Semiconductor devices
A semiconductor device includes circuit elements on a first substrate; gate electrodes on a second substrate and stacked to be apart from each other in a first direction; sacrificial insulating layers on a lower through-insulating layer penetrating the second substrate, stacked to be spaced apart from each other in the first direction, and having side surfaces opposing the gate electrodes; channel structures penetrating the gate electrodes, extending vertically on the second substrate, and including a channel layer; a first separation pattern penetrating the gate electrodes and including a first barrier pattern and a first pattern portion extending from the first barrier pattern in a second direction; and a second separation pattern penetrating the gate electrodes, disposed to be parallel to the first separation pattern, and extending in the second direction. Some of the side surfaces of the sacrificial insulating layers may overlap the first barrier pattern in a third direction.
1. A semiconductor device, comprising:
a peripheral circuit region on a first substrate and including circuit elements;
a stack structure provided on a second substrate disposed on the peripheral circuit region and including:
gate electrodes stacked to be spaced apart from each other in a first direction perpendicular to an upper surface of the second substrate on a first region of the second substrate and extending while having a staircase shape in a cross-sectional view in a second direction perpendicular to the first direction on a second region of the second substrate, and
interlayer insulating layers stacked alternately with the gate electrodes;
a channel structure penetrating through the stack structure, extending vertically on the second substrate, and including a channel layer;
a separation structure penetrating through the stack structure and extending in the second direction, and including a first separation pattern and a pair of second separation patterns disposed to be parallel to the first separation pattern;
a through-region disposed between the pair of second separation patterns and including a lower through-insulating layer penetrating through the second substrate, and the interlayer insulating layers and sacrificial insulating layers sequentially stacked on the lower through-insulating layer; and
through-contact plugs extending in the first direction through the through-region and electrically connected to the circuit elements of the peripheral circuit region,
wherein the sacrificial insulating layers have side surfaces opposing the gate electrodes, and
wherein an end portion of the first separation pattern protrudes further than at least some of the side surfaces of the sacrificial insulating layers toward the through-region.
2. The semiconductor device as claimed in claim 1 , wherein the end portion of the first separation pattern is in direct contact with the sacrificial insulating layers.
3. The semiconductor device as claimed in claim 1 , wherein the first separation pattern includes a first barrier pattern having the end portion of the first separation pattern and a first pattern portion that extends from the first barrier pattern in the second direction, and
wherein a material composition of the first barrier pattern includes a material that is different from a material composition of the sacrificial insulating layers.
4. The semiconductor device as claimed in claim 3 , wherein the first barrier pattern and the first pattern portion include materials that are different from each other.
5. The semiconductor device as claimed in claim 1 , wherein a portion of a side surface of the second separation pattern is in direct contact with the sacrificial insulating layers.
6. The semiconductor device as claimed in claim 5 , wherein the second separation pattern includes:
a second barrier pattern, having the portion of the side surface of the second separation pattern, and
second pattern portions, respectively extending from both end portions of the second barrier pattern in the second direction, and
wherein the second barrier pattern includes a material that is different from a material composition of the sacrificial insulating layers.
7. The semiconductor device as claimed in claim 6 , wherein the second barrier pattern and the second pattern portions include materials that are different from each other.
8. The semiconductor device as claimed in claim 1 , wherein the first separation pattern includes a first barrier pattern, having the end portion of the first separation pattern, and a first pattern portion extending from the first barrier pattern in the second direction, and
wherein the first pattern portion has a width that decreases toward the first barrier pattern in a third direction, perpendicular to the second direction.
9. The semiconductor device as claimed in claim 8 , wherein a width of the first barrier pattern in the third direction is smaller than the width of the first pattern portion in the third direction.
10. The semiconductor device as claimed in claim 8 , wherein the first barrier pattern includes an insulating spacer layer and a semiconductor layer disposed on an internal side surface of the insulating spacer layer.