Activating surfaces for subsequent bonding
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm 2 to about 300 J/cm 2 . Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
1. A method of activating a surface of a plastics substrate formed from:
(a) polyether ether ketone (PEEK); polyether ketone ketone (PEKK); polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
(b) a polymer containing a phenyl group directly attached to a carbonyl group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm 2 to about 300 J/cm 2 ; the method comprising a step of treating the surface with copper acrylate, prior to exposing the surface to actinic radiation.
2. A method according to claim 1 wherein the exposing of the surface to actinic radiation is applied selectively to create areas of the surface that are activated for subsequent bonding and areas of the surface that are not activated for subsequent bonding.
3. A method according to claim 2 wherein a mask is used which has areas which transmit actinic radiation to create areas of the surface that are activated for subsequent bonding areas and areas which block actinic radiation to create areas of the surface that are not activated for subsequent bonding.
4. A method according to any according to claim 1 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from about 2 J/cm 2 to about 240 J/cm 2 ; and/or
the substrate is PEEK, PEKK, PEK, PEEKK, PEKEKK, PPS, PBT or PEI; and/or
activating is carried out for subsequent bonding with epoxy adhesive.
5. A method of activating a surface to claim 4 wherein the activating is carried out for subsequent bonding with an epoxy adhesive.
6. A method of activating a surface according to claim 1 , the method comprising the step of treating the surface with a (meth)acrylate, prior to exposing the surface to actinic radiation optionally wherein the (meth)acrylate is selected from tetrahydrofurfuryl acrylate (THFA); methyl methacrylate (MMA); and isobornyl acrylate (IBOA) and any combination thereof.
7. A method according to claim 6 wherein:
the plastics substrate is PPS; and/or
the activating is carried out for subsequent bonding with acrylic adhesive; and/or
the energy of the actinic radiation to which the surface is exposed is in the range from about 25 J/cm 2 to about 240 J/cm 2 .
8. A method of activating a surface according to claim 1 wherein the actinic radiation includes radiation with wavelength in the range from about 200 nm to about 700 nm.
9. A method according to claim 1 wherein the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm 2 to about 240 J/cm 2 .
10. A method according to claim 1 wherein the duration of the exposure is from about 0.1 seconds to about 360 minutes.
11. A method of activating a surface according to claim 1 wherein the activating is carried out for subsequent bonding with an acrylic adhesive, optionally wherein the energy of the actinic radiation to which the surface is exposed is in the range from about 1.5 J/cm 2 to about 240 J/cm 2 .
12. A method according to claim 1 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from about 3.5 J/cm 2 to about 100 J/cm 2 ; and/or
the substrate is PPS, PBT, PARA or PEI; and/or
activating is carried out for subsequent bonding with acrylic adhesive.
13. A method according to claim 1 wherein:
the energy of the actinic radiation to which the surface is exposed is in the range from about 3 J/cm 2 to about 240 J/cm 2 ; and/or
activating is carried out for subsequent bonding with anaerobic adhesive.
14. A method of activating a surface according to claim 1 wherein the activating is carried out for subsequent bonding with an anaerobic adhesive.
15. A method of bonding a first substrate formed from:
(a) polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
(b) a polymer containing a phenyl group directly attached to a carbonyl group;
(c) polyphenylene sulfide (PPS); or
(d) polyetherimide (PEI);
to a second substrate comprising the steps of:
(i) exposing the surface of the first substrate to actinic radiation to activate the surface for subsequent bonding wherein the actinic radiation includes radiation with wavelength in the range from about 10 nm to about 1000 nm; and the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm 2 to about 300 J/cm 2 ,
(ii) subsequently, bonding the activated surface of the first substrate to the second substrate utilising adhesive;
wherein the method comprises a step of treating the surface with copper acrylate, prior to exposing the surface to actinic radiation.
16. A method of bonding according to claim 15 , the method comprising the step of treating the surface with a (meth)acrylate, prior to exposing the surface to actinic radiation.
17. A method of activating a surface of a plastics substrate formed from: polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed in a time of about 30 seconds to about 4 minutes, is in the range from about 3.5 J/cm 2 to about 40 J/cm 2 for subsequent bonding with acrylic adhesive; or
the energy of the actinic radiation to which the surface is exposed is in the range from about 4 J/cm 2 to about 850 J/cm 2 for subsequent bonding with epoxy adhesive.
18. A method of activating a surface of a plastics substrate formed from polyarylamide (PARA) or polybutadiene terephthalate (PBT), for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm; and
the energy of the actinic radiation to which the surface is exposed is in the range from about 10 J/cm 2 to about 30 J/cm 2 for subsequent bonding with acrylic adhesive.
19. A method of activating a surface of a plastics substrate formed from polyphenylene sulfide (PPS), for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation
includes radiation with wavelength in the range from about 10 nm to about 1000 nm and two or more UV wavelengths selected from UVA, UVB, UVC and UVV are applied; and
the energy of the actinic radiation to which the surface is exposed is in the range from about 15 J/cm 2 to about 240 J/cm 2 for subsequent bonding with acrylic adhesive wherein the surface is treated with methacrylic acid, prior to exposing the surface to the actinic radiation,
or the energy of the actinic radiation to which the surface is exposed is in the range from about 5 J/cm 2 to about 312 J/cm 2 for subsequent bonding with epoxy adhesive.
20. A method of activating a surface of a plastics substrate formed from polyarylamide (PARA) or polybutadiene terephthalate (PBT), for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation for a time of about 5 seconds to about 4 minutes, wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from about 10 J/cm 2 to about 30 J/cm 2 for subsequent bonding with acrylic adhesive.
21. A method of activating a surface of a plastics substrate formed from polyetherimide (PEI), for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation for a time of about 30 seconds to 2 minutes, wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
the energy of the actinic radiation to which the surface is exposed is in the range from about 3.5 J/cm 2 to about 10 J/cm 2 for subsequent bonding with acrylic adhesive,
or the energy of the actinic radiation to which the surface is exposed is in the range from about 6 J/cm 2 to about 120 J/cm 2 for subsequent bonding with epoxy adhesive.
22. A method of activating a surface of a plastics substrate formed from: polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK);
for subsequent bonding,
the method comprising the steps of
treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed is in the range from about 9 J/cm 2 to about 240 J/cm 2 for subsequent bonding with anaerobic adhesive.
23. A method of activating a surface of a plastics substrate formed from: polyarylamide (PPS) for subsequent bonding,
the method comprising the steps of
treating the surface with copper acrylate solution, prior to exposing the surface to actinic radiation,
exposing the surface to actinic radiation for a time of about 2 to about 4 minutes, wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed is in the range from about 14 J/cm 2 to about 30 J/cm 2 for subsequent bonding with anaerobic adhesive; and after exposing the surface to the actinic radiation, removing excess copper acrylate solution from the surface before applying the anaerobic adhesive.
24. A method of activating a surface of a plastics substrate formed from: polyarylamide (PARA) or polybutadiene terephthalate (PBT) for subsequent bonding,
the method comprising the steps of
treating the surface with copper acrylate, prior to exposing the surface to actinic radiation,
exposing the surface to actinic radiation wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed is in the range from about 10 J/cm 2 to about 30 J/cm 2 for subsequent bonding with anaerobic adhesive.
25. A method of activating a surface of a plastics substrate formed from: polyetherimide (PEI) for subsequent bonding,
the method comprising the steps of
treating the PEI surface to be bonded with copper acrylate in acrylic acid, prior to exposing the surface to actinic radiation,
exposing the surface to actinic radiation for 30 sec to 4 minutes wherein the actinic radiation:
includes radiation with wavelength in the range from about 10 nm to about 1000 nm;
and the energy of the actinic radiation to which the surface is exposed is in the range from about 3 J/cm 2 to about 30 J/cm 2 for subsequent bonding with anaerobic adhesive; and after exposing the surface to the actinic radiation, removing excess copper acrylate solution from the surface before applying the anaerobic adhesive.