IP Library Granted Patent US 11,325,322
Granted Patent B2
US 11,325,322 · App. 17/193,660 · Granted May 10, 2022

Process for producing a packaging weld

Inventors: Jacques Thomasset (Neuvecelle, FR); Yan Gex-Collet (Choëx, CH); Gaël Bussien (Le Bouveret, CH); François Fleuret (Yverdon-les-Bains, CH); Yann Lepoittevin (Lausanne, CH); Florent Monay (Monthey, CH)
Assignee: AISAPACK HOLDING SA
B29C66/954B29C65/18B29C66/1122B29C66/849
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Quick Facts
Patent No.
US 11,325,322
App. No.
17/193,660
Granted
May 10, 2022
Kind
B2
Abstract

A process for continuous welding of a sheet of plastic material for manufacturing flexible packages, comprising a step of positioning the sheet relative to the welding device, putting ends of the sheet into contact, forming a weld by heating, pressing and cooling the ends of the sheet that are in contact, acquiring a primary temporal signal with a sensor, the primary temporal signal proportional to a thickness of the weld, transforming the primary temporal signal into a primary frequency signal and defining a low-frequency spectrum, a medium-frequency spectrum, and a high-frequency spectrum from the primary frequency signal, reconstructing a secondary low-frequency signal from the low-frequency spectrum, and determining the thickness of the weld based on the secondary low-frequency signal.

Claims (31)

1. A process for continuous welding of a sheet of plastic material for manufacturing flexible packages, comprising the steps of:

positioning the sheet relative to the welding device;

putting ends of the sheet into contact;

forming a weld by heating, pressing and cooling the ends of the sheet that are in contact;

acquiring a primary temporal signal with a sensor, the primary temporal signal proportional to a thickness of the weld;

transforming the primary temporal signal into a primary frequency signal and defining a low-frequency spectrum, a medium-frequency spectrum, and a high-frequency spectrum from the primary frequency signal;

reconstructing a secondary low-frequency signal from the low-frequency spectrum; and

determining the thickness of the weld based on the secondary low-frequency signal, the secondary low-frequency signal providing for an accuracy of a measurement of the thickness below 10 μm, such that the accuracy of the measurement is approximately ten times below than an amplitude of an interference noise.

2. The process as claimed in claim 1 , wherein the primary signal is further reconstructed into a medium-frequency secondary signal from the medium-frequency spectrum, the medium-frequency secondary signal used to detect sudden variations in the thickness of the weld and/or one-off defects in the weld.

3. The process as claimed in claim 1 , wherein the primary signal is further reconstructed into a high-frequency secondary signal from the high-frequency spectrum, the high-frequency secondary signal being used to characterize the welding device in a environment.

4. The process as claimed in claim 1 , wherein the frequency of acquisition of the primary signal is greater than 100 Hz.

5. The process as claimed in claim 1 , wherein the frequency of acquisition of the primary signal is greater than 1000 Hz.

6. The process as claimed in claim 1 , wherein the low-frequency secondary signal is obtained from the spectrum of frequencies of the primary signal that are lower than f 1 , f 1 being greater than C m /60, wherein,

f 1 is the frequency in Hertz, and

C m is a speed of the manufacturing of the flexible packages expressed in flexible packages per minute.

7. The process as claimed in claim 1 , wherein f 1 is greater than (C m /60)×(L e /10) and wherein,

f 1 is the frequency in Hertz,

C m is a speed of the manufacturing of the flexible packages expressed in flexible packages per minute, and

L e is a length of the weld per flexible package in mm.

8. The process as claimed in claim 1 , wherein the medium-frequency secondary signal lies within a spectrum of frequencies defined by a low-frequency secondary signal (f 1 ) and a frequency f 2 , f 2 being less than (C m /60)*(L e /0.01), wherein,

f 2 is the frequency in Hertz,

C m is a speed of the manufacturing of the flexible packages expressed in flexible packages per minute, and

L e is a length of the weld per flexible package in mm.

9. The process as claimed in claim 1 , wherein f 2 is less than (C m /60)*(L e /0.03), wherein,

f 2 is the frequency in Hertz,

C m is a speed of the manufacturing of the flexible packages expressed in flexible packages per minute, and

L e is a length of the weld per flexible package in mm.

10. The process as claimed in claim 1 , wherein the high-frequency secondary signal lies within a spectrum of frequencies that is higher than a range of the medium-frequency secondary signal.

11. The process as claimed in claim 1 , further comprising a step of:

calibrating the measurement of the thickness of the weld.

12. The process as claimed in claim 1 , wherein the accuracy of the measurement of the thickness below 5 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 24, 2021
From: THOMASSET, JACQUES; GEX-COLLET, YAN; BUSSIEN, GAËL; FLEURET, FRANÇOIS; LEPOITTEVIN, YANN; MONAY, FLORENT
To: AISAPACK HOLDING S.A.
Reel/Frame 055702/0211 →
Priority Claims (1)
EP 18193142 · Sep 7, 2018 · regional
Continuity (2)
Continuation In Part PCTIB2019057551 · Sep 6, 2019
Related Publication 20210187872A1 · Jun 24, 2021