Integrating control circuits with light emissive circuits with dissimilar wafer sizes

1. An article comprising:

a semiconductor including at least one integrated circuit; and

an inorganic semiconductor layer bonded to a first surface of the semiconductor, wherein the inorganic semiconductor layer comprises a μLED array, wherein the μLED array comprises a plurality of μLEDs, wherein the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer, and wherein the first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.

2. The article of claim 1 , further comprising a fill material disposed on the first surface of the semiconductor and contacting the first edge of the inorganic semiconductor layer.

3. The article of claim 2 , wherein the fill material comprises an oxide or a dielectric polymer.

4. The article of claim 3 , wherein a surface of the fill material is substantially coplanar with a major surface of the inorganic semiconductor layer opposite the first surface of the semiconductor.

5. The article of claim 4 , wherein the first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the major surface of the inorganic semiconductor layer and the surface of the fill material.

6. The article of claim 5 , wherein the surface of the fill material extends beyond the first edge of the inorganic semiconductor layer.

7. The article of claim 1 , wherein the semiconductor comprises complementary metal-oxide-semiconductor (CMOS) or bi-CMOS.

8. The article of claim 1 , wherein the at least one integrated circuit comprises at least one of digital circuitry or analog circuitry.

9. The article of claim 1 , wherein the μLED array is configured to emit at least one of red light, green light, or blue light.

10. The article of claim 1 , wherein the at least one integrated circuit is configured to drive at least one element of the μLED array.

11. A method comprising:

singulating a wafer into a plurality of singulated dice, wherein the wafer comprises an inorganic semiconductor layer on a substrate, and wherein each singulated die includes a portion of the substrate and a corresponding portion of the inorganic semiconductor layer;

bonding the plurality of singulated dice to a semiconductor wafer including a plurality of integrated circuits;

after bonding the plurality of singulated dice to the semiconductor wafer, removing substantially the entire substrate portion from each of the plurality of singulated dice; and

forming a μLED array in at least one of the portions of the inorganic semiconductor layer.

12. The method of claim 11 , wherein forming the μLED array comprises forming the μLED array in each corresponding portion of the inorganic semiconductor layer.

13. The method of claim 11 , wherein bonding the plurality of singulated dice to the semiconductor wafer including the plurality of integrated circuits comprises bonding a singulated dice to a corresponding integrated circuit of the plurality of integrated circuits.

14. The method of claim 11 , wherein the inorganic semiconductor layer comprises an epitaxial layer comprising at least one of gallium nitride, gallium arsenide, indium gallium nitride, or indium gallium arsenide.

15. The method of claim 11 , wherein the semiconductor wafer including a plurality of integrated circuits comprises a complementary metal-oxide-semiconductor (CMOS) wafer including a plurality of device driver integrated circuits or a bi-CMOS wafer including a plurality of device driver integrated circuits.

16. The method of claim 11 , where the wafer comprising the inorganic semiconductor layer on the substrate is a different size from the semiconductor wafer including the plurality of integrated circuits.

17. The method of claim 11 , further comprising:

filling a volume between the bonded plurality of singulated dice with a fill material; and

wherein removing substantially the entire substrate portion from each of the plurality of singulated dice comprises thinning and planarizing the bonded plurality of singulated dice and the fill material, wherein the fill material comprises an oxide.

18. The method of claim 11 , wherein bonding the plurality of singulated dice to the semiconductor wafer including the plurality of integrated circuits comprises:

bonding the portions of the substrates of the singulated dice to a carrier substrate;

filling a volume between the plurality of singulated dice with a fill material;

planarizing the plurality of singulated dice and the fill material to define a substantially planar surface comprising the portions of the inorganic semiconductor material and the fill material; and

bonding, via wafer-to-wafer bonding, the portion of the inorganic semiconductor layer of each of the plurality of singulated dice to the semiconductor wafer including the plurality of integrated circuits.

19. The method of claim 18 , wherein removing substantially the entire portion of the substrate from each of the plurality of singulated dice further comprises:

after bonding the portion of the inorganic semiconductor layer of each of the plurality of singulated dice to the semiconductor wafer, thinning and planarizing carrier substrate, the plurality of singulated dice, and the fill material to expose the portion of the inorganic semiconductor layer of each of the plurality of singulated dice.

20. An artificial reality system comprising:

a head mounted display comprising:

a semiconductor including at least one integrated circuit; and

an inorganic semiconductor layer bonded to a first surface of the semiconductor, wherein the inorganic semiconductor layer comprises a μLED array, wherein the μLED array comprises a plurality of μLEDs, wherein the first surface of the semiconductor extends beyond a first edge of the inorganic semiconductor layer, and wherein the first edge of the inorganic semiconductor layer is oriented substantially perpendicular to the first surface of the semiconductor.