IP Library Granted Patent US 11,290,097
Granted Patent B2
US 11,290,097 · App. 17/204,331 · Granted Mar 29, 2022

Semiconductor device

Inventors: Tomoki Hikichi (Tokyo, JP); Kentaro Fukai (Tokyo, JP)
Assignee: ABLIC INC.
H03K5/24G01R33/07H03F3/04
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Quick Facts
Patent No.
US 11,290,097
App. No.
17/204,331
Granted
Mar 29, 2022
Kind
B2
Abstract

A semiconductor device formed on a semiconductor substrate of a P type includes: a vertical resistor circuit including a resistor of an N type, the resistor forming a current path in a direction perpendicular to a surface of the semiconductor substrate; a Hall element provided on the semiconductor substrate, the Hall element being configured to supply a voltage proportional to a magnetic flux density in the direction perpendicular to the surface of the semiconductor substrate; an amplifier configured to amplify the voltage supplied from the Hall element, and supply the amplified voltage; a current/voltage conversion circuit configured to supply, as a comparison reference voltage, a voltage containing a product of a reference current IREF flowing through the vertical resistor circuit and a resistance value RREF of the vertical resistor circuit; and a comparator configured to receive the voltage supplied from the amplifier and the comparison reference voltage.

Claims (26)

1. A semiconductor device which is formed on a semiconductor substrate of a P type, the semiconductor device comprising:

a vertical resistor circuit including a resistor of an N type, the resistor forming a current path in a direction perpendicular to a surface of the semiconductor substrate;

a Hall element provided on the semiconductor substrate, the Hall element being configured to supply a voltage proportional to a magnetic flux density in the direction perpendicular to the surface of the semiconductor substrate;

an amplifier configured to amplify the voltage supplied from the Hall element, and supply the amplified voltage;

a current/voltage conversion circuit configured to supply, as a comparison reference voltage, a voltage containing a product of a reference current flowing through the vertical resistor circuit and a resistance value of the vertical resistor circuit; and

a comparator having a signal input terminal configured to receive the voltage supplied from the amplifier, and a reference voltage input terminal configured to receive the comparison reference voltage.

2. The semiconductor device according to claim 1 , further comprising:

a first current source configured to supply a drive current for driving the Hall element; and

a second current source configured to supply the reference current.

3. The semiconductor device according to claim 2 , wherein the second current source includes a current mirror circuit configured to copy the drive current at a predetermined current ratio, and supply the copied drive current as the reference current.

4. The semiconductor device according to claim 1 , further comprising:

a current source configured to supply a drive current for driving the Hall element; and

a current mirror circuit configured to copy the drive current at a predetermined current ratio, and supply the copied drive current as the reference current.

5. The semiconductor device according to claim 1 , wherein the vertical resistor circuit includes:

a first resistor arranged along a first direction parallel to the surface of the semiconductor substrate; and

a second resistor arranged along a second direction, the second resistor having the same piezoelectric coefficient as a piezoelectric coefficient of the first resistor, the second direction being parallel to the surface of the semiconductor substrate and perpendicular to the first direction,

the first resistor and the second resistor being electrically connected to form the vertical resistor circuit.

6. The semiconductor device according to claim 5 , further comprising:

a first current source configured to supply a drive current for driving the Hall element; and

a second current source configured to supply the reference current.

7. The semiconductor device according to claim 6 , wherein the second current source includes a current mirror circuit configured to copy the drive current at a predetermined current ratio, and supply the copied drive current as the reference current.

8. The semiconductor device according to claim 4 , further comprising:

a first current source configured to supply a drive current for driving the Hall element; and

a current mirror circuit configured to copy the drive current at a predetermined current ratio, and supply the copied drive current as the reference current.

9. The semiconductor device according to claim 1 , further comprising a current source circuit configured to supply a drive current for driving the Hall element and the reference current,

wherein the current source circuit includes a current source configured to supply the drive current, and a current mirror circuit configured to supply the reference current generated by copying the drive current at a predetermined current ratio.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2021
From: HIKICHI, TOMOKI; FUKAI, KENTARO
To: ABLIC INC.
Reel/Frame 055633/0778 →