IP Library Granted Patent US 11,917,779
Granted Patent B2
US 11,917,779 · App. 17/194,945 · Granted Feb 27, 2024

Cover assembly with damping hinge

Inventors: Amrita Sidhu Maguire (Cedar Park, TX); Alice Aigin Liu (Shanghai, CN); Sam Shang (Shanghai, CN); Anthony Sanchez (Pflugerville, TX); Yuxin Chen (Shanghai, CN)
Assignee: Dell Products L.P.
H05K5/0226H05K7/1494
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Quick Facts
Patent No.
US 11,917,779
App. No.
17/194,945
Granted
Feb 27, 2024
Kind
B2
Abstract

A modular information handling system may include one or more information handling resources and an enclosure configured to house the one or more information handling resources, the enclosure comprising a topside cover comprising: a fixed portion mechanically fixed to a remaining portion of the enclosure, a movable portion, and a damping hinge configured to rotatably couple the movable portion to the fixed portion about an axis of rotation defined by the damping hinge, wherein the damping hinge is configured to dampen mechanical rotation of the movable portion relative to the fixed portion when the movable portion mechanically moves towards a closed position relative to the fixed portion.

Claims (26)

1. A modular information handling system, comprising:

one or more information handling resources; and

an enclosure configured to house the one or more information handling resources, the enclosure comprising a topside cover comprising:

a fixed portion mechanically fixed to a remaining portion of the enclosure;

a movable portion;

a damping hinge configured to rotatably couple the movable portion to the fixed portion about an axis of rotation defined by the damping hinge, wherein the damping hinge is configured to dampen mechanical rotation of the movable portion relative to the fixed portion when the movable portion mechanically moves towards a closed position relative to the fixed portion; and

a spring assembly configured to exert a mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion.

2. The modular information handling system of claim 1 , wherein the spring assembly is configured to exert the mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion beyond a particular angle relative to the closed position.

3. The modular information handling system of claim 2 , wherein the particular angle is 90 degrees.

4. The modular information handling system of claim 2 , wherein the spring assembly comprises a torsional spring configured to exert the mechanical spring force.

5. The modular information handling system of claim 2 , wherein the spring assembly comprises a hinge feature rotationally coupling the movable portion to the fixed portion about the rotational axis.

6. A cover configured to at least partially house one or more components, the cover comprising:

a fixed portion;

a movable portion;

a damping hinge configured to rotatably couple the movable portion to the fixed portion about an axis of rotation defined by the damping hinge, wherein the damping hinge is configured to dampen mechanical rotation of the movable portion relative to the fixed portion when the movable portion mechanically moves towards a closed position relative to the fixed portion; and

a spring assembly configured to exert a mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion.

7. The cover of claim 6 , wherein the spring assembly is configured to exert the mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion beyond a particular angle relative to the closed position.

8. The cover of claim 7 , wherein the particular angle is 90 degrees.

9. The cover of claim 7 , wherein the spring assembly comprises a torsional spring configured to exert the mechanical spring force.

10. The cover of claim 7 , wherein the spring assembly comprises a hinge feature rotationally coupling the movable portion to the fixed portion about the rotational axis.

11. A method comprising:

mechanically coupling a fixed portion of a cover configured to at least partially house one or more components to a movable portion via a damping hinge configured to rotatably couple the movable portion to the fixed portion about an axis of rotation defined by the damping hinge, wherein the damping hinge is configured to dampen mechanical rotation of the movable portion relative to the fixed portion when the movable portion mechanically moves towards a closed position relative to the fixed portion, and further comprising mechanically coupling a spring assembly between the fixed portion and the movable portion, the spring assembly configured to exert a mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion.

12. The method of claim 9 , wherein the spring assembly is configured to exert the mechanical spring force on the movable portion relative to the fixed portion to force the movable portion toward the closed position when the movable portion is opened relative to the fixed portion beyond a particular angle relative to the closed position.

13. The method of claim 12 , wherein the particular angle is 90 degrees.

14. The method of claim 12 , wherein the spring assembly comprises a torsional spring configured to exert the mechanical spring force.

15. The method of claim 12 , wherein the spring assembly comprises a hinge feature rotationally coupling the movable portion to the fixed portion about the rotational axis.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2021
From: MAGUIRE, AMRITA SIDHU; LIU, ALICE AIQIN; SHANG, SAM; SANCHEZ, ANTHONY; CHEN, YUXIN
To: DELL PRODUCTS L.P.
Reel/Frame 055522/0446 →