High-performance computing cooling system
A computing cooling system includes a chassis having chassis air inlet(s) and outlet(s). Heat dissipation device(s) thermally coupled to heat producing component(s) are located in the chassis adjacent the chassis air outlet(s). A first fan device located in the chassis adjacent the chassis air inlet(s) pulls first air from outside the chassis into the first fan device via the chassis air inlet(s), and pushes the first air though the heat dissipation device(s) and out of the chassis via the chassis air outlet(s). A second fan device located in the chassis adjacent the chassis air inlet(s) pulls second air from outside the chassis into the second fan device via the chassis air inlet(s), pushes a first portion of the second air past the heat dissipation device(s) and out of the chassis via the chassis air outlet(s), and pushes a second portion of the second air into the chassis.
1. A computing cooling system, comprising:
a chassis defining a chassis housing;
at least one heat producing component that is located in the chassis housing;
at least one first heat dissipation device that is thermally coupled to the at least one heat producing component and located in the chassis housing adjacent at least one first chassis air outlet defined by the chassis, and at least one second heat dissipation device that is thermally coupled to the at least one heat producing component and located in the chassis housing opposite the at least one heat producing component from the at least one first heat dissipation device and adjacent at least one second chassis air outlet defined by the chassis;
a first fan device that is located in the chassis housing adjacent the at least one first heat dissipation device, at least one first chassis air inlet defined by the chassis, a first chassis wall on the chassis that defines a first chassis air outlet that is included in the at least one first chassis air outlet, and a second chassis wall on the chassis that defines a second chassis air outlet that is included in the at least one first chassis air outlet and that is oriented substantially perpendicularly to the first chassis wall, wherein the first fan device is configured to:
pull first air from outside of the chassis into the first fan device via the at least one first chassis air inlet;
push a first portion of the first air past the at least one first heat dissipation device and out of the chassis via the first chassis air outlet included in the at least one first chassis air outlet; and
push a second portion of the first air past the at least one first heat dissipation device and out of the chassis via the second chassis air outlet included in the at least one first chassis air outlet;
a second fan device that is located in the chassis housing opposite the at least one heat producing component from the first fan device and adjacent the at least one second heat dissipation device and at least one second chassis air inlet defined by the chassis, wherein the second fan device is configured to:
pull second air from outside of the chassis into the second fan device via the at least one second chassis air inlet; and
push the second air past the at least one second heat dissipation device and out of the chassis via the at least one second chassis air outlet; and
a third fan device that is located in the chassis housing opposite the at least one heat producing component from the first fan device and adjacent the at least one second heat dissipation device and at least one third chassis air inlet defined by the chassis, wherein the third fan device is configured to:
pull third air from the outside of the chassis into the third fan device via the at least one third chassis air inlet;
push a first portion of the third air past the at least one second heat dissipation device and out of the chassis via the at least one second chassis air outlet; and
push a second portion of the third air into the chassis housing.
2. The system of claim 1 ,
further comprising:
a gasketing system that is included in the chassis and that defines a positive pressure zone that is generated when the third fan device pushes the second portion of the third air into the chassis housing.
3. The system of claim 1 , wherein the second fan device is located adjacent the first chassis wall on the chassis that defines a first chassis air outlet that is included in the at least one second chassis air outlet, and adjacent a third chassis wall on the chassis that defines a second chassis air outlet that is included in the at least one second chassis air outlet and that is oriented substantially perpendicularly to the first chassis wall, and wherein the second fan device is configured to:
push a first portion of the second air past the at least one second heat dissipation device and out of the chassis via the first chassis air outlet included in the at least one second chassis air outlet; and
push a second portion of the second air past the at least one second heat dissipation device and out of the chassis via the second chassis air outlet included in the at least one second chassis air outlet.
4. The system of claim 3 , wherein the third fan device is located adjacent the third chassis wall on the chassis that defines a third chassis air outlet that is included in the at least one second chassis air outlet, and wherein the third fan device is configured to:
push the first portion of the third air past the at least one second heat dissipation device and out of the chassis via the third chassis air outlet.
5. The system of claim 1 , further comprising:
a fourth fan device that is located in the chassis housing opposite the at least one heat producing component from the second fan device and the third fan device, and adjacent the at least one first heat dissipation device and the at least one first chassis air inlet, wherein the fourth fan device is configured to:
pull fourth air from the outside of the chassis into the fourth fan device via at least one fourth chassis air inlet defined by the chassis; and
push the fourth air past the at least one first heat dissipation device and out of the chassis via the at least one first chassis air outlet.
6. The system of claim 5 , wherein the fourth fan device is configured to:
push a first portion of the fourth air past the at least one first heat dissipation device and out of the chassis via the at least one first chassis air outlet; and
push a second portion of the fourth air into the chassis housing.
7. An Information Handling System (IHS), comprising:
a chassis;
a processing system that is housed in the chassis;
a memory system that is housed in the chassis and coupled to the processing system;
at least one first heat dissipation device that is thermally coupled to the processing system and the memory system and located in the chassis adjacent the processing system and the memory system, and at least one second heat dissipation device that is thermally coupled to the processing system and the memory system and located in the chassis opposite the processing system and the memory system from the at least one first heat dissipation device;
a first fan device that is located in the chassis adjacent the at least one first heat dissipation device, wherein the first fan device is configured to:
pull first air from outside of the chassis into the first fan device via at least one first chassis air inlet defined by the chassis;
push a first portion of the first air past the at least one first heat dissipation device and out of the chassis via a first chassis air outlet defined on a first chassis wall on the chassis; and
push a second portion of the first air past the at least one first heat dissipation device and out of the chassis via a second chassis air outlet defined on a second chassis wall on the chassis that is oriented substantially perpendicularly to the first chassis wall;
a second fan device that is located in the chassis opposite the processing system and the memory system from the first fan device and adjacent the at least one second heat dissipation device, wherein the second fan device is configured to:
pull second air from outside of the chassis into the second fan device; and
push the second air past the at least one second heat dissipation device and out of the chassis; and
a third fan device that is located in the chassis opposite the processing system and the memory system from the first fan device and adjacent the at least one second heat dissipation device, wherein the third fan device is configured to:
pull third air from the outside of the chassis into the third fan device;
push a first portion of the third air past the at least one second heat dissipation device and out of the chassis; and
push a second portion of the third air into the chassis.
8. The IHS of claim 7 ,
further comprising:
a board that supports the processing system and the memory system, wherein the board includes a first portion that is located between the first fan device and the second fan device and that includes a first width, and a second portion that extends from the first portion, that is located adjacent the third fan device, and that includes a second width that is greater than the first width.
9. The IHS of claim 7 , wherein the second fan device is located adjacent a third chassis air outlet that is defined by the chassis, and adjacent a fourth chassis air outlet that is defined by the chassis and that is oriented substantially perpendicularly to the third chassis air outlet, and wherein the second fan device is configured to:
push a first portion of the second air past the at least one second heat dissipation device and out of the chassis via the third chassis air outlet; and
push a second portion of the second air past the at least one second heat dissipation device and out of the chassis via the fourth chassis air outlet.
10. The IHS of claim 9 , wherein the third fan device is located adjacent a fifth chassis air outlet that is defined by the chassis adjacent the fourth chassis air outlet, and wherein the third fan device is configured to:
push the first portion of the third air past the at least one second heat dissipation device and out of the chassis via the fifth chassis air outlet.
11. The IHS of claim 7 , further comprising:
a fourth fan device that is located in the chassis opposite the processing system and the memory system from the second fan device and the third fan device and adjacent the at least one first heat dissipation device, wherein the fourth fan device is configured to:
pull fourth air from the outside of the chassis into the fourth fan device; and
push the fourth air past the at least one first heat dissipation device and out of the chassis.
12. The IHS of claim 11 , wherein the fourth fan device is configured to:
push a first portion of the fourth air past the at least one first heat dissipation device and out of the chassis; and
push a second portion of the fourth air into the chassis.
13. The IHS of claim 7 , further comprising:
a gasketing system that is included in the chassis and that defines a positive pressure zone that is generated when the third fan device pushes the second portion of the third air into the chassis.
14. A method for cooling a computing device, comprising:
pulling, by a first fan device that is located in a chassis adjacent at least one first heat dissipation device that is included in the chassis and that is thermally coupled to at least one heat producing component that is included in the chassis, first air from outside the chassis into the first fan device via at least one first chassis air inlet defined by the chassis;
pushing, by the first fan device, a first portion of the first air past the at least one first heat dissipation device and out of the chassis via a first chassis air outlet defined on a first chassis wall on the chassis;
pushing, by the first fan device, a second portion of the first air past the at least one first heat dissipation device and out of the chassis via a second chassis air outlet defined on a second chassis wall on the chassis that is oriented substantially perpendicularly to the first chassis wall;
pulling, by a second fan device that is located in the chassis opposite the at least one heat producing component from the first fan device and adjacent at least one second heat dissipation device that is thermally coupled to the at least one heat producing component, second air from outside the chassis into the second fan device;
pushing, by the second fan device, the second air past the at least one second heat dissipation device and out of the chassis;
pulling, by a third fan device that is located in the chassis opposite the at least one heat producing component from the first fan device and adjacent the at least one second heat dissipation device, second air from the outside of the chassis into the second fan device;
pushing, by the third fan device, a first portion of the third air past the at least one second heat dissipation device and out of the chassis; and
pushing, by the third fan device, a second portion of the third air into the chassis.
15. The method of claim 14 ,
wherein the chassis includes board that supports the at least one heat producing component, includes a first portion that has a first width and that is located between the first fan device and the second fan device, and includes a second portion that extends from the first portion, that is located adjacent the third fan device, and that includes a second width that is greater than the first width.
16. The method of claim 14 , further comprising:
pushing, by the second fan device, a first portion of the second air past the at least one second heat dissipation device and out of the chassis via a third chassis air outlet that is defined by the chassis; and
pushing, by the second fan device, a second portion of the second air past the at least one second heat dissipation device and out of the chassis via a fourth chassis air outlet that is defined by the chassis and that is oriented substantially perpendicularly to the third chassis air outlet.
17. The method of claim 16 , further comprising:
pushing, by the third fan device, a first portion of the third air past the at least one second heat dissipation device and out of the chassis via a fifth chassis air outlet that is defined by the chassis adjacent the fourth chassis air outlet.
18. The method of claim 14 , further comprising:
pulling, by a fourth fan device that is located in the chassis opposite the at least one heat producing component from the second fan device and the third fan device and adjacent the at least one first heat dissipation device, fourth air from the outside of the chassis into the fourth fan device; and
pushing, by the fourth fan device, the fourth air past the at least one first heat dissipation device and out of the chassis.
19. The method of claim 18 , further comprising:
pushing, by the fourth fan device, a first portion of the fourth air past the at least one first heat dissipation device and out of the chassis; and
pushing, by the fourth fan device, a second portion of the fourth air into the chassis.
20. The method of claim 14 , further comprising:
generating, in response to the third fan device pushing the second portion of the third air into the chassis, a positive pressure zone in the chassis that is defined by a gasketing system.