Differential circuit board and semiconductor light emitting device
A differential circuit board includes a dielectric layer having a first and a second surface, a first conductor line with a first line-width, a second conductor line with a second line-width less than the first line-width, and a ground conductor. The dielectric layer has a first portion with a first thickness between the first and second surface and a second portion with a second thickness less than the first thickness between the first and second surfaces. The first conductor line is disposed on the first surface of the first portion. The second conductor line is disposed on the first surface of the second portion. The ground conductor is disposed on the second surface of the first portion and the second surface of the second portion, wherein the ground conductor overlaps with the first conductor line and the second conductor line. The first and second conductor lines are differential transmission lines.
1. A differential circuit board comprising:
a dielectric layer having a first surface and a second surface,
wherein the dielectric layer has a first portion with a first thickness between the first surface and the second surface and has a second portion with a second thickness less than the first thickness between the first surface and the second surface;
a first conductor line with a first line-width,
wherein the first conductor line is disposed on the first surface of the first portion;
a second conductor line with a second line-width less than the first line-width,
wherein the second conductor line is disposed on the first surface of the second portion; and
a ground conductor disposed on the second surface of the first portion and the second surface of the second portion,
wherein the ground conductor overlaps with the first conductor line and the second conductor line,
wherein the first conductor line and the second conductor line are differential transmission lines.
2. The differential circuit board of claim 1 , wherein the ground conductor is continuous on the second surface of the first portion and the second surface of the second portion.
3. The differential circuit board of claim 1 , wherein:
the ground conductor includes a first ground conductor disposed on the second surface of the first portion; and
the ground conductor includes a second ground conductor disposed on the second surface of the second portion,
wherein the second ground conductor is separated from the first ground conductor.
4. The differential circuit board of claim 1 , wherein the dielectric layer has a third portion with a varying thickness between the first portion and the second portion,
wherein the third portion overlaps with none of the first conductor line and the second conductor line.
5. The differential circuit board of claim 1 , wherein the second surface has a level difference between the first portion and the second portion,
wherein the level difference is below a center of a space between the first conductor line and the second conductor line.
6. The differential circuit board of claim 1 , wherein the second conductor line is positioned at a center of the second portion in an arranging direction of the first conductor line and the second conductor line.
7. The differential circuit board according to claim 1 , wherein:
the dielectric layer includes a plurality of first portions, wherein the plurality of first portions comprises the first portion;
the dielectric layer includes a plurality of second portions, wherein the plurality of second portions comprises the second portion;
the first conductor line is disposed on the first surface of each of the plurality of first portions;
the second conductor line is disposed on the first surface of each of the plurality of second portions; and
the first conductor line and the second conductor line are respective differential transmission lines in multiple channels.
8. The differential circuit board of claim 7 , wherein:
each of the plurality of first portions, on the first surface, includes a routing area in which the first conductor line is formed and includes a margin area adjacent to the routing area in a direction against the second conductor line,
wherein the margin area has a margin width, and
wherein each of the plurality of first portions has a width that is equal to the margin width.
9. The differential circuit board of claim 7 , wherein each of the plurality of first portions, on the first surface, includes a routing area in which the first conductor line is formed and includes no margin area adjacent to the routing area in a direction against the second conductor line.
10. The differential circuit board of claim 7 , further comprising:
an inter-channel conductor on the first surface and between adjacent channels of the multiple channels; and
a connecting conductor configured to penetrate the dielectric layer and connect the ground conductor and the inter-channel conductor.
11. The differential circuit board of claim 10 , wherein the connecting conductor is configured to penetrate the first portion without penetrating the second portion.
12. The differential circuit board of claim 10 , wherein the connecting conductor is configured to penetrate the second portion without penetrating the first portion.
13. A semiconductor light-emitting device comprising:
a differential circuit board; and
an optical semiconductor device mounted on the differential circuit board, wherein:
the differential circuit board comprises:
a dielectric layer having a first surface and a second surface,
wherein the dielectric layer has a first portion with a first thickness between the first surface and the second surface and has a second portion with a second thickness less than the first thickness between the first surface and the second surface;
a first conductor line with a first line-width,
wherein the first conductor line is disposed on the first surface of the first portion;
a second conductor line with a second line-width less than the first line-width,
wherein the second conductor line is disposed on the first surface of the second portion; and
a ground conductor disposed on the second surface of the first portion and the second surface of the second portion,
wherein the ground conductor overlaps with the first conductor line and the second conductor line,
wherein the first conductor line and the second conductor line are differential transmission lines.
14. The semiconductor light-emitting device of claim 13 , wherein:
the optical semiconductor device is an electro-absorption modulator integrated laser in which an electro-absorption modulator and a semiconductor laser are integrated;
the electro-absorption modulator integrated laser includes a lower electrode common to the electro-absorption modulator and the semiconductor laser, and includes an upper electrode of the electro-absorption modulator;
the lower electrode is opposite to the first conductor line without protrusion; and
the upper electrode is connected to the second conductor line with a wire.
15. The semiconductor light-emitting device of claim 14 , further comprising:
a pad on the first surface, the pad being adjacent to the first conductor line in a direction against the second conductor line;
a matching resistor connected in series between the pad and the first conductor line; and
a wire configured to connect the upper electrode and the pad.
16. The semiconductor light-emitting device of claim 15 , wherein the pad is on the first portion.
17. The semiconductor light-emitting device of claim 15 , wherein the pad is on the second portion.
18. The semiconductor light-emitting device of claim 15 , wherein:
the second conductor line has a stub extending in a direction against the first conductor line, and
the first conductor line has a portion adjacent to the pad and adjacent to part, where the stub extends, of the second conductor line.
19. The semiconductor light-emitting device of claim 14 , wherein the second surface has a level difference between the first portion and the second portion,
wherein the level difference is below a center of a space between the first conductor line and the second conductor line.
20. The semiconductor light-emitting device of claim 14 , wherein the second conductor line is positioned at a center of the second portion in an arranging direction of the first conductor line and the second conductor line.