Ejection head having optimized fluid ejection characteristics

1. An ejection head for a fluid ejection device, the ejection head comprising:

a plurality of first fluid ejectors and a plurality of second fluid ejectors deposited on a semiconductor substrate;

a first flow feature layer attached to the semiconductor substrate providing a plurality of first fluid supply channels and a plurality of first fluid chambers in the first flow feature layer for the plurality of first fluid ejectors and a first portion of second fluid channel and second fluid chambers for the plurality of second fluid ejectors;

a second flow feature layer laminate laminated to the first flow feature layer providing a first portion of first nozzle holes therein adjacent to the plurality of first fluid chambers and a second portion of second fluid supply channels and second fluid chambers therein for the plurality of second fluid ejectors;

a first nozzle plate layer laminate laminated to the second flow feature layer providing a second portion of the first nozzle holes therein adjacent to the plurality of first fluid chambers and a first portion of second nozzle holes therein adjacent to the plurality of second fluid chambers; and

a second nozzle plate layer laminate laminated to the first nozzle plate layer providing a second portion of the second nozzle holes therein adjacent to the plurality of second fluid chambers.

2. The ejection head of claim 1 , wherein the second fluid ejectors and nozzle holes are configured to eject a volume of fluid that is from about 2 to about 6 times greater than the volume of fluid configured to be ejected by the plurality of first fluid ejectors through the first nozzle holes.

3. The ejection head of claim 1 , wherein the first flow feature layer is derived from a first photoresist material layer having a thickness ranging from about 10 to about 20 microns.

4. The ejection head of claim 1 , wherein the second flow feature layer laminate is derived from a second photoresist material layer having a thickness ranging from about 1 to about 10 microns.

5. The ejection head of claim 1 , wherein the first nozzle plate layer laminate is derived from a third photoresist material layer having a thickness ranging from about 5 to about 30 microns.

6. The ejection head of claim 1 , wherein the second nozzle plate laminate layer is derived from a fourth photoresist material layer having a thickness ranging from about 5 to about 30 microns.

7. The ejection head of claim 1 , wherein the ejection head is attached to a fluid cartridge for a fluid ejection device, wherein the fluid cartridge contains at least two different fluids.

8. A method of making an ejection head, the method comprising:

providing a semiconductor substrate having a plurality of fluid ejectors thereon;

applying a first fluid flow layer to the semiconductor substrate;

imaging and developing first fluid channels and first fluid chambers in the first fluid flow layer for a plurality of first fluid ejectors and a portion of second fluid channels and second fluid chambers therein for a plurality of second fluid ejectors;

etching a fluid supply via through the semiconductor substrate;

laminating a second fluid flow layer laminate to the first fluid flow layer;

imagining and developing a first portion of first nozzle holes therein adjacent to the first fluid chambers and a second portion of the second fluid channels and the second fluid chambers in the second fluid flow layer laminate for the plurality of second fluid ejectors;

laminating a first nozzle plate layer laminate to the second fluid flow layer laminate;

imaging and developing the first nozzle plate layer laminate to provide a second portion of the first nozzle holes therein adjacent to the fluid chambers and a first portion of second nozzle holes therein adjacent to the second fluid chambers;

laminating a second nozzle plate layer laminate to the first nozzle plate layer laminate; and

imaging and developing the second nozzle plate layer laminate to provide a second portion of the second nozzle holes therein adjacent to the second fluid chambers,

wherein a volume of fluid ejected by the plurality of second fluid ejectors through the plurality of second nozzle holes is from about 2 to about 6 times greater than the volume of fluid ejected by the plurality of first fluid ejector through the plurality of first nozzle holes.

9. The method of claim 8 , wherein the first fluid flow layer is a photoresist material that is spun on to the semiconductor substrate.

10. The method of claim 8 , wherein the second fluid flow layer laminate is derived from a second photoresist material layer having a thickness ranging from about 1 to about 10 microns.

11. The method of claim 8 , wherein the first nozzle plate layer laminate is derived from a third photoresist material layer having a thickness ranging from about 5 to about 30 microns.

12. The method of claim 8 wherein the second nozzle plate layer laminate is derived from a fourth photoresist material layer having a thickness ranging from about 5 to about 30 microns.

13. An ejection head comprising:

a semiconductor substrate containing a first plurality of fluid ejectors and a second plurality of fluid ejectors thereon, a flow feature layer attached to the semiconductor substrate, and a nozzle plate laminated to the flow feature layer,

wherein the flow feature layer comprises:

a first plurality of fluid supply channels and a first plurality of fluid chambers associated with the first plurality of fluid ejectors, and

a second plurality of fluid supply channels and a second plurality of fluid chambers associated with the second plurality of fluid ejectors, and

wherein the flow feature layer comprises a first flow feature layer derived from a photoresist material attached to the semiconductor substrate and a second flow feature layer laminate derived from a photoresist material laminated to the first flow feature layer; and

the nozzle plate layer comprises:

a first plurality of nozzle holes associated with the first plurality of fluid chambers and a second plurality of nozzle holes associated with the second plurality of fluid chambers,

wherein the nozzle plate layer comprises a first nozzle plate layer laminate laminated to the second flow feature layer and a second nozzle plate layer laminate laminated to the first nozzle plate layer laminate; and

wherein a volume of fluid ejected by the second plurality of nozzle holes is from about 2 to about 6 times greater than the volume of fluid ejected by the first plurality of first nozzle holes.

14. The multi-fluid ejection head of claim 13 , wherein the first flow feature layer has a thickness ranging from about 10 to about 20 microns.

15. The multi-fluid ejection head of claim 13 , wherein the second flow feature layer laminate has a thickness ranging from about 1 to about 10 microns.

16. The multi-fluid ejection head of claim 15 , wherein the first nozzle plate layer laminate has a thickness ranging from about 5 to about 30 microns.

17. The multi-fluid ejection head of claim 15 , wherein the second nozzle plate layer laminate has a thickness ranging from about 5 to about 30 microns.