IP Library Granted Patent US 12,043,130
Granted Patent B2
US 12,043,130 · App. 17/196,473 · Granted Jul 23, 2024

Cooling structure, charging apparatus, and vehicle

Inventor: Shinya Kimura (Tokyo, JP)
Assignee: Panasonic Automotive Systems Co., Ltd.
B60L53/302B60L53/18B60L2210/30
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Quick Facts
Patent No.
US 12,043,130
App. No.
17/196,473
Granted
Jul 23, 2024
Kind
B2
Abstract

A cooling structure is provided. The cooling structure includes a harness, a board electrically connected to the harness, a heat transfer member whose one end is connected between the harness and the board, the heat transfer member being a member to which heat of the harness is transmitted, and a heat sink connected to the other end of the heat transfer member and configured to radiate heat transmitted to the heat transfer member.

Claims (28)

1. A cooling structure comprising:

a harness;

a board electrically connected to the harness;

a heat transfer member whose one end is connected between the harness and the board, the heat transfer member being a member to which heat of the harness is transmitted; and

a heat dissipation member connected to another end of the heat transfer member and configured to radiate heat transmitted to the heat transfer member;

a connecting member configured to electrically connect the harness to the board, and

wherein one end of the heat transfer member is connected to the connecting member,

wherein another end of the heat transfer member is connected to the heat dissipation member,

wherein a part of the heat transfer member is disposed between a part of the connecting member and a part of the board, and

wherein the part of the connecting member, the part of the heat transfer member and the part of the board are fixed by screw fastening.

2. The cooling structure according to claim 1 , wherein a heat resistance of the heat transfer member is lower than a heat resistance of the board.

3. The cooling structure according to claim 1 , wherein the heat transfer member has a C-shape.

4. The cooling structure according to claim 3 , wherein the heat transfer member includes a bottom portion, a first upright portion that vertically rises from one end of the bottom portion, and a second upright portion that vertically rises from another end of the bottom portion in a direction parallel to the first upright portion.

5. The cooling structure according to claim 4 , wherein the first upright portion is sandwiched between the connecting member and the board.

6. The cooling structure according to claim 4 , wherein the first upright portion is thermally connected to a conducting body on the board and the connecting member.

7. The cooling structure according to claim 4 , wherein the first upright portion is formed in a plate-shape parallel to a surface of the connecting member.

8. The cooling structure according to claim 4 , wherein the second upright portion is formed in a plate-shape parallel to a surface of the heat dissipation member.

9. The cooling structure according to claim 4 , wherein the second upright portion is in surface contact with a surface of the heat dissipation member.

10. The cooling structure according to claim 4 , further comprising a potting material configured to bring the second upright portion into intimate contact with the heat dissipation member.

11. The cooling structure according to claim 1 , wherein the heat transfer member has an I-shape.

12. The cooling structure according to claim 1 , wherein the heat transfer member has an L-shape.

13. The cooling structure according to claim 1 , further comprising:

a first path configured to transmit heat generated at the harness to the connecting member, the heat transfer member, and the board; and

a path configured to transmit the heat generated at the harness to the connecting member, the heat transfer member, and the heat dissipation member.

14. The cooling structure according to claim 1 , wherein the heat dissipation member radiates heat transmitted to the heat dissipation member from the heat transfer member through a potting material.

15. The cooling structure according to claim 1 , wherein the heat transfer member is made of a conductive material.

16. A charging apparatus comprising the cooling structure according to claim 1 .

17. A vehicle comprising the charging apparatus according to claim 16 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2024
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
Reel/Frame 066709/0702 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2021
From: KIMURA, SHINYA
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 057662/0713 →
Priority Claims (1)
JP 2020-047729 · Mar 18, 2020 · national
Continuity (1)
Related Publication 20210291678A1 · Sep 23, 2021