Granted Patent B2

US 12,446,795 · App. 17/211,251 · Granted Oct 21, 2025

Inventors: Andrew DeHennis (Germantown, MD); Abhi Chavan (Germantown, MD); James Masciotti (Germantown, MD); Bryan Hays (Germantown, MD); Yahya Hosseini (Germantown, MD); Erman Citirik (Germantown, MD)

Assignee: Senseonics, Incorporated

A61B5/076A61B5/686A61B5/14503A61B2562/12

Abstract

Claims (70)

1. A method of manufacturing an implantable device, the method comprising:

placing circuitry at least partially within a housing;

after placing the circuitry at least partially within the housing, filling the housing with a first epoxy to an initial epoxy fill line;

after filling the housing with the first epoxy to the initial epoxy fill line, curing the first epoxy;

inserting one or more supports of a coupler into the housing;

with the one or more supports of the coupler inserted into the housing, connecting first and second electrically conductive connectors to contact pads of the circuitry;

attaching the coupler to a power source;

after curing the first epoxy, filling at least a remaining space in the housing between the cured first epoxy and an end of the housing with a second epoxy; and

curing the second epoxy in at least the remaining space in the housing between the cured first epoxy and the end of the housing.

2. The method of claim 1 , wherein attaching the coupler to the power source comprises connecting the first electrically conductive connector to a positive terminal of the power source.

3. The method of claim 1 , wherein attaching the coupler to the power source comprises connecting the second electrically conductive connector to a negative terminal of the power source.

4. The method of claim 1 , wherein, after inserting the one or more supports of the coupler into the housing, a surface of the coupler abuts a surface of the housing.

5. A method of manufacturing an implantable device, the method comprising:

placing circuitry at least partially within a housing;

adding a material to the housing;

after placing the circuitry at least partially within the housing and adding the material to the housing, curing the material;

connecting a first electrically conductive connector to a contact pad of the circuitry; and

connecting the first electrically conductive connector to a positive terminal of a power source, wherein:

connecting the first electrically conductive connector to the positive terminal of the power source comprises pushing a spring at an end of the first electrically conductive connector against the positive terminal of the power source and compressing the spring between the first electrically conductive connector and the positive terminal of the power source,

the spring is made of an electrically conductive material, and

the spring establishes an electrical connection between the first electrically conductive connector and the positive terminal of the power source.

6. The method of claim 5 , wherein the material is a first material, and the method further comprises:

filling at least a remaining space in the housing between the cured first material and an end of the housing with a second material; and

curing the second material.

7. The method of claim 6 , further comprising:

inserting one or more supports of a coupler into the housing; and

attaching the coupler to the power source.

8. The method of claim 6 , wherein, after inserting the one or more supports of the coupler into the housing, a surface of the coupler abuts a surface of the housing.

9. The method of claim 6 , wherein the first and second materials are epoxy.

10. The method of claim 5 , further comprising:

connecting a second electrically conductive connector to a contact pad of the circuitry; and

connecting the second electrically conductive connector to a negative terminal of the power source.

11. The method of claim 10 , further comprising inserting one or more supports of a coupler into the housing, wherein the first and second electrically conductive connectors are connected to contact pads of the circuitry with the one or more supports of the coupler inserted into the housing.

12. The method of claim 5 , wherein adding the material to the housing comprises filling the housing with the material to an initial fill line.

13. The method of claim 5 , wherein the material is epoxy.

14. The method of claim 5 , wherein the spring is welded to the end of the first electrically conductive connector.

15. The method of claim 5 , wherein the compression of the spring is greater than any compression of the first electrically conductive connector.

16. A method of manufacturing an implantable device, the method comprising:

placing circuitry at least partially within a housing;

after placing the circuitry at least partially within the housing, filling the housing with a first epoxy to an initial epoxy fill line;

after filling the housing with the first epoxy to the initial epoxy fill line, curing the first epoxy;

connecting first and second electrically conductive connectors to contact pads of the circuitry;

after curing the first epoxy, filling at least a remaining space in the housing between the cured first epoxy and an end of the housing with a second epoxy; and

curing the second epoxy.

17. The method of claim 16 , further comprising attaching a coupler to a power source.

18. The method of claim 17 , wherein the cured second epoxy fills a portion of the coupler.

19. The method of claim 17 , wherein the cured second epoxy fills all of the coupler.

20. A method of manufacturing an implantable device, the method comprising:

placing circuitry at least partially within a housing;

after placing the circuitry at least partially within the housing, filling the housing with a first material to an initial fill line;

after filling the housing with the first material to the initial fill line, curing the first material, wherein the cured first material creates a transmissive optical cavity within the housing;

connecting first and second electrically conductive connectors to contact pads of the circuitry;

after curing the first material, filling at least a remaining space in the housing between the cured first material and an end of the housing with a second material; and

curing the second material.

21. The method of claim 20 , wherein the first and second materials are epoxy.

22. The method of claim 20 , further comprising attaching a coupler to a power source.

23. The method of claim 22 , wherein the cured second material fills a portion of the coupler.

24. The method of claim 22 , wherein the cured second material fills all of the coupler.

25. A method of manufacturing an implantable device, the method comprising:

placing circuitry at least partially within a housing;

adding a first material to the housing;

after placing the circuitry at least partially within the housing and adding the first material to the housing, curing the first material, wherein the cured first material creates a transmissive optical cavity within the housing;

connecting first and second electrically conductive connectors to contact pads of the circuitry;

after curing the first material, filling at least a remaining space in the housing between the cured first material and an end of the housing with a second material; and

curing the second material.

26. The method of claim 25 , wherein the first and second materials are epoxy.

27. The method of claim 25 , further comprising attaching a coupler to a power source.

28. The method of claim 27 , wherein the cured second material fills a portion of the coupler.

29. The method of claim 27 , wherein the cured second material fills all of the coupler.

30. The method of claim 25 , wherein adding the first material to the housing comprises filling the housing with the first material to an initial fill line.

Assignments (2)

Continuity (2)

References Cited (37)