Cooling computing modules of a rack-mountable tray
An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a cold fluid intake and a warm fluid return, wherein each computing module of the plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of one or more of the bays of the plurality of bays; and a fluid circulation system positioned within the tray and coupled to the cold fluid intake and the warm fluid return of each of the bays, the fluid circulation system introducing, for each bay that a respective computing module is engaged with, fluid within the computing module via the cold fluid intake of each bay and returning warm fluid via the warm fluid return of each bay to transfer heat from the computing modules.
1. An information handling system, comprising:
a plurality of computing modules, each computing module of the plurality of computing modules including a thermal plate;
a rack-mountable tray including:
a plurality of bays and a plurality of thermal pads, each bay of the plurality of bays including i) a respective thermal pad of the plurality of thermal pads, ii) a cold fluid intake, and iii) a warm fluid return, wherein each computing module of the plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of a respective bay of the plurality of bays, and the thermal plate of the computing module is in thermal communication with the thermal pad of the respective bay to transfer heat from the thermal plate of the computing module to the thermal pad of the respective bay; and
a fluid circulation system positioned within the rack-mountable tray, the fluid circulation system including a cold fluid intake line coupled to the cold fluid intake of each of the plurality of bays and a warm fluid return line coupled to the warm fluid return of each of the plurality of bays, the fluid circulation system;
introducing, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, a fluid within the computing module via the cold fluid intake of the bay to transfer heat from components of the computing module to the fluid and transfer heat from the fluid to the thermal plate of the computing module and returning warm fluid via the warm fluid return of the bay, and
circulating, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, additional fluid via the cold fluid intake line proximate to the thermal pad of the bay to transfer heat from the thermal pad to the additional fluid and return the additional fluid via the warm fluid return line.
2. The information handling system of claim 1 , wherein each of the plurality of bays further includes one or more interconnects for engaging with the respective computing module of the plurality of computing modules.
3. The information handling system of claim 2 , wherein the rack-mountable tray further includes a data delivery system and a power delivery system, wherein the interconnects couple the plurality of computing modules with the data delivery system and the power delivery system.
4. The information handling system of claim 1 , wherein the fluid is a water-based fluid.
5. The information handling system of claim 1 , further including an air circulation system coupled to the rack-mountable tray to further transfer heat from the plurality of computing modules.
6. The information handling system of claim 1 , wherein a particular computing module of the plurality of computing modules is engaged with at least two bays of the plurality of bays.
7. An apparatus, comprising:
a rack-mountable tray, including:
a plurality of bays and a plurality of thermal pads, each bay of the plurality of bays including i) a respective thermal pad of the plurality of thermal pads, ii) a cold fluid intake, and iii) a warm fluid return, wherein each computing module of a plurality of computing modules is engaged with the cold fluid intake and the warm fluid return of a respective bay of the plurality of bays, and a thermal plate of the computing module is in thermal communication with the thermal pad of the respective bay to transfer heat from the thermal plate of the computing module to the thermal pad of the respective bay; and
a fluid circulation system positioned with in the rack-mountable tray, the fluid circulation system including a cold fluid intake line coupled to the cold fluid intake of each of the plurality of bays and a warm fluid return line coupled to the warm fluid return of each of the plurality of bays, the fluid circulation system:
introducing, for each bay that a respective computing module of the plurality of computing modules is engaged with, a fluid within the computing module via the cold fluid intake of the bay to transfer heat from components of the computing module to the fluid and transfer heat from the fluid to the thermal plate of the computing module and returning warm fluid via the warm fluid return of the bay, and
circulating, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, additional fluid via the cold fluid intake line proximate to the thermal pad of the bay to transfer heat from the thermal pad to the additional fluid and return the additional fluid via the warm fluid return line.
8. The apparatus of claim 7 , wherein each of the plurality of bays further includes one or more interconnects for engaging with the respective computing module of the plurality of computing modules.
9. The apparatus of claim 8 , wherein the rack-mountable tray further includes a data delivery system and a power delivery system, wherein the interconnects couple the plurality of computing modules with the data delivery system and the power delivery system.
10. The apparatus of claim 7 , wherein the fluid is a water-based fluid.
11. The apparatus of claim 7 , wherein the fluid is a dielectric-based fluid.
12. The apparatus of claim 7 , further including an air circulation system coupled to the rack-mountable tray to further transfer heat from the plurality of computing modules.
13. The apparatus of claim 7 , wherein a particular computing module of the plurality of computing modules is engaged with at least two bays of the plurality of bays.
14. A method of cooling a plurality of computing modules, comprising:
engaging each computing module of the plurality of computing modules with a respective bay of a plurality of bays of a rack mountable tray, including engaging each computing module of the plurality of computing modules with a cold fluid intake and a warm fluid return of the respective bay, such that, for each computing module, a thermal plate of the computing module is positioned proximate to a thermal pad of the respective bay to place the thermal pad of the respective bay in thermal communication with the thermal plate of the computing module to transfer heat form the thermal plate of the computing module to thermal pad of the respective bay;
introducing fluid, for each computing module of the plurality of computing modules, within the computing module via the cold fluid intake of the respective bay that is engaged with the computing module and coupled to a cold fluid intake line to transfer heat from components of the computing module to the fluid and transfer heat from the fluid to the thermal plate of the computing module and returning warm fluid via the warm fluid return of the respective bay that is engaged with the computing module and coupled to a warm fluid return line; and
circulating, for each bay of the plurality of bays that a respective computing module of the plurality of computing modules is engaged with, additional fluid via the cold fluid intake line proximate to the thermal pad of the bay to transfer heat from the thermal pad to the additional fluid and return the additional fluid via the warm fluid return line.
15. The method of claim 14 , wherein engaging each computing module of the plurality of computing modules with a respective bay of the plurality of bays further includes engaging each computing module of the plurality of computing modules with one or more interconnects of the respective bay.
16. The method of claim 15 , wherein engaging each computing module of the plurality of computing modules with one or more interconnects of the respective bay further includes coupling each computing module of the plurality of computing modules with a data delivery system and a power delivery system through the interconnects.
17. The method of claim 14 , wherein the fluid is a water-based fluid.
18. The method of claim 14 , wherein the fluid is a dielectric-based fluid.
19. The method of claim 14 , further including circulating air over the plurality of computing modules to further transfer heat from the plurality of computing modules.
20. The method of claim 14 , wherein engaging each computing module of the plurality of computing modules with one or more bays further includes engaging a particular computing module of the plurality of computing modules with at least two bays of the plurality of bays.