Ultrasonic probe with heat dissipation members arranged in center of backing layer
An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.
1. An ultrasonic probe comprising:
a transduction layer in which a plurality of transducers are placed;
a backing layer provided at a rear side of the transduction layer; and
a plurality of heat dissipation members which are provided in the backing layer, wherein the heat dissipation members extend in a line form in the backing layer in a long axis of the ultrasonic probe and are placed with an aligned direction of extension,
wherein an area occupancy percentage of the heat dissipation members relative to the backing layer at a center region of the backing layer in a cross section along a short axis intersecting the long axis is larger than the area occupancy percentage of the heat dissipation members relative to the backing layer at a region at an outer side of the center region.
2. The ultrasonic probe according to claim 1 , wherein
the center region is a region which is not positioned at ends of the cross section, which includes a center of gravity of the cross section, and which occupies an area less than or equal to a half of an area of the cross section.
3. The ultrasonic probe according to claim 1 , wherein
each of the transducers extends in the long axis direction, and is placed in an arrangement along the short axis direction intersecting the long axis direction, and
the heat dissipation members extend in the long axis direction, and are placed a positions between cut grooves extending from gaps between two adjacent transducers to the backing layer.
4. The ultrasonic probe according to claim 1 , further comprising:
a wiring layer provided between the transduction layer and the backing layer, wherein
each of the transducers extend in the long axis direction, and is placed in an arrangement along the short axis direction intersecting the long axis direction, and
the heat dissipation members extend in the short axis direction, and the wiring layer has a heat conducting structure.
5. The ultrasonic probe according to claim 4 , wherein
the heat conducting structure includes thermal vias provided between the transducers and the heat dissipation members.
6. The ultrasonic probe according to claim 5 , wherein
the thermal vias are provided at positions between cut grooves extending from gaps between two adjacent transducers to the wiring layer.
7. The ultrasonic probe according to claim 4 , further comprising:
a cut groove extending from a gap between two adjacent transducers to the wiring layer.
8. The ultrasonic probe according to claim 1 , wherein
a placement interval of the plurality of heat dissipation members becomes wider from a center of the center region toward an outer side.
9. The ultrasonic probe according to claim 1 , wherein
a width in a direction of placement of the plurality of heat dissipation members becomes greater from an outer side of the center region of the backing layer toward a center of the backing layer.
10. The ultrasonic probe according to claim 1 , wherein
thermal conductivities of materials forming the plurality of heat dissipation members become higher from an outer side of the center region of the backing layer toward a center of the backing layer.