IP Library Patent Application 17225198
Patent Application
App. No. 17/225,198

MODIFIED FLUID JET PLUME CHARACTERISTICS

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Quick Facts
Patent No.
US None
App. No.
17/225,198
Abstract

A fluid jet ejection device, a method of making a fluid jet ejection head for a fluid ejection device, and a method of improving the plume characteristics of fluid ejected from the fluid jet ejection head. The fluid jet ejection device includes a cartridge body; and a fluid jet ejection cartridge disposed in the cartridge body. The fluid jet ejection cartridge contains a fluid and an ejection head attached to the fluid jet ejection cartridge. The ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors, wherein a first portion of the plurality of fluid ejection nozzles have a first axial flow path length and a second portion of the plurality of fluid ejection nozzles have a second axial flow path length greater than the first axial flow path length.

Claims (35)

1 . A fluid jet ejection device comprising:

a cartridge body;

a fluid outlet nozzle attached to the cartridge body;

a fluid jet ejection cartridge disposed in the cartridge body, the fluid jet ejection cartridge containing a fluid and an ejection head attached to the fluid jet ejection cartridge; wherein the ejection head contains a plurality of fluid ejectors thereon and a nozzle plate having a plurality of fluid ejection nozzles therein associated with the plurality of fluid ejectors, wherein a first portion of the plurality of fluid ejection nozzles have a first axial flow path length and a second portion of the plurality of fluid ejection nozzles have a second axial flow path length greater than the first axial flow path length.

2 . The fluid jet ejection device of claim 1 , wherein the second axial flow path length is provided by a second nozzle plate layer attached to a first nozzle plate layer.

3 . The fluid jet ejection device of claim 2 , wherein the first nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

4 . The fluid jet ejection device of claim 2 , wherein the second nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

5 . The fluid jet ejection device of claim 2 wherein the first nozzle plate layer is laminated to a flow feature layer for the ejection head.

6 . The fluid jet ejection device of claim 2 , wherein the first nozzle plate layer and second nozzle plate layer comprise laminated photoresist material layers.

7 . The fluid jet ejection device of claim 6 , wherein the first nozzle plate layer is imaged and developed to form the first portion and the second nozzle plate layer is imaged and developed to form the second portion.

8 . A method of making an ejection head, the method comprising:

providing a semiconductor substrate having a plurality of fluid ejectors thereon;

applying a fluid flow layer to the semiconductor substrate;

imaging and developing fluid channels and fluid chambers in the fluid flow layer;

etching a fluid supply via through the semiconductor substrate;

applying a first nozzle plate layer to the fluid flow layer;

imaging and developing the first nozzle plate layer to provide a plurality of fluid ejection nozzles therein having a first axial flow path length;

applying a second nozzle plate layer to the first nozzle plate layer;

imaging and developing the second nozzle plate layer to provide a plurality of fluid ejection nozzles therein having a second axial flow path length through the first nozzle plate layer and the second nozzle plate layer and to removing a portion of the second nozzle plate layer from the first nozzle plate layer adjacent to the fluid ejection nozzles having the first axial flow path length.

9 . The method of claim 8 , wherein the first nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

10 . The method of claim 8 , wherein the second nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

11 . The method of claim 8 , wherein the first nozzle plate layer is laminated to the fluid flow layer.

12 . The method of claim 8 , wherein the second nozzle plate layer is laminated to the first nozzle plate layer.

13 . The method of claim 8 , wherein the fluid ejection nozzles having the first axial flow path length are adjacent to fluid ejection nozzles having the second axial flow path length.

14 . A method for improving plume characteristics of fluid ejected from a fluid jet ejection head, comprising:

applying a first nozzle plate layer to a fluid flow layer on an ejection head substrate;

imaging and developing the first nozzle plate layer to provide a plurality of nozzle holes therein having a first axial flow path length;

applying a second nozzle plate layer to the first nozzle plate layer;

imaging and developing the second nozzle plate layer to provide a plurality of nozzle holes therein having a second axial flow path length through the first nozzle plate layer and the second nozzle plate layer and removing a portion of the second nozzle plate layer adjacent to the plurality of nozzle holes having the first axial flow path length; and

ejecting fluid from the ejection head through nozzle holes having the first and second axial flow path lengths.

15 . The method of claim 14 , wherein the first nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

16 . The method of claim 14 , wherein the second nozzle plate layer has a thickness ranging from about 5 to about 30 microns.

17 . The method of claim 14 , wherein the first nozzle plate layer is laminated to the fluid flow layer.

18 . The method of claim 14 , wherein the second nozzle plate layer is laminated to the first nozzle plate layer.

19 . The method of claim 14 , wherein fluid is ejected from the fluid ejection head by alternately or simultaneously ejection fluid through nozzle holes having the first and second axial flow path lengths.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2023
From: FUNAI ELECTRIC HOLDINGS CO., LTD.
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 064093/0487 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 063815 FRAME: 0716. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jun 2, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063843/0907 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2023
From: FUNAI ELECTRIC CO., LTD.
To: FUNAI ELECTRIC HOLDINGS CO., LTD.
Reel/Frame 063815/0716 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2021
From: MARRA, MICHAEL A, III
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 055861/0614 →