IP Library Granted Patent US 12,310,239
Granted Patent B2
US 12,310,239 · App. 17/221,088 · Granted May 20, 2025

Low power thermoelectric systems

Inventors: Kristen Warren (Cambridge, MA); Locklin George (Boston, MA); Sarah Horton (San Carlos, CA); Caitlynn Tov (Sacramento, CA); Matthew Dowling (Hillsborough, NJ); Xuchen He (Malden, MA); Matthew J. Smith (Somerville, MA)
Assignee: EMBR Labs IP LLC
H10N10/80F25B21/02F25B2321/0212F25B2321/023
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Quick Facts
Patent No.
US 12,310,239
App. No.
17/221,088
Granted
May 20, 2025
Kind
B2
Abstract

A device for manipulating the temperature of a surface may include a heat transfer surface including active portions and a passive portion. The passive portion may include an inner passive portion disposed between each of the active portions and/or may include an outer passive portion that may surround each of the active portions. The active portions may form 40-90% of a total surface area of the heat transfer surface, where total surface area includes active portions and an inner passive portion. The passive portion(s) may have a thermal conductivity less than the active portion. A processor may be in electrical communication with thermoelectric modules defining or forming the active portions to generate a heat flux through the heat transfer surface. The heat flux through the active portions may be between 500 and 15,000 W/m 2 during nominal operation of the device.

Claims (21)

1. A wearable device for manipulating a temperature of a surface, comprising:

a heat transfer surface configured to be placed in contact with the surface, wherein the surface is a user's skin, and the heat transfer surface comprising:

an active portion defined by a single thermoelectric module, wherein the active portion has a first thermal conductivity, and

an inner passive portion wherein a perimeter of the inner passive portion is fully surrounded by the active portion and wherein the inner passive portion has a second thermal conductivity less than the first thermal conductivity

wherein the perimeter of the active portion is fully surrounded by an outer passive portion.

2. The device of claim 1 , further comprising a heat sink thermally coupled to the inner passive portion, and wherein a heat flux through the active portion is in an opposite direction relative to a heat flux through the inner passive portion during operation of the device.

3. The device of claim 1 , wherein the active portion forms 40-60% of a total surface area of the heat transfer surface.

4. The device of claim 1 , wherein the heat transfer surface has a power consumption between 0.1 and 2 W during operation of the device.

5. The device of claim 1 , wherein a heat flux through the active portion is between 8,000 and 11,000 W/m 2 during operation of the device.

6. The device of claim 1 , wherein a total surface area of the heat transfer surface is between 200 and 1000 mm 2 during operation of the device.

7. The device of claim 1 , wherein the thermoelectric module is rectangular.

8. The device of claim 1 , wherein the thermoelectric module is annular.

9. The device of claim 1 , wherein a heat flux through the active portion is between 500 and 15,000 W/m 2 during operation of the device.

10. The device of claim 1 , wherein the heat transfer surface has a plurality of active portions.

11. The device of claim 1 , further comprising a spreader configured to transfer heat and thermally coupled with the thermoelectric module.

12. The device of claim 11 , wherein the inner passive portion is thermally isolated from the spreader.

13. The device of claim 1 , wherein the thermoelectric module includes a plurality of thermoelectric piles.

14. The device of claim 1 , wherein a boundary of a total surface area is defined by a region sharing a boundary with outer edges of the thermoelectric module.

15. The device of claim 1 , wherein the active portion is raised relative to the inner passive portion.

16. The device of claim 1 , further comprising a processor in electrical communication with the thermoelectric module, the processor configured to cause the thermoelectric module to generate heat flux through the heat transfer surface, wherein a heat flux through the active portion is between 500 and 15,000 W/m 2 .

17. The device of claim 1 , further comprising a power source coupled to the thermoelectric module, and wherein the thermoelectric module is configured to actively heat and/or cool the surface.

Assignments (7)
CONFIRMATORY LICENSE Recorded Nov 14, 2023
From: EMBER LABS, INC.
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 065564/0095 →
RELEASE OF SECURITY INTEREST Recorded Apr 3, 2023
From: QUIQ CAPITAL, LLC
To: EMBR LABS INC.
Reel/Frame 063207/0374 →
SECURITY INTEREST Recorded Apr 3, 2023
From: EMBR LABS IP LLC
To: ANKURA TRUST COMPANY, LLC
Reel/Frame 063210/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2023
From: EMBR LABS INC.
To: EMBR LABS IP LLC
Reel/Frame 063208/0482 →
SECURITY INTEREST Recorded Oct 21, 2022
From: EMBR LABS INC.
To: QUIQ CAPITAL, LLC
Reel/Frame 061500/0823 →
CONFIRMATORY LICENSE Recorded Sep 20, 2022
From: EMBR LABS INC
To: NATIONAL SCIENCE FOUNDATION
Reel/Frame 061477/0408 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2021
From: WARREN, KRISTEN; GEORGE, LOCKLIN; HORTON, SARAH; TOV, CAITLYNN; DOWLING, MATTHEW; HE, XUCHEN; SMITH, MATTHEW J.
To: EMBR LABS INC.
Reel/Frame 056909/0399 →
Continuity (2)
Provisional Application 63041724 · Jun 19, 2020
Related Publication 20210399186A1 · Dec 23, 2021
References Cited (42)
US 8397518B1 · Vistakula · 2013 [cited by examiner]
US 20070193278A1 · Polacek et al. · 2007 [cited by applicant]
US 20080188915A1 · Mills · 2008 [cited by examiner]
US 20090025770A1 · Lofy · 2009 [cited by examiner]
US 20100100004A1 · Van Someren · 2010 [cited by applicant]
US 20130085552A1 · Mandel · 2013 [cited by applicant]
US 20130086923A1 · Petrovski · 2013 [cited by examiner]
US 20130087180A1 · Stark · 2013 [cited by examiner]
US 20150101788A1 · Smith et al. · 2015 [cited by applicant]
US 20160030233A1 · Millar · 2016 [cited by examiner]
US 20180042761A1 · Smith · 2018 [cited by examiner]
US 20190110950A1 · Smith et al. · 2019 [cited by applicant]
US 20190117444A1 · Smith et al. · 2019 [cited by applicant]
US 20190275527A1 · Hayes · 2019 [cited by examiner]
US 20200035896A1 · Jovovic · 2020 [cited by examiner]
US 20200050248A1 · Smith et al. · 2020 [cited by applicant]
US 20200136005A1 · Sun · 2020 [cited by examiner]
US 20200289314A1 · Smith et al. · 2020 [cited by applicant]
US 20200289315A1 · Smith et al. · 2020 [cited by applicant]
US 20200289359A1 · Janson · 2020 [cited by examiner]
US 20200345971A1 · Schirm · 2020 [cited by examiner]
US 20200352459A1 · Lee · 2020 [cited by applicant]
US 20200352777A1 · Smith et al. · 2020 [cited by applicant]
US 20210030141A1 · Goo · 2021 [cited by examiner]
US 20210085559A1 · Smith et al. · 2021 [cited by applicant]
US 20210089097A1 · Smith et al. · 2021 [cited by applicant]
US 20210296553A1 · Wang · 2021 [cited by examiner]
US 20210315731A9 · Smith et al. · 2021 [cited by applicant]
US 20220096317A1 · Smith et al. · 2022 [cited by applicant]
US 20230226365A1 · Smith et al. · 2023 [cited by applicant]
JP 2007208066A · 2007 [cited by examiner]
JP-2007208066-A English (Year: 2007). [cited by examiner]
U.S. Appl. No. 16/214,372, filed Dec. 10, 2018, Smith et al. [cited by applicant]
U.S. Appl. No. 16/891,821, filed Jun. 3, 2020, Smith et al. [cited by applicant]
U.S. Appl. No. 15/555,677, filed Sep. 5, 2017, Smith et al. [cited by applicant]
U.S. Appl. No. 16/891,781, filed Jun. 3, 2020, Smith et al. [cited by applicant]
U.S. Appl. No. 16/344,577, filed Apr. 24, 2019, Smith et al. [cited by applicant]
U.S. Appl. No. 17/109,749, filed Dec. 2, 2020, Smith et al. [cited by applicant]
U.S. Appl. No. 16/129,182, filed Sep. 12, 2018, Smith et al. [cited by applicant]
U.S. Appl. No. 17/109,790, filed Dec. 2, 2020, Smith et al. [cited by applicant]
U.S. Appl. No. 16/962,322, filed Jul. 15, 2020, Smith et al. [cited by applicant]
International Search Report and Written Opinion for International Application No. PCT/US2021/025491, mailed Jul. 9, 2021. [cited by applicant]