IP Library Granted Patent US 11,596,073
Granted Patent B2
US 11,596,073 · App. 17/237,202 · Granted Feb 28, 2023

Electronic equipment that provides multi-function slots

Inventors: Kunzheng Zhang (Shanghai, CN); Sandburg Hu (Shanghai, CN); Aric Hadav (Tel Aviv, IL); Xiang Yu (Shanghai, CN); Yuxin Chen (Shanghai, CN)
Assignee: EMC IP Holding Company LLC
H05K5/0069H05K5/026H05K5/0291H05K7/1435
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Quick Facts
Patent No.
US 11,596,073
App. No.
17/237,202
Filed
Apr 22, 2021
Granted
Feb 28, 2023
Kind
B2
Art Unit
2841
USPC
361/736
Abstract

An electronic equipment assembly has an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors, and a chassis coupled with the interconnect. The chassis provides slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices. At least one column of the columns of signal conductors of the interconnect is a multi-function column. Each multi-function column is constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column.

Claims (71)

1. Electronic equipment assembly, comprising:

an interconnect including columns of signal conductors;

connectors mounted to the columns of signal conductors;

a chassis coupled with the interconnect, the chassis providing slots that guide resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices, at least one column of the columns of signal conductors of the interconnect being a multi-function column, each multi-function column being constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column; and

a set of paddle cards, each paddle card having a first edge to connect with a resource device and a second edge to connect with a connector mounted to a multi-function column of the interconnect;

wherein the first edge of each paddle card provides a first connection form factor that complies with the Open Compute Project (OCP) 3.0 Specification; and

wherein the second edge of each paddle card provides a second connection form factor that complies with the Enterprise and Data Center Solid State Device Form Factor (EDSFF) E3 Specification.

2. Electronic equipment assembly as in claim 1 wherein the slots provided by the chassis extend from an interior location to a front opening provided by the chassis;

wherein the interconnect is disposed at the interior location; and

wherein at least some of the resource devices are constructed and arranged to slide within the slots to engage the connectors mounted to the columns of signal conductors of the interconnect.

3. Electronic equipment assembly as in claim 2 wherein the interconnect is a midplane having a front side facing the front opening provided by the chassis and a rear side facing a rear opening provided by the chassis; and

wherein the chassis is constructed and arranged to guide other devices into engagement with other connectors mounted to the front side of the midplane.

4. Electronic equipment assembly as in claim 1 wherein the columns of signal conductors of the interconnect are arranged in a row; and

wherein the columns of signal conductors includes a first multi-function column adjacent a first end of the row, and a second multi-function column adjacent a second end of the row that is opposite the first end of the row.

5. Electronic equipment assembly as in claim 4 wherein the columns of signal conductors further includes single-function columns residing between the first multi-function column and the second multi-function column; and

wherein each multi-function column is constructed and arranged to electronically access a single type of resource devices through a respective connector mounted to that single-function column.

6. Electronic equipment assembly as in claim 1 wherein each multi-function column is constructed and arranged to provide dual-host access to a resource device when that resource device engages a respective connector mounted to the that multi-function column.

7. Electronic equipment assembly as in claim 6 wherein the different types of resource devices includes:

a data storage type of resource device, as a first type of resource device, the data storage type of resource device including a first physical port to provide a first storage controller with access to storage space and a second physical port to provide a second storage controller with access to the storage space, and

a data processing type of resource device, as a second type of resource device, the data processing type of resource device including a first physical port through which to process data for the first storage controller and a second physical port through which to process data for the second storage controller.

8. Electronic equipment assembly as in claim 1 wherein the different types of resource devices includes:

a non-volatile memory type of resource device, as a first type of resource device, the non-volatile memory type of resource device being constructed and arranged to store data in a non-volatile memory space,

a mirroring type of resource device, as a second type of resource device, the mirroring type of resource device being constructed and arranged to coordinate data mirroring operations between storage controllers, and

a compression type of resource device, as a third type of resource device, the compression type of resource device being constructed and arranged to perform data compression operations,

the non-volatile memory type of resource device, the mirroring type of resource device, and the compression type of resource device being different from each other.

9. Electronic equipment assembly as in claim 8 wherein each resource device of the non-volatile memory type has a first length;

wherein each resource device of the mirroring type has a second length that is shorter than the first length;

wherein each resource device of the compression type has the second length that is shorter than the first length; and

wherein at least one each paddle card is constructed and arranged to provide extension that extends a resource device having the second length to the first length.

10. Electronic equipment assembly as in claim 1 wherein each paddle card further includes:

a plurality of conductors extending between the first edge and the second edge to convey a plurality of signals when a resource device connects with the first edge and a connector mounted to a multi-function column of the interconnect connects with the second edge.

11. Electronic equipment assembly as in claim 10 wherein the first edge of each paddle card has a first conductor mapping;

wherein the second edge of each paddle card has a second conductor mapping that is different from the first conductor mapping; and

wherein the plurality of conductors of each paddle card remaps the first conductor mapping to the second conductor mapping.

12. Electronic equipment assembly as in claim 10 wherein each paddle card further includes:

a hot-swap controller interconnected between the first edge and the second edge of that paddle card, the hot-swap controller being constructed and arranged to electronically couple a resource device connected to the first edge to a connector mounted to a multi-function column of the interconnect at the second edge while the interconnect is live.

13. Electronic equipment assembly as in claim 10 wherein the first edge of each paddle card has a first conductor mapping;

wherein the second edge of each paddle card has a second conductor mapping that is different from the first conductor mapping;

wherein the plurality of conductors of each paddle card remaps the first conductor mapping to the second conductor mapping;

wherein each paddle card further includes:

a hot-swap controller interconnected between the first edge and the second edge of that paddle card, the hot-swap controller being constructed and arranged to electronically couple a resource device connected to the first edge to a connector mounted to a multi-function column of the interconnect at the second edge while the interconnect is live.

14. Electronic equipment assembly as in claim 1 wherein the interconnect is a midplane having a front side facing the front opening provided by the chassis and a rear side facing a rear opening provided by the chassis;

wherein the connectors mount on the front side of the midplane; and

wherein a set of storage controllers connect with the rear side of the midplane.

15. Data storage system, comprising:

a set of storage controllers;

resource devices; and

an electronic equipment assembly that couples with the set of storage controllers and the resource devices, the electronic equipment assembly including:

an interconnect including columns of signal conductors, connectors mounted to the columns of signal conductors,

a chassis coupled with the interconnect, the chassis providing slots that guide the resource devices into engagement with the connectors mounted to the columns of signal conductors to enable the interconnect to electronically access the resource devices, at least one column of the columns of signal conductors of the interconnect being a multi-function column, each multi-function column being constructed and arranged to electronically access different types of resource devices through a respective connector mounted to that multi-function column; and

a set of paddle cards, each paddle card having a first edge to connect with a resource device and a second edge to connect with a connector mounted to a multi-function column of the interconnect;

wherein the first edge of each paddle card provides a first connection form factor that complies with the Open Compute Project (OCP) 3.0 Specification; and

wherein the second edge of each paddle card provides a second connection form factor that complies with the Enterprise and Data Center Solid State Device Form Factor (EDSFF) E3 Specification.

16. Data storage system as in claim 15 wherein the interconnect of the electronic equipment assembly is a midplane having a front side facing the front opening provided by the chassis and a rear side facing a rear opening provided by the chassis;

wherein the connectors mount on the front side of the midplane; and

wherein a set of storage controllers connect with the rear side of the midplane.

17. A method, comprising:

installing a set of electronic controllers within an electronic equipment assembly that provides one or more multi-function slots;

installing one or more resource devices within the one or more multi-function slots provided by the electronic equipment assembly;

providing power to the electronic equipment assembly to operate the set of electronic controllers and the one or more resource devices installed within the one or more multi-function slots; and

installing a set of paddle cards within the electronic equipment assembly, each paddle card having a first edge to connect with a resource device and a second edge to connect with a connector mounted to a multi-function column of the interconnect;

wherein the first edge of each paddle card provides a first connection form factor that complies with the Open Compute Project (OCP) 3.0 Specification; and

wherein the second edge of each paddle card provides a second connection form factor that complies with the Enterprise and Data Center Solid State Device Form Factor (EDSFF) E3 Specification.

18. A method as in claim 17 wherein the interconnect of the electronic equipment assembly is a midplane having a front side facing the front opening provided by the chassis and a rear side facing a rear opening provided by the chassis;

wherein the connectors mount on the front side of the midplane; and

wherein the set of storage controllers install on the rear side of the midplane.

19. A method as in claim 17 wherein installing the one or more resource devices includes:

connecting an edge of a resource device with a portion of a paddle card, and

inserting the resource device within the electronic equipment assembly while the edge of the resource device is connected with the portion of a paddle card, the paddle card being installed contemporaneously with the resource device.

20. A method as in claim 17 wherein installing the set of paddle cards includes:

inserting a paddle card within the electronic equipment assembly while a portion of the paddle card is connected with an edge of the resource device, the resource device being installed contemporaneously with the paddle card.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0280) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0255 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0124) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062022/0012 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (056295/0001) Recorded Jun 10, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 062021/0844 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058297/0332 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0124 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0001 →
SECURITY INTEREST Recorded May 19, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 056295/0280 →
CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING PATENTS THAT WERE ON THE ORIGINAL SCHEDULED SUBMITTED BUT NOT ENTERED PREVIOUSLY RECORDED AT REEL: 056250 FRAME: 0541. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 17, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056311/0781 →
SECURITY AGREEMENT Recorded May 14, 2021
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 056250/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2021
From: ZHANG, KUNZHENG; HU, SANDBURG; HADAV, ARIC; YU, XIANG; CHEN, YUXIN
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 056199/0101 →