Electro-optic package featuring sputtered EMI shield
Embodiments relate to a die package featuring a sputtered metal shield to reduce Electro-Magnetic Interference (EMI). According to a particular embodiment, a die featuring a top surface exposed by surrounding Molded Underfill (MUF) material, is subjected to metal sputtering. The resulting sputtered metal shield is in direct physical and thermal contact with the die, and is in electrical contact with a substrate supporting the die (e.g., to provide shield grounding). Specific embodiments may be particularly suited to reducing the EMI of a package containing an electro-optic die, to between 3-15 dB. The conformal nature and small thickness of the sputtered metal shield desirably conserves space and reduces package footprint. Direct physical contact between the shield and the die surface exposed by the MUF, enhances thermal communication (e.g., reducing junction temperature). According to certain embodiments, the sputtered metal shield comprises a stainless steel liner, copper, and a stainless steel coating.
1. A packaged electronic device comprising:
a substrate in electrical contact with a die;
a mold compound in contact with the substrate and with one or more sides of the die; and
a sputtered metal shield comprising a first layer of a first metal and a second layer of a second metal formed on the first layer, the sputtered metal shield being applied by sputtering and being in contact with the mold compound and with the substrate and extending to a bottom surface of the substrate.
2. The packaged electronic device of claim 1 wherein at least one of the sides of the die is in physical contact with the sputtered metal shield without the mold compound being disposed between the at least one of the sides of the die and the sputtered metal shield.
3. The packaged electronic device of claim 1 wherein the die is an electro-optic die.
4. The packaged electronic device of claim 3 wherein operation of the electro-optic die results in an Electro-Magnetic Interference (EMI) of between about 3-15 dB.
5. The packaged electronic device of claim 1 wherein the mold compound comprises molded underfill (MUF) material.
6. The packaged electronic device of claim 1 wherein the sputtered metal shield comprises copper.
7. The packaged electronic device of claim 1 wherein the sputtered metal shield comprises:
a top portion having a first thickness; and
a side portion having a second thickness smaller than the first thickness.
8. The packaged electronic device of claim 7 wherein:
the sputtered metal shield comprises copper;
the first thickness is approximately 6 μm; and
the second thickness is approximately 2 μm.
9. The packaged electronic device of claim 1 wherein the sputtered metal shield comprises a plurality of metal layers of at least two different metallic materials.
10. The packaged electronic device of claim 9 wherein the first layer of the sputtered metal shield comprises copper, and the second layer of the sputtered metal shield comprises stainless steel.
11. The packaged electronic device of claim 1 wherein the die is not in physical contact with the sputtered metal shield.
12. The packaged electronic device of claim 1 wherein the sputtered metal shield contacts a portion of the die and conducts heat away from the die.