Thermal interface material

1. A composition comprising:

a first part comprising polyisobutylene, a reactive diluent mixture, a catalyst, and one or more thermally conductive fillers, and

a second part comprising polyisobutylene, the reactive diluent mixture, a silicone based cross-linker, an inhibitor and one or more thermally conductive fillers,

wherein the reactive diluent mixture comprises one or more diluents with a mono-substituted alkene structure comprising a terminal olefin, and one or more diluents with a multi-substituted alkene structure comprising a 1,1-disubstituted olefin with 12-24 carbon atoms, and wherein a molar ratio of the one or more mono-substituted alkene structure diluents to the one or more multi-substituted alkene structure diluents is about 3:1,

wherein a molar ratio of the combined polyisobutylene of the first and second parts to the combined reactive diluent mixture of the first and second parts is from about 15:1 to about 31:1 and

wherein the thermally conductive fillers of the first part and the second part are present in the composition in an amount of 90 wt. % or greater based on the total weight of the composition.

2. The composition of claim 1 , wherein the mono-substituted alkene structure comprises 1-hexadecene, and the multi-substituted alkene structure comprises 7-methylenepentadecane.

3. The composition of claim 1 , wherein the silicone based cross-linker has at least 3 Si—H groups in each single molecular chain.

4. The composition of claim 1 , wherein the silicone based cross-linker has at least 17 Si—H groups in each single molecular chain.

5. The composition of claim 1 , wherein the silicone based cross-linker is a siloxane.

6. The composition of claim 1 , wherein the molar ratio of silicone based cross-linker to polyisobutylene is in the range of about 1:0.4 to about 1:1.

7. The composition of claim 1 , wherein the catalyst is included in an amount of 10 to 100 ppm.

8. The composition of claim 1 , wherein the inhibitor is included in an amount of greater than about 1 ppm.

9. The composition of claim 1 , wherein the catalyst is any catalyst suitable for a hydrosilation reaction.

10. The composition of claim 1 , wherein the catalyst is Karstedt's catalyst.

11. The composition of claim 1 , wherein the inhibitor is a phenolic inhibitor.

12. The composition of claim 11 , wherein the inhibitor comprises 4-tert butylcatechol or a sterically hindered phenolic antioxidant.

13. The composition of claim 1 , wherein after curing at room temperature the composition exhibits 0.3% weight loss at up to 50° C.

14. The composition of claim 1 , wherein after curing the composition exhibits thermal conductivity of at least 3 W/mK.

15. The composition of claim 1 , wherein after curing the composition exhibits thermal stability measured using thermal shock from −40° C. to 125° C. after 1000 hour cycles.

16. The composition of claim 1 , wherein after curing the composition exhibits Shore 00 hardness in the range of 45-60.

17. A heat-generating component or a heat sink comprising the composition of claim 1 disposed thereon.

18. An electronic device comprising a heat-generating component, a heat sink, and the composition of claim 1 disposed therebetween.

19. The electronic device of claim 18 , wherein there is no air disposed between the heat-generating component and the heat sink.

20. The electronic device of claim 19 , wherein the composition is applied on the heat-generating component or the heat sink via two-component (2K) mixing system.

21. An electronic device comprising a heat-generating component, a heat sink, and the composition of claim 1 disposed therebetween, wherein after curing the composition exhibits Shore 00 hardness in the range of 45-60 and thermal conductivity of at least 3 W/mK.