IP Library Granted Patent US 11,576,283
Granted Patent B2
US 11,576,283 · App. 17/229,624 · Granted Feb 7, 2023

Modular and highly available cooling distribution unit for information handling systems

Inventors: Yuan Chen (Shanghai, CN); Gemma Hui Chen (Shanghai, CN); Weidong Zuo (Shrewsbury, MA); Quanqing Zhu (Shanghai, CN)
Assignee: Dell Products L.P.
H05K7/20627H05K7/20172H05K7/20263H05K7/20272H05K7/20554H05K7/20781
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Quick Facts
Patent No.
US 11,576,283
App. No.
17/229,624
Filed
Apr 13, 2021
Granted
Feb 7, 2023
Kind
B2
Art Unit
2835
USPC
361/688
Abstract

A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.

Claims (48)

1. A liquid-to-air cooling distribution unit for a rack information handling system, wherein the cooling distribution unit comprises:

a heat exchange module configured to occupy a first region of a designated rack space, wherein the heat exchange module is fluidically coupled to one or more rack information handling resources and, wherein the heat exchange module includes:

a heat exchanger to dissipate heat from a liquid coolant; and

a fan assembly to move heated air in proximity to the heat exchanger;

a pair of redundant pump modules coupled to the heat exchange module and configured to occupy a second region of the designated rack space, wherein the pair of redundant pump modules include a first pump module and a second pump module, where each pump module is configured to circulate liquid coolant through the heat exchanger;

fluidic quick disconnects providing tool-less fluidic connections between liquid coolant conduits and the heat exchange module; and

electrical quick disconnects providing tool-less electrical connections between the heat exchange module and each pump module.

2. The cooling distribution unit of claim 1 , wherein the heat exchanger is configured to:

receive heated coolant from an inlet manifold fluidically coupled to one or more rack information handling resources; and

provide cooled coolant to an outlet manifold fluidically coupled to the one or more information handling resources.

3. The cooling distribution unit of claim 1 , wherein the fan assembly includes a plurality of fans configured to move air away from the heat exchanger.

4. The cooling distribution unit of claim 3 , wherein the plurality of fans are configured with N+1 redundancy.

5. The cooling distribution unit of claim 1 , wherein each pump module includes a circulating pump, a first liquid coolant conduit connected to a first port of the circulating pump and a second liquid coolant conduit connected to a second port of the circulating pump.

6. The cooling distribution unit of claim 1 , wherein each of the pump modules is hot serviceable.

7. A rack information handling system, comprising:

a server rack defining a plurality of 1U rack units suitable for receiving one or more information handling resources; and

a cooling distribution unit, wherein the cooling distribution unit comprises:

a heat exchange module configured to occupy a first portion of a designated rack space within the server rack, wherein the heat exchange module is fluidically coupled to one or more rack information handling resources and, wherein the heat exchange module includes:

a heat exchanger to dissipate heat from a liquid coolant; and

a fan assembly to move heated air in proximity to the heat exchanger;

a pair of redundant pump modules coupled to the heat exchange module and configured to occupy a second region of the designated rack space, wherein the pair of redundant pump modules include a first pump module and a second pump module, where each pump module is configured to circulate liquid coolant through the heat exchanger;

fluidic quick disconnects providing tool-less fluidic connections between liquid coolant conduits and the heat exchange module; and

electrical quick disconnects providing tool-less electrical connections between the heat exchange module and each pump module.

8. The rack information handling system of claim 7 , wherein the heat exchanger is configured to:

receive heated coolant from an inlet manifold fluidically coupled to one or more rack information handling resources; and

provide cooled coolant to an outlet manifold fluidically coupled to the one or more information handling resources.

9. The rack information handling system of claim 7 , wherein the fan assembly includes a plurality of fans configured to move air away from the heat exchanger.

10. The rack information handling system of claim 9 , wherein the plurality of fans are configured with N+1 redundancy.

11. The rack information handling system of claim 7 , wherein each pump module includes a circulating pump, a first liquid coolant conduit connected to a first port of the circulating pump and a second liquid coolant conduit connected to a second port of the circulating pump.

12. The rack information handling system of claim 7 , wherein each of the pump modules is hot serviceable.

13. The rack information handling system of claim 7 , wherein:

the rack information handling system includes a server rack defining a plurality of 1U rack units;

the designated rack space comprises N 1U rack units, wherein N is an integer greater than 1;

the heat exchange module is configured to occupy a forward portion of the N adjacent 1U rack units; and

each pump module is configured to occupy one half of a reward portion of the N adjacent 1U rack units.

14. The rack information handling system of claim 13 , wherein the pair of redundant pump modules are arranged with the first pump module over the second pump module, wherein each of the pump module has a vertical dimension of N/2 1U rack units.

15. The rack information handling system of claim 13 , wherein the pair of redundant pump modules are arranged with the first pump module alongside the second pump module, wherein each of the pump module has a vertical dimension of N 1U rack units.

16. A liquid-to-air cooling distribution unit for a rack information handling system, wherein the cooling distribution unit comprises:

a heat exchange module configured to occupy a first region of a designated rack space, wherein the heat exchange module is fluidically coupled to one or more rack information handling resources and, wherein the heat exchange module includes:

a heat exchanger to dissipate heat from a liquid coolant; and

a fan assembly to move heated air in proximity to the heat exchanger; and

a pair of redundant pump modules coupled to the heat exchange module and configured to occupy a second region of the designated rack space, wherein the pair of redundant pump modules include a first pump module and a second pump module, where each pump module is configured to circulate liquid coolant through the heat exchanger, wherein:

the rack information handling system includes a server rack defining a plurality of 1U rack units;

the designated rack space comprises N 1U rack units, wherein N is an integer greater than 1;

the heat exchange module is configured to occupy a forward portion of the N adjacent 1U rack units; and

each pump module is configured to occupy one half of a reward portion of the N adjacent 1U rack units.

17. The cooling distribution unit of claim 16 , wherein the pair of redundant pump modules are arranged with the first pump module over the second pump module, wherein each of the pump module has a vertical dimension of N/2 1U rack units.

18. The cooling distribution unit of claim 16 , wherein the pair of redundant pump modules are arranged with the first pump module alongside the second pump module, wherein each of the pump module has a vertical dimension of N 1U rack units.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2021
From: CHEN, YUAN; CHEN, GEMMA HUI; ZUO, WEIDONG; ZHU, QUANQING
To: DELL PRODUCTS L.P.
Reel/Frame 055907/0888 →
Continuity (1)
Related Publication 20220330459A1 · Oct 13, 2022
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