IP Library Granted Patent US 11,926,157
Granted Patent B2
US 11,926,157 · App. 17/193,731 · Granted Mar 12, 2024

Photoresist imaging and development for enhanced nozzle plate adhesion

Inventor: Sean T. Weaver (Lexington, KY)
Assignee: Funai Electric Co., Ltd.
B41J2/1623B41J2/1433B41J2/1628B41J2/1631G03F7/0382G03F7/0751G03F7/0752G03F7/162G03F7/2004B41J2202/19B41J2202/22
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Quick Facts
Patent No.
US 11,926,157
App. No.
17/193,731
Granted
Mar 12, 2024
Kind
B2
Abstract

A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.

Claims (10)

1. A fluid ejection head for a fluid jet ejection device comprising,

a silicon substrate containing at least one array of fluid ejectors deposited thereon,

at least one fluid supply via etched through the silicon substrate adjacent to the at least one array of fluid ejectors,

a flow feature layer attached to the silicon substrate, the flow feature layer containing at least one array of fluid chambers and fluid flow channels corresponding the at least one array of fluid ejectors configured for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers, wherein at least a portion of the flow feature layer comprises an attachment surface having a roughened surface area with improved surface adhesion characteristics, and

a nozzle plate containing nozzle holes laminated to the flow feature layer to provide the fluid ejection head.

2. The fluid ejection head of claim 1 , wherein the flow feature layer comprises a negative photoresist material spin coated onto the silicon substrate.

3. The fluid ejection head of claim 1 , wherein the flow feature layer comprises a negative photoresist material laminated to the silicon substrate.

4. The fluid ejection head of claim 2 , wherein the flow feature layer is imaged through a mask containing opaque areas and gray scale areas, wherein the gray scale areas provide a roughened attachment surface configured to provide the roughened surface area having the improved surface adhesion characteristics.

5. The fluid ejection head of claim 2 , wherein the flow feature layer is imaged through a mask containing opaque areas and areas containing chrome particles, wherein the areas containing chrome particles provide concavities on a portion of the surface of the flow feature layer whereby a surface area for attaching the nozzle plate to the flow feature layer has the roughened surface area that provides the improved surface adhesion characteristics.

6. The fluid ejection head of claim 2 , wherein the flow feature layer is imaged through a mask containing opaque areas and areas containing opaque geometric shapes, wherein the areas containing opaque geometric shapes provide a surface of the flow feature layer whereby a surface area for attaching the nozzle plate to the flow feature layer has the roughened surface area that provides the improved surface adhesion characteristics.

Assignments (5)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2025
From: FUNAI ELECTRIC CO., LTD.
To: BRADY WORLDWIDE, INC.
Reel/Frame 070724/0640 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2023
From: FUNAI ELECTRIC HOLDINGS CO., LTD.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 064093/0487 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 063815 FRAME: 0716. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jun 2, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063843/0907 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063815/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2021
From: WEAVER, SEAN T
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 055510/0667 →
Continuity (1)
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