PLUGGABLE OPTICAL MODULE CAGE FOR FIXED HEAT SINK
An electronic module cage for receiving an electronic module (such as a pluggable optical module (POM)), includes a cage body mounted to a printed circuit board (PCB), the cage body having a first opening configured to receive an electronic module, the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the electronic module in a direction away from the printed circuit board and toward a heat dissipating element such that a surface of the electronic module contacts the heat dissipating element through a second opening in the cage body.
1 . An electronic module cage for receiving an electronic module (such as a pluggable optical module (POM)), comprising:
a cage body mounted to a printed circuit board (PCB), the cage body having a first opening configured to receive an electronic module, the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the electronic module in a direction away from the printed circuit board and toward a heat dissipating element such that a surface of the electronic module contacts the heat dissipating element through a second opening in the cage body.
2 . The electronic module cage of claim 1 , wherein the spring feature biases a heat generating surface of the electronic module directly adjacent the heat dissipating element.
3 . The electronic module cage of claim 1 , wherein the heat dissipating element comprises a heat sink solidly affixed to the printed circuit board to which the cage body is mounted.
4 . The electronic module cage of claim 1 , further comprising an additional cage body mounted to the circuit board alongside the cage body, the additional cage body having a first opening configured to receive an additional electronic module (POM), the additional cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the additional electronic module in a direction away from the printed circuit board and toward the heat dissipating element such that a surface of the additional electronic module contacts the heat dissipating element through a second opening in the additional cage body, the heat dissipating element configured to simultaneously dissipate heat from the electronic module and from the additional electronic module.
5 . The electronic module cage of claim 1 , wherein the heat dissipating element comprises a housing in which the cage body is mounted, the housing having a portion that extends or protrudes through the second opening in the cage body.
6 . The electronic module cage of claim 1 , wherein the printed circuit board (PCB) and the heat dissipating element are located on opposing surfaces of the electronic module cage.
7 . The electronic module cage of claim 1 , wherein the heat dissipating element is a heatsink with at least one active cooling feature.
8 . An electronic module cage for receiving an electronic module (such as a pluggable optical module (POM)), comprising:
a cage body mounted to a printed circuit board (PCB), the cage body having a first opening configured to receive an electronic module, the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure in a direction away from the printed circuit board and toward a heat dissipating element, the heat dissipating element having a portion that extends or protrudes through a second opening in a surface of the cage body.
9 . The electronic module cage of claim 8 , wherein the spring feature biases a heat generating surface of the electronic module directly adjacent the heat dissipating element.
10 . The electronic module cage of claim 8 , wherein the heat dissipating element comprises a heat sink solidly affixed to the printed circuit board to which the cage body is mounted.
11 . The electronic module cage of claim 8 , further comprising an additional cage body mounted to the circuit board alongside the cage body, the additional cage body having a first opening configured to receive an additional electronic module (POM), the additional cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the additional electronic module in a direction away from the printed circuit board and toward the heat dissipating element such that a surface of the additional electronic module contacts the heat dissipating element through a second opening in the additional cage body, the heat dissipating element configured to simultaneously dissipate heat from the electronic module and from the additional electronic module.
12 . The electronic module cage of claim 8 , wherein the heat dissipating element comprises a housing in which the cage body is mounted, the housing having a portion that extends or protrudes through the second opening in the cage body.
13 . The electronic module cage of claim 8 , wherein the printed circuit board (PCB) and the heat dissipating element are located on opposing surfaces of the electronic module cage.
14 . The electronic module cage of claim 8 , wherein the heat dissipating element is a heatsink with at least one active cooling feature.
15 . An electronic assembly, comprising:
a printed circuit board (PCB) having an electronic module cage mounted thereon, the printed circuit board (PCB) having a heat dissipating element mounted thereon;
the electronic module cage having a cage body having a first opening configured to receive an electronic module (such as a pluggable optical module (POM)), the cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the electronic module in a direction away from the printed circuit board (PCB) and toward the heat dissipating element such that a surface of the electronic module directly contacts the heat dissipating element through a second opening in the cage body.
16 . The electronic assembly of claim 15 , wherein the spring feature biases a heat generating surface of the electronic module directly adjacent the heat dissipating element.
17 . The electronic assembly of claim 15 , wherein the heat dissipating element comprises a heat sink solidly affixed to the printed circuit board to which the cage body is mounted.
18 . The electronic assembly of claim 15 , further comprising an additional cage body mounted to the circuit board alongside the cage body, the additional cage body having a first opening configured to receive an additional electronic module (POM), the additional cage body comprising a spring feature, the spring feature configured to apply a biasing pressure to the additional electronic module in a direction away from the printed circuit board and toward the heat dissipating element such that a surface of the additional electronic module contacts the heat dissipating element through a second opening in the additional cage body, the heat dissipating element configured to simultaneously dissipate heat from the electronic module and from the additional electronic module.
19 . The electronic assembly of claim 15 , wherein the heat dissipating element comprises a housing in which the cage body is mounted, the housing having a portion that extends or protrudes through the second opening in the cage body.
20 . The electronic assembly of claim 15 , wherein the printed circuit board (PCB) and the heat dissipating element are located on opposing surfaces of the electronic module cage.
21 . The electronic assembly of claim 15 , wherein the heat dissipating element is a heatsink with at least one active cooling feature.