High-performance computing cooling system
A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.
1. A computing cooling system, comprising:
a chassis defining a chassis housing;
a plurality of heat dissipation devices that are located in the chassis housing;
a chassis exhaust-only fan system that includes a pair of spaced-apart chassis exhaust-only fan devices that are each located in the chassis housing adjacent at least one of the plurality of heat dissipation devices and that are each configured to generate a chassis exhaust-only airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis exhaust-only fan device and out of the chassis;
a chassis housing fan system that includes at least one chassis housing fan device that is located in the chassis housing and that is configured to generate a chassis housing airflow that is directed into the chassis housing;
a board that is located in the chassis housing and that includes a first board section that is located between the pair of spaced-apart chassis exhaust-only fan devices in the chassis exhaust-only fan system, and a second board section that is located adjacent the at least one chassis housing fan device in the chassis housing fan system and that is configured to receive the chassis housing airflow,
wherein the first board section includes first components that are thermally coupled to at least one of the plurality of heat dissipation devices and that are configured to operate in a first temperature range, and
wherein the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.
2. The system of claim 1 , wherein the at least one chassis housing fan device in the chassis housing fan system includes a dual-outlet-opposing fan device that is located adjacent at least one of the plurality of heat dissipation devices and that is configured to generate a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis housing fan device and out of the chassis.
3. The system of claim 1 , wherein the chassis housing fan system includes a pair of spaced-apart chassis housing fan devices that are located on opposite sides of the second board section and that are each configured to generate the chassis housing airflow that is directed into the chassis housing.
4. The system of claim 3 , further comprising:
an Input/Output (I/O) connector system that is located on the first board section between the first components and a chassis wall that is included on the chassis.
5. The system of claim 4 , further comprising:
a plurality of voltage regulator devices that are included on the first board section, interleaved with the I/O connector system, and coupled to the first components.
6. The system of claim 1 , wherein the chassis housing fan system includes a pair of spaced-apart dual-outlet-opposing fan devices that are each located adjacent at least one of the plurality of heat dissipation devices and that are each configured to generate a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that dual-outlet-opposing fan device and out of the chassis, and wherein the second board section is located between the pair of spaced-apart dual-outlet-opposing fan devices.
7. An Information Handling System (IHS), comprising:
a chassis;
a plurality of heat dissipation devices that are located in the chassis;
a chassis exhaust-only fan system that includes a pair of spaced-apart chassis exhaust-only fan devices that are each located in the chassis and that are each configured to generate a chassis exhaust-only airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis exhaust-only fan device and out of the chassis;
a chassis housing fan system that includes at least one chassis housing fan device that is located in the chassis and that is configured to generate a chassis housing airflow that is directed into the chassis; and
a board that is located in the chassis and that includes a first board section that is located between the pair of spaced-apart chassis exhaust-only fan devices in the chassis exhaust-only fan system, and a second board section that is located adjacent the at least one chassis housing fan device in the chassis housing fan system and that is configured to receive the chassis housing airflow,
wherein the first board section includes a processing system and a memory system that are thermally coupled to at least one of the plurality of heat dissipation devices and that are configured to operate in a first temperature range, and
wherein the second board section includes a storage system and a networking system that are configured to operate in a second temperature range that is lower than the first temperature range.
8. The IHS of claim 7 , wherein the at least one chassis housing fan device in the chassis housing fan system includes a dual-outlet-opposing fan device that is located adjacent at least one of the plurality of heat dissipation devices and that is configured to generate a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis housing fan and out of the chassis.
9. The IHS of claim 7 , wherein the chassis housing fan system includes a pair of spaced-apart chassis housing fan devices that are located on opposite sides of the second board section and that are each configured to generate the chassis housing airflow that is directed into the chassis.
10. The IHS of claim 9 , further comprising:
an Input/Output (I/O) connector system that is located on the first board section between the first components and a chassis wall that is included on the chassis.
11. The IHS of claim 10 , further comprising:
a plurality of voltage regulator devices that are included on the first board section, interleaved with the I/O connector system, and coupled to the processing system.
12. The IHS of claim 7 , wherein the chassis housing fan system includes a pair of spaced-apart dual-outlet-opposing fan devices that are each located adjacent at least one of the plurality of heat dissipation devices and that are each configured to generate a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that dual-outlet-opposing fan device and out of the chassis, and wherein the second board section is located between the pair of spaced-apart dual-outlet-opposing fan devices.
13. The IHS of claim 7 , wherein the processing system includes a central processing subsystem and a graphics processing subsystem, and wherein the memory system includes a central processing memory subsystem and a graphics processing memory subsystem.
14. A method for cooling a computing device, comprising:
generating, by first components that are included on a first board section of a board that is located in a chassis, first heat in a first temperature range;
conducting, by a plurality of heat dissipation devices that are located in the chassis and that are thermally coupled to the first components, the first heat;
generating, by second components that are included on a second board section of the board, second heat in a second temperature range that is less than the first temperature range;
generating, by a pair of spaced-apart chassis exhaust-only fan devices that are included in a chassis exhaust-only fan system and that are each located in the chassis on opposite sides of the first board section and adjacent at least one of the plurality of heat dissipation devices, a chassis exhaust-only airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis exhaust-only fan device and out of the chassis in order to dissipate the first heat; and
generating, by a at least one chassis housing fan device that is included in a chassis housing fan system and that is located in the chassis adjacent the second board section, a chassis housing airflow that is directed into the chassis and past the second board section to dissipate the second heat.
15. The method of claim 14 , further comprising:
generating, by a dual-outlet-opposing fan device that is included in the at least one chassis housing fan device in the chassis housing fan system, a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that chassis housing fan device and out of the chassis in order to dissipate the first heat.
16. The method of claim 14 , further comprising:
generating, by a pair of spaced-apart chassis housing fan devices that are included in the chassis housing fan system and that are located on opposite sides of the second board section, the chassis housing airflow that is directed into the chassis.
17. The method of claim 16 , wherein an Input/Output (I/O) connector system is located on the first board section between the first components and a chassis wall that is included on the chassis.
18. The method of claim 17 , wherein a plurality of voltage regulator devices that are included on the first board section, interleaved with the I/O connector system, and coupled to the first components.
19. The method of claim 14 , further comprising:
generating, by a pair of spaced-apart dual-outlet-opposing fan devices that are included in the chassis housing fan system and that are each located on opposite sides of the second board section and adjacent at least one of the plurality of heat dissipation devices, a chassis exhaust airflow that is directed past the at least one of the plurality of heat dissipation devices located adjacent that dual-outlet-opposing fan device and out of the chassis.
20. The method of claim 14 , wherein the first components include a central processing subsystem, a graphics processing subsystem, a central processing memory subsystem, and a graphics processing memory subsystem.