17. The information handling system of claim 16 , wherein:

the set of thermal characteristics are associated with an operating mode of the portable information handling system.

18. The information handing system of claim 12 , wherein:

the substrate material signal is provided to the thermal characteristic selection system via the electrical path detection component.

19. The information handing system of claim 16 , wherein:

the set of thermal characteristic values are provided to the thermal characteristic selection system via an embedded serial port interface.

20. The information handing system of claim 12 , wherein:

the electrical path detection component comprises a spring clip.

21. The information handing system of claim 17 , wherein:

the operating mode of the portable information handling system includes a balance mode of operation, a performance mode of operation, a cool mode of operation and a quiet mode of operation.

22. The information handing system of claim 21 , wherein:

the balance mode of operation is a default mode of operation.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 25, 2021
From: HAMPTON, PATRICK A.; RAMIREZ, ERNESTO; HOM, BO
To: DELL PRODUCTS L.P.
Reel/Frame 055402/0857 →
Continuity (1)
Related Publication 20220269321A1 · Aug 25, 2022
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