Solvent compatible nozzle plate
A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.
1. A composite photoresist nozzle plate comprising a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin wherein the photoresist layer devoid of a phenoxy resin is configured to be adjacent to a flow feature layer of a fluid ejection head.
2. The composite photoresist nozzle plate of claim 1 , wherein the composite photoresist nozzle plate is coated onto a release liner.
3. The composite photoresist nozzle plate of claim 1 , wherein the photoresist layer devoid of a phenoxy resin is also devoid of a hydrophobicity agent.
4. The composite photoresist nozzle plate of claim 1 , wherein the photoresist layer devoid of a phenoxy resin has a thickness ranging from about 3 to about 10 microns.
5. The composite photoresist nozzle plate of claim 1 , wherein the photoresist layer containing a phenoxy resin has a thickness ranging from about 3 to about 20 microns.
6. The composite photoresist nozzle plate of claim 1 , further comprising a third photoresist layer adjacent to the photoresist layer containing the phenoxy resin, wherein the third photoresist layer contains a phenoxy resin and a hydrophobicity agent.
7. The composite photoresist nozzle plate of claim 6 , wherein the third photoresist layer has a thickness ranging from about 3 to about 20 microns.
8. The composite photoresist nozzle plate of claim 6 , wherein the hydrophobicity agent is selected from the group consisting of heptadecafluorodecyltrimethoxysilane, octadecyl-dimethylchlorosilane, octadecyltrichlorosilane, methytrimethoxysilane, octyltriethoxysilane, phenyltrimethoxysilane, t-butylmethoxysilane, tetraethoxysilane, sodium methyl siliconate, vinyltrimethoxysilane N-(3-(trimethoxysilyl)propyl)ethylenediamine, polymethylmethoxy-siloxane, polydimethylsiloxane, polyethylhydrogensiloxane, and dimethyl siloxane.
9. A fluid ejection head comprising a semiconductor substrate, a flow feature layer attached to the semiconductor substrate and the composite photoresist nozzle plate of claim 1 laminated to the flow feature layer.
10. A fluid ejection head comprising:
a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof and one or more fluid supply vias etched therethrough;
a flow feature layer applied to the device surface of the semiconductor substrate, wherein the flow feature layer has fluid channels and fluid ejection chambers imaged and developed therein; and
a composite photoresist nozzle plate laminated to the flow feature layer, wherein the composite photoresist nozzle plate comprises a photoresist layer devoid of a phenoxy resin adjacent to the flow feature layer, and a photoresist layer comprising a phenoxy resin adjacent to the photoresist layer devoid of a phenoxy resin.
11. The fluid ejection head of claim 10 , wherein the composite photoresist nozzle plate is devoid of a hydrophobicity agent.
12. The fluid ejection head of claim 10 , wherein the photoresist layer comprising the phenoxy resin comprises a photoresist layer devoid of a hydrophobicity agent adjacent to the photoresist layer devoid of a phenoxy resin and a photoresist layer comprising a hydrophobicity agent.
13. The fluid ejection head of claim 12 , wherein the hydrophobicity agent is selected from the group consisting of heptadecafluorodecyltrimethoxysilane, octadecyl-dimethylchlorosilane, octadecyltrichlorosilane methytrimethoxysilane, octyltriethoxysilane, phenyltrimethoxysilane, t-butylmethoxysilane, tetraethoxysilane, sodium methyl siliconate, vinyltrimethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine, polymethylmethoxy-siloxane, polydimethylsiloxane, polyethylhydrogensiloxane, and dimethyl siloxane.