IP Library Granted Patent US 11,640,190
Granted Patent B2
US 11,640,190 · App. 17/230,627 · Granted May 2, 2023

Liquid-assisted air cooling design with parallel cold plates and serial pumps

Inventors: Weidong Zuo (Shrewsbury, MA); Gemma Hui Chen (Shanghai, CN); Xiaoliang Zhou (Shanghai, CN); Mingming Zhang (Shanghai, CN); Jie Yang (Shanghai, CN)
Assignee: Dell Products L.P.
G06F1/20H05K7/20254H05K7/20263H05K7/20272H05K7/20509G06F2200/201
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Quick Facts
Patent No.
US 11,640,190
App. No.
17/230,627
Filed
Apr 14, 2021
Granted
May 2, 2023
Kind
B2
Art Unit
2835
USPC
361/679.46
Abstract

An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.

Claims (40)

1. An information handling system, comprising:

a pair of heat-generating information handling devices, including a first device and a second device; and

a liquid-assisted air cooling (LAAC) assembly to dissipate heat generated by at least one of the first device and the second device, wherein the LAAC assembly includes:

a radiator to convert hot coolant received at a radiator inlet to cold coolant provided to a radiator outlet;

a first pump and a second pump connected in series with the radiator wherein:

a first pump outlet is fluidically coupled to the radiator inlet; and

a second pump inlet is fluidically coupled to the radiator outlet;

a first cold plate, thermally coupled to the first device, and a second cold plate, thermally coupled to the second device, wherein the first cold plate includes a first cold plate housing defining a first device cavity engaging the first device and wherein the second cold plate includes a second cold plate housing defining a second device cavity engaging the second device, wherein the first and second cold plates are connected in parallel between a first pump inlet and a second pump outlet.

2. The information handling system of claim 1 , wherein:

a first cold plate outlet and a second cold plate outlet are both fluidically coupled to an inlet of the first pump; and a first cold plate inlet and a second cold plate inlet are both fluidically coupled to an outlet of the second pump.

3. The information handling system of claim 1 , wherein:

the first pump outlet is fluidically coupled to the radiator inlet exclusively;

the second pump inlet is fluidically coupled to the radiator outlet exclusively;

the cold plate outlets are fluidically coupled to the first pump inlet exclusively; and

the cold plate inlets are fluidically coupled to the second pump outlet exclusively.

4. The information handling system of claim 1 , wherein the LAAC assembly further includes:

a fan assembly including one or more fans to exchange hot air in proximity to the radiator for cold air.

5. The information handling system of claim 1 , wherein the first device and the second device are first and second components of a rack information handling resource and further wherein the rack information handling system is configured to occupy one or more rack units of a server rack.

6. The information handling system of claim 5 , wherein the rack information handling resource comprises a dual socket rack server and wherein the first device comprises a first central processing unit (CPU) of the dual socket rack server and the second device comprise a second CPU of the dual socket rack server.

7. The information handling system of claim 1 , wherein heated coolant from both cold plates is provided to the first pump inlet and neither cold plate receives heated coolant from the other cold plate.

8. The information handling system of claim 1 , wherein the first and second pumps are redundant wherein the second pump is configured to circulate coolant through the liquid cooling assembly when the first pump is non-functional and the first pump is configured to circulate coolant through the liquid cooling assembly when the second pump is non-functional.

9. A liquid-assisted air cooling (LAAC) assembly to cool heat-generating devices in an infoiniation handling system, wherein the LAAC assembly comprises:

a radiator to convert hot coolant received at a radiator inlet to cold coolant provided to a radiator outlet;

a first pump and a second pump connected in series with the radiator wherein:

a first pump outlet is fluidically coupled to the radiator inlet; and

a second pump inlet is fluidically coupled to the radiator outlet;

a first cold plate including a first cold plate housing defining a first device cavity to engage a first heat-generating device, and a second cold plate including a first cold plate housing defining a first device cavity to engage a second heat-generating device, wherein the first and second cold plates are connected in parallel between a first pump inlet and a second pump outlet.

10. The assembly of claim 9 , wherein:

a first cold plate outlet and a second cold plate outlet are both fluidically coupled to an inlet of the first pump; and a first cold plate inlet and a second cold plate inlet are both fluidically coupled to an outlet of the second pump.

11. The assembly of claim 9 , wherein:

the first pump outlet is fluidically coupled to the radiator inlet exclusively;

the second pump inlet is fluidically coupled to the radiator outlet exclusively;

the cold plate outlets are fluidically coupled to the first pump inlet exclusively; and

the cold plate inlets are fluidically coupled to the second pump outlet exclusively.

12. The assembly of claim 9 , wherein the LAAC assembly further includes:

a fan assembly including one or more fans to exchange hot air in proximity to the radiator for cold air.

13. The assembly of claim 9 , wherein the first heat-generating device and the second heat-generating device are first and second components of a rack information handling resource and further wherein the rack information handling system is configured to occupy one or more rack units of a server rack.

14. The assembly of claim 13 , wherein the rack information handling resource comprises a dual socket rack server and wherein the first heat-generating device comprises a first central processing unit (CPU) of the dual socket rack server and the second heat-generating device comprise a second CPU of the dual socket rack server.

15. The assembly of claim 9 , wherein heated coolant from both cold plates is provided to the first pump inlet and neither cold plate receives heated coolant from the other cold plate.

16. The assembly of claim 9 , wherein the first and second pumps are redundant wherein the second pump is configured to circulate coolant through the liquid cooling assembly when the first pump is non-functional and the first pump is configured to circulate coolant through the liquid cooling assembly when the second pump is non-functional.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 14, 2021
From: ZUO, WEIDONG; CHEN, GEMMA HUI; ZHOU, XIAOLIANG; ZHANG, MINGMING; YANG, JIE
To: DELL PRODUCTS L.P.
Reel/Frame 055920/0656 →
Continuity (1)
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