Granted Patent B2

US 11,523,542 · App. 17/224,862 · Granted Dec 6, 2022

Inventor: Travis Gaskill (Austin, TX)

Assignee: Dell Products L.P.

H05K7/20709G06F1/20H05K1/021

Abstract

Claims (32)

1. An information handling system comprising:

a circuit board that includes a plurality of memory module sockets;

a plurality of memory modules received in the plurality of memory module sockets;

a plurality of heatsinks disposed between adjacent ones of the plurality of memory modules, wherein the memory modules and the heatsinks are bonded together to form a group that is simultaneously insertable into and simultaneously removable from the plurality of memory module sockets; and

a cold plate having projections that extend into regions between adjacent ones of the plurality of heatsinks.

2. The information handling system of claim 1 , further comprising gap pads disposed between the memory modules and the heatsinks.

3. The information handling system of claim 1 , wherein the heatsinks include heatpipes.

4. The information handling system of claim 1 , wherein the heatsinks include vapor chambers.

5. The information handling system of claim 1 , wherein the cold plate includes a fluid channel disposed therein that is configured to receive a liquid coolant.

6. The information handling system of claim 5 , further comprising:

a pump and tubing configured to convey the liquid coolant through the fluid channel; and

internal fins within the fluid channel configured to convey heat from the cold plate to the liquid coolant.

7. The information handling system of claim 1 , wherein the cold plate includes external fins thereon.

8. The information handling system of claim 7 , further comprising an air mover configured to direct an airflow across the external fins.

9. A method comprising:

coupling a plurality of memory modules to a plurality of heatsinks to form a group, such that in the group, the plurality of heatsinks are disposed between adjacent ones of the plurality of memory modules;

inserting the memory modules of the group simultaneously into a plurality of memory module sockets disposed on a circuit board; and

thermally coupling a cold plate to the group such that projections of the cold plate extend into regions between adjacent ones of the plurality of heatsinks.

10. The method of claim 9 , wherein the plurality of heatsinks have surface features corresponding to surface features of the plurality of memory modules.

11. The method of claim 9 , wherein coupling the plurality of memory modules to the plurality of heatsinks comprises bonding the plurality of memory modules to the plurality of heatsinks with a thermal interface material.

12. The method of claim 11 , wherein the thermal interface material comprises a thermal epoxy.

13. An apparatus comprising:

a group comprising a plurality of memory modules coupled to a plurality of heatsinks, such that in the group, the plurality of heatsinks are disposed between adjacent ones of the plurality of memory modules; and

a cold plate thermally coupled to the group such that projections of the cold plate extend into regions between adjacent ones of the plurality of heatsinks;

wherein the memory modules of the group are simultaneously insertable into a plurality of memory module sockets disposed on a circuit board.

14. The apparatus of claim 13 , further comprising gap pads disposed between the memory modules and the heatsinks.

15. The apparatus of claim 14 , wherein the gap pads comprise thermal epoxy.

16. The apparatus of claim 13 , wherein the heatsinks include heatpipes.

17. The apparatus of claim 13 , wherein the heatsinks include vapor chambers.

18. The apparatus of claim 13 , wherein the cold plate includes a fluid channel disposed therein that is configured to receive a liquid coolant.

19. The apparatus of claim 13 , wherein the memory modules are dual in-line memory modules (DIMMs).

20. The apparatus of claim 13 , wherein the cold plate includes external fins thereon.

Assignments (10)