IP Library Granted Patent US 11,569,602
Granted Patent B2
US 11,569,602 · App. 17/232,482 · Granted Jan 31, 2023

Flexible input output mounting for solder joint stress reduction

Inventors: David W. Grunow (Round Rock, TX); Michael Kotson (Georgetown, TX)
Assignee: Dell Products L.P.
H01R12/91G06F1/183H01R12/707H01R12/7047H01R12/722
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Quick Facts
Patent No.
US 11,569,602
App. No.
17/232,482
Granted
Jan 31, 2023
Kind
B2
Abstract

A system and flexible mounting structure for solder joint stress reduction are disclosed that provide flexibility on a printed circuit board that includes an input output (I/O) connector when wrenching or torque forces are applied. A bracket supporting the connector is mounted on one side of the PCB, and a hinge saddle structure is mounted on the other side of the PCB. A bottom structure is connected to the hinge saddle structure by screw bosses. The bottom structure and the hinge saddle structure are connected to a chassis of an information handling system. An area of the PCB as defined by the bracket is provided flexibility when forces are applied.

Claims (32)

1. A flexible mounting structure for solder joint stress reduction comprising:

a printed circuit board (PCB);

a bracket mounted on one side of the PCB supporting a connector;

a hinge saddle structure mounted on the other side of the PCB, wherein the hinge saddle structure is attached to a chassis of an information handling system; and

a bottom structure attached to the chassis of the information handling system, connected to the hinge saddle structure by screw bosses, wherein an area of the PCB as defined by the bracket is provided flexibility when forces are applied.

2. The flexible mounting structure claim 1 further comprising through holes on the PCB for screw bosses that connect the hinge saddle structure to the bracket, providing the flexibility when forces are applied.

3. The flexible mounting structure claim 1 , wherein the connector is one of multiple input output (I/O) types.

4. The flexible mounting structure claim 1 , wherein the hinge saddle structure is attached to a structure of the chassis.

5. The flexible mounting structure claim 1 , wherein the information handling system is a laptop computer.

6. The flexible mounting structure claim 1 further comprising a cut out section of the PCB to form a flexible region.

7. The flexible mounting structure claim 6 , wherein the flexible region comprises a space for connector specific components and a flex zone.

8. An information handing system printed circuit board (PCB) comprising:

an input output (I/O) connector mounted on the PCB;

a bracket supporting the connector mounted on one side of the PCB; and

a hinge saddle structure mounted on the other side of the PCB,

wherein the hinge saddle structure is attached to a chassis of an information handling system,

wherein the hinge saddle structure is connected by screw bosses to a bottom structure of the chassis, and

wherein an area of the PCB as defined by the bracket is provided flexibility when forces are applied.

9. The PCB of claim 8 further comprising through holes on the PCB for screw bosses that connect the hinge saddle structure to the bracket, providing the flexibility when forces are applied.

10. The PCB of claim 8 , wherein the connector is one of multiple input output (I/O) types.

11. The PCB claim 8 , wherein the wherein the hinge saddle structure is attached to a structure of the chassis.

12. The PCB of claim 8 , wherein the information handling system is a laptop computer.

13. The PCB of claim 8 further comprising a cut out section of the PCB to form a flexible region.

14. The PCB of claim 13 , wherein the flexible region comprises a space for connector specific components and a flex zone.

15. An information handling system chassis comprising:

a hinge saddle structure attached to the chassis, wherein the hinge saddle is mounted on one side of a printed circuit board (PCB) and a bracket supporting a connector is attached on the other side of the PCB; and

a bottom structure attached to the chassis, connected to the hinge saddle structure by screw bosses, wherein an area of the PCB as defined by the bracket is provided flexibility when forces are applied.

16. The chassis of claim 15 further comprising through holes on the PCB for screw bosses that connect the hinge saddle structure to the bracket, providing the flexibility when forces are applied.

17. The chassis of claim 15 , wherein the connector is one of multiple input output (I/O) types.

18. The chassis of claim 15 , wherein the information handling system is a laptop computer.

19. The chassis of claim 15 , wherein the PCB comprises a cut out section that forms a flexible region.

20. The chassis of claim 19 , wherein the flexible region comprises a space for connector specific components and a flex zone.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2021
From: GRUNOW, DAVID W.; KOTSON, MICHAEL
To: DELL PRODUCTS L.P.
Reel/Frame 055942/0624 →
Continuity (1)
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